Winbond Electronics Corporation W631GG8KB15I

Overview

W631GG8KB15I from Winbond is a 1G-bit DDR3 SDRAM organized as 16M × 8 banks × 8 bits, supporting DDR3-1333 (9-9-9) speed grade with 667 MHz clock frequency, 1.5 V supply (VDD/VDDQ), and industrial temperature range (–40°C to +95°C). It implements on-die termination (ODT), ZQ calibration, programmable CAS Write Latency (CWL = 5–7), and asynchronous RESET# for reliable memory subsystems in embedded controllers and networking equipment.

For engineers reviewing the W631GG8KB15I datasheet, W631GG8KB15I pinout, W631GG8KB15I application, or W631GG8KB15I equivalent, key selection considerations include its industrial-grade thermal rating, 78-ball WBGA package, SSTL_15 interface compatibility, and support for auto-precharge, partial array self-refresh (PASR), and write leveling - all critical for stable DDR3 memory channel design.

Technical Context

This DDR3 SDRAM uses an 8-bit prefetch architecture with eight internal banks enabling concurrent access, and employs differential CK/CK# and DQS/DQS# signaling synchronized at the clock crossing point. Its DLL aligns DQ and DQS transitions to CK, ensuring timing closure across process/voltage/temperature variations.

It supports programmable mode registers (MR0–MR3) for CAS Latency (CL = 6, 8, 9, 10), CWL, additive latency (AL = 0, CL−1, CL−2), ODT RTT values (60 Ω, 120 Ω, 40 Ω), and dynamic ODT (Rtt_WR) during writes. The device also implements ZQ calibration using an external 240 Ω resistor and supports multi-purpose register (MPR) readout for system-level timing calibration.

Key Specifications

Pinout & Package

Packaged in a lead-free, RoHS-compliant 78-ball WBGA (8 mm × 10.5 mm, 0.8 mm pitch), with ball grid layout optimized for DDR3 routing density and signal integrity.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR3 SDRAM applications.

Compared with MT41K128M8RH-125:E and IS43TR16128B-125KBL, W631GG8KB15I uniquely combines industrial temperature support, asynchronous RESET#, ZQ calibration, and PASR/ASR - making it the only option among the three qualified for unattended operation in harsh thermal environments with autonomous refresh management.

Availability

W631GG8KB15I is available at Aetrix Electronics and suitable for industrial automation, network infrastructure, and medical imaging systems requiring stable component supply, long-term lifecycle assurance, and guaranteed extended-temperature performance.

Supply support for W631GG8KB15I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and DDR SDRAM for industrial, automotive, and communications markets.

W631GG8KB15I belongs to Winbond's DDR3 SDRAM product line, designed specifically for cost-sensitive, thermally demanding embedded systems requiring JEDEC-compliant DDR3 functionality with industrial-grade reliability and integrated calibration features.

FAQ

What is the maximum clock frequency supported by W631GG8KB15I?

W631GG8KB15I supports a maximum clock frequency of 667 MHz (DDR3-1333), corresponding to a data transfer rate of 1333 MT/s per pin. This is validated under industrial temperature conditions (–40°C to +95°C) with tAA/tRCD/tRP = 9-9-9 timing and VDD/VDDQ = 1.5 V ± 0.075 V. The device does not support higher speed bins such as DDR3-1600 or DDR3-1866.

Does W631GG8KB15I support on-die termination (ODT) and how is it configured?

Yes, W631GG8KB15I supports programmable on-die termination (ODT) on DQ, DQS, DQS#, and DM pins. ODT is enabled via the ODT pin and configured through Mode Register MR1, offering RTT_NOM values of 60 Ω, 120 Ω, or 40 Ω. It also supports dynamic ODT (Rtt_WR) during write operations, which is set via MR2 and improves signal integrity without affecting read paths.

What is the purpose of the ZQ pin on W631GG8KB15I and what external component is required?

The ZQ pin on W631GG8KB15I connects to an external 240 Ω ±1 % resistor to ground, enabling factory-trimmed calibration of output driver impedance and ODT resistance across voltage and temperature. This calibration occurs automatically after power-up and can be re-triggered via ZQCL command, ensuring consistent signal integrity without manual board-level tuning.

How does W631GG8KB15I handle refresh in extended temperature ranges above 85°C?

W631GG8KB15I supports Auto Self-Refresh (ASR) above 85°C via MR2 bit A6. When enabled, the internal temperature sensor triggers automatic entry into Self-Refresh mode with doubled refresh rate (tREFI = 3.9 µS), maintaining data retention up to +95°C without host intervention. This eliminates the need for external thermal monitoring or firmware-driven refresh adjustments.

Is W631GG8KB15I pin-compatible with other Winbond DDR3 SDRAMs in the same family?

W631GG8KB15I shares the same 78-ball WBGA package and pinout as other members of the W631GG8KB family (e.g., W631GG8KB-11, W631GG8KB12I), including identical ball assignments for CK/CK#, DQS/DQS#, RESET#, ZQ, and ODT. However, speed bin and temperature grade differences mean timing parameters and AC specifications are not interchangeable without controller reconfiguration.