Winbond Electronics Corporation W631GG6MB-12 TR

Overview

W631GG6MB-12 TR from Winbond Electronics is a 1G-bit DDR3 SDRAM organized as 8M × 8 banks × 16 bits, compliant with DDR3-1600 (11-11-11) timing, operating at 1.5 V supply, and rated for 0°C ≤ TCASE ≤ 95°C. It supports programmable CAS Latency (CL = 5–11), CAS Write Latency (CWL = 5–8), on-die termination (ODT), ZQ calibration, and asynchronous RESET#, targeting memory subsystems in industrial computing and embedded controllers.

For engineers reviewing the W631GG6MB-12 TR datasheet, W631GG6MB-12 TR pinout, W631GG6MB-12 TR application, or W631GG6MB-12 TR equivalent, key selection criteria include DDR3-1600 speed bin compliance, VFBGA-96 package compatibility, SSTL_15 interface signaling, CL/CWL programmability, and industrial temperature support without extended thermal grade.

Technical Context

This DDR3 SDRAM implements an 8-bit prefetch architecture with eight internal banks enabling concurrent access. Its differential clock (CK/CK#) and bi-directional DQS/DQS# strobes support source-synchronous double-data-rate transfers, while DLL alignment ensures precise DQ-DQS timing relative to CK edges.

Functional control is managed via mode registers MR0–MR3, supporting programmable features including additive latency (AL = 0, CL−1, CL−2), posted CAS, dynamic ODT (Rtt_WR), partial array self-refresh (PASR), and write leveling. The device uses asynchronous RESET# for power-up initialization and supports both auto-precharge and manual refresh commands.

Key Specifications

Pinout & Package

VFBGA-96 package with 7.5 mm × 13 mm footprint, 0.8 mm ball pitch, and RoHS-compliant lead-free construction. Ball map follows JEDEC MO-274AC standard layout.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR3 SDRAM applications.

Compared with MT41K128M16HA-125:E and IS43TR16128B-125KBL, W631GG6MB-12 TR offers standard DDR3 (1.5 V) operation with proven thermal stability up to 95°C, making it optimal for cost-sensitive industrial controllers where DDR3L migration or extended temp qualification is unnecessary.

Availability

W631GG6MB-12 TR is available at Aetrix Electronics and suitable for industrial PLCs, medical imaging systems, network edge routers, and automotive ADAS video preprocessors requiring stable component supply, long-lifecycle support, and JEDEC-compliant DDR3-1600 performance.

Supply support for W631GG6MB-12 TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and DRAM products for industrial, automotive, and communications markets.

The W631GG6MB series belongs to Winbond's industrial-grade DDR3 SDRAM product line, designed specifically for reliability-critical embedded systems requiring JEDEC-compliant timing, robust thermal performance, and long-term supply assurance.

FAQ

What is the maximum clock frequency supported by W631GG6MB-12 TR?

W631GG6MB-12 TR supports a maximum clock frequency of 800 MHz, corresponding to DDR3-1600 (11-11-11) operation. This is confirmed in the datasheet's Key Parameters table under fCKMAX = 800 MHz for the -12 speed grade. The device achieves this with tAA min = 13.75 ns and tRCD/tRP min = 13.75 ns, meeting JEDEC specification requirements for DDR3-1600 timing.

Does W631GG6MB-12 TR support write leveling and how is it implemented?

Yes, W631GG6MB-12 TR supports write leveling via its Multi Purpose Register (MPR) and dedicated write leveling mode. The MPR outputs a predefined calibration bit pattern on DQ pins, allowing the memory controller to adjust DQS-DQ phase alignment. This procedure is defined in section 8.9 of the datasheet and is essential for achieving timing closure at DDR3-1600 speeds with the W631GG6MB-12 TR's 16-bit interface.

What package type and ball count does W631GG6MB-12 TR use?

W631GG6MB-12 TR uses a VFBGA-96 package measuring 7.5 mm × 13 mm with 1.0 mm thickness and 0.8 mm ball pitch. It is RoHS-compliant and lead-free, conforming to JEDEC MO-274AC. The 96-ball layout includes dedicated VDD/VDDQ, VSS/VSSQ, address/command, data, strobe, and control terminals as detailed in the Ball Configuration and Ball Description sections of the datasheet.

Can W631GG6MB-12 TR operate outside the 0°C to 95°C temperature range?

No, W631GG6MB-12 TR is specified only for 0°C ≤ TCASE ≤ 95°C operation. The datasheet explicitly states that the -12 suffix denotes standard commercial/industrial grade with no extended temperature capability. For operation below 0°C or above 95°C, alternative variants such as W631GG6MB12I (-40°C to 95°C) or W631GG6MB12J (-40°C to 105°C) must be selected instead of W631GG6MB-12 TR.

What are the supported CAS Latency and CAS Write Latency values for W631GG6MB-12 TR?

W631GG6MB-12 TR supports CAS Latency (CL) values of 5, 6, 7, 8, 9, 10, and 11, and CAS Write Latency (CWL) values of 5, 6, 7, and 8. These are programmable via mode registers MR0 and MR2 respectively. The datasheet's Key Parameters table confirms Sup_CL = 5–11 and Sup_CWL = 5–8 for the -12 speed grade, enabling flexible timing configuration for different system clock domains and controller capabilities.