Winbond Electronics Corporation W631GG6NB15I

Overview

W631GG6NB15I from Winbond is a 1G-bit DDR3 SDRAM organized as 8M × 8 banks × 16 bits, operating at DDR3-1333 speed (9-9-9 CL-tRCD-tRP), with 1.5V VDD/VDDQ supply, industrial temperature range (–40°C to +95°C), and VFBGA-96 (7.5 × 13 mm) packaging. It supports programmable CAS Write Latency (CWL = 5–7), on-die termination (ODT), ZQ calibration, and asynchronous RESET# for embedded computing and industrial control memory subsystems.

For engineers reviewing the W631GG6NB15I datasheet, W631GG6NB15I pinout, W631GG6NB15I application, or W631GG6NB15I equivalent, key selection considerations include its DDR3-1333 timing compliance, industrial-grade thermal rating, VFBGA-96 ball mapping, ODT configuration flexibility, and support for write leveling and MPR-based system calibration.

Technical Context

This DDR3 SDRAM implements an 8-bit prefetch architecture with eight internal banks enabling concurrent access. It uses differential CK/CK# inputs synchronized at the crossing point and source-synchronous DQS/DQS# strobes aligned edge-to-read-data and center-to-write-data.

The device supports programmable additive latency (AL = 0, CL−1, CL−2), posted CAS, auto-precharge, and multiple power-down modes including precharged and active power down. It also features dynamic ODT, ZQ calibration for output driver and ODT impedance tuning, and Multi-Purpose Register (MPR) for timing calibration bitstream readout.

Key Specifications

Pinout & Package

VFBGA-96 package with 7.5 mm × 13 mm footprint, 0.8 mm ball pitch, and window-type construction optimized for high-density PCB layout and thermal dissipation in industrial memory modules.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR3 SDRAM applications.

Compared with IS43TR16128B-15KLI and MT41K128M16HA-125:E, W631GG6NB15I uniquely delivers guaranteed +95°C operation within a standard 1.5 V DDR3 interface and full JEDEC DDR3-1333 (9-9-9) timing compliance - critical for thermally constrained industrial control and medical equipment.

Availability

W631GG6NB15I is available at Aetrix Electronics and suitable for industrial PLCs, medical imaging systems, rugged network routers, and smart energy meters requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for W631GG6NB15I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and DRAM products for industrial, automotive, and communications markets.

The W631GG6NB series belongs to Winbond's industrial-grade DDR3 SDRAM product line, designed specifically for high-reliability embedded systems demanding extended temperature operation, robust signal integrity, and JEDEC-compliant timing behavior.

FAQ

What is the maximum operating frequency supported by W631GG6NB15I?

W631GG6NB15I is rated for DDR3-1333 operation, corresponding to a maximum clock frequency of 667 MHz and data transfer rate of 1333 MT/s. Its AC timing specifications are validated at CL-tRCD-tRP = 9-9-9 under industrial temperature conditions (–40°C to +95°C) and 1.5 V supply. Higher speeds require different speed grades such as W631GG6NB12I (DDR3-1600).

Does W631GG6NB15I support write leveling and how is it implemented?

Yes, W631GG6NB15I supports write leveling per JEDEC DDR3 specification. It uses the DQS strobe in conjunction with the MPR to allow the memory controller to measure and compensate for DQS-to-CK skew during initialization. The procedure involves entering write leveling mode via MR3, issuing specific patterns, and adjusting delay taps until valid DQS edges align with CK - a capability confirmed in Section 8.9 of the W631GG6NB15I datasheet.

What package type and ball count does W631GG6NB15I use?

W631GG6NB15I uses a VFBGA-96 package measuring 7.5 mm × 13 mm with 1.0 mm thickness and 0.8 mm ball pitch. It is a window-type ball grid array constructed with lead-free, RoHS-compliant materials. Ball configuration and pin functions are fully documented in Sections 5 and 6 of the official datasheet, including dedicated DQS/DQS#, DM, and RESET# terminals.

Can W631GG6NB15I operate in self-refresh mode at full temperature range?

Yes, W631GG6NB15I supports self-refresh across its full industrial temperature range (–40°C to +95°C). At temperatures above 85°C, it requires either Manual Self-Refresh with Extended Temperature Range enabled (MR2[A6]=0, MR2[A7]=1) or Auto Self-Refresh (ASR) mode (MR2[A6]=1) to double refresh frequency (tREFI = 3.9 µs), ensuring data retention integrity without external intervention.

What is the purpose of the Multi-Purpose Register (MPR) in W631GG6NB15I?

The MPR in W631GG6NB15I provides a fixed 128-bit calibration pattern readable via standard READ commands. This pattern enables system-level timing margin testing - particularly for DQ–DQS and DQS–CK relationships - without altering user data. It is essential for production validation and field diagnostics, and its behavior is defined in Section 8.10 of the W631GG6NB15I datasheet.