Winbond Electronics Corporation W631GG6MB-15 TR

Overview

W631GG6MB-15 TR from Winbond is a 1G-bit DDR3 SDRAM organized as 8M × 8 banks × 16 bits, supporting DDR3-1333 (9-9-9) operation at 667 MHz clock frequency with 1.5 V supply. It features eight internal banks, 8-bit prefetch architecture, programmable CAS latency (CL = 5–10), and on-die termination (ODT) for signal integrity in memory subsystems used in industrial embedded controllers and networking equipment.

For engineers reviewing the W631GG6MB-15 TR datasheet, W631GG6MB-15 TR pinout, W631GG6MB-15 TR application, or W631GG6MB-15 TR equivalent, key selection criteria include supported speed bin (DDR3-1333), operating temperature range (0°C to 95°C), VFBGA-96 package compatibility, and JEDEC-compliant power-down and self-refresh modes.

Technical Context

This DDR3 SDRAM implements source-synchronous I/O with differential DQS/DQS# strobes aligned to data edges during reads and center-aligned during writes. Its DLL aligns DQ and DQS transitions with CK/CK#, enabling stable timing at 667 MHz. The device supports posted CAS with additive latency (AL = 0, CL−1, CL−2), auto-precharge, and burst lengths of 8 or 4 via mode register or on-the-fly selection.

It integrates ZQ calibration for output driver and ODT impedance tuning using an external 240 Ω resistor, and supports dynamic ODT (Rtt_WR) with programmable termination values. Reset is asynchronous via RESET# pin, and initialization requires stable power-up sequence followed by mode register programming for CL, CWL, ODT, and PASR configuration.

Key Specifications

Pinout & Package

VFBGA-96 package with 7.5 mm × 13 mm footprint and 0.8 mm ball pitch; lead-free, RoHS-compliant construction.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR3 SDRAM applications.

Compared with MT41K128M16JT-125:K and IS43TR16128B-15HBL, the W631GG6MB-15 TR offers guaranteed 1.5 V operation and JEDEC-compliant DDR3-1333 timing at 0°C–95°C, making it suitable for legacy 1.5 V memory interfaces where voltage scaling is not feasible.

Availability

W631GG6MB-15 TR is available at Aetrix Electronics and suitable for industrial PLC controllers, network switch buffers, medical imaging front-ends, and video surveillance DVRs requiring stable component supply across extended product lifecycles.

Supply support for W631GG6MB-15 TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including NOR/NAND Flash, SRAM, and DRAM products for industrial, automotive, and communications markets.

The W631GG6MB series belongs to Winbond's industrial-grade DDR3 SDRAM product line, designed specifically for embedded systems demanding robust thermal performance, JEDEC compliance, and long-term supply assurance in harsh environments.

FAQ

What is the maximum clock frequency supported by the W631GG6MB-15 TR?

The W631GG6MB-15 TR supports a maximum clock frequency of 667 MHz, corresponding to DDR3-1333 data rate (1333 MT/s). This is defined by its -15 speed grade and validated under 0°C to 95°C case temperature with 1.5 V ± 0.075 V supply. The device does not support higher bins such as DDR3-1600 or DDR3-1866; attempting to operate beyond 667 MHz violates JEDEC timing specifications and may cause data corruption.

Does the W631GG6MB-15 TR support automatic self-refresh (ASR) mode?

Yes, the W631GG6MB-15 TR supports Auto Self-Refresh (ASR) mode via MR2 bit A6. When enabled, ASR automatically adjusts refresh rate based on die temperature-doubling frequency to 3.9 µs interval above 85°C. This feature maintains data retention integrity at elevated case temperatures up to 95°C without host intervention, and is essential for thermal management in sealed industrial enclosures where the W631GG6MB-15 TR operates.

What package type and ball count does the W631GG6MB-15 TR use?

The W631GG6MB-15 TR uses a 96-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA) package measuring 7.5 mm × 13 mm with 0.8 mm ball pitch. It is lead-free and RoHS-compliant. This package matches JEDEC MO-270AB standard and is mechanically and electrically compatible with other DDR3 SDRAMs in the same VFBGA-96 footprint, enabling layout reuse across speed grades within the W631GG6MB family.

Can the W631GG6MB-15 TR be used in systems requiring extended temperature operation beyond 95°C?

No, the W631GG6MB-15 TR is rated for 0°C ≤ T_CASE ≤ 95°C only. For operation up to 105°C, Winbond offers the W631GG6MB15J variant with industrial-plus qualification. Using the W631GG6MB-15 TR above 95°C violates its specified operating conditions, risks accelerated parameter drift, and invalidates JEDEC timing margins-particularly for tREFI, tRAS, and ODT stability-making it unsuitable for such applications.

How does write leveling function in the W631GG6MB-15 TR?

Write leveling in the W631GG6MB-15 TR allows the memory controller to calibrate DQS-to-CK skew per rank by issuing a special MRS command that places the DRAM in write-leveling mode. In this mode, the DRAM echoes back CK on DQS, enabling the controller to adjust delay taps until alignment is achieved. This process is mandatory for reliable DDR3-1333 operation and is supported natively by the W631GG6MB-15 TR per JEDEC JESD79-3F specification.