Winbond Electronics Corporation W631GG8MB-15

Overview

W631GG8MB-15 from Winbond Electronics is a 1 Gb (128 MB) DDR3 SDRAM organized as 16M × 8 banks × 8 bits, compliant with JEDEC DDR3-1333 (9-9-9) timing, operating at 667 MHz clock frequency with 1.5 V VDD/VDDQ supply, and designed for embedded computing, industrial control, and networking equipment requiring reliable high-bandwidth memory buffering.

For engineers reviewing the W631GG8MB-15 datasheet, W631GG8MB-15 pinout, W631GG8MB-15 application, or W631GG8MB-15 equivalent, key selection considerations include its -15 speed grade (DDR3-1333), industrial-grade temperature range (0°C to 95°C), VFBGA-78 package, SSTL_15 interface compatibility, and support for ZQ calibration, dynamic ODT, and write leveling.

Technical Context

This DDR3 SDRAM implements an 8-bit prefetch architecture with eight internal banks enabling concurrent access, uses differential CK/CK# and DQS/DQS# signaling for source-synchronous data transfer, and supports programmable CAS Latency (CL = 5–10) and CAS Write Latency (CWL = 5–7) optimized for DDR3-1333 operation.

It features asynchronous RESET# for power-up initialization, on-die termination (ODT) with selectable RTT values (60 Ω, 120 Ω, 40 Ω), dynamic ODT during writes, and multi-purpose register (MPR) support for system-level timing calibration-enabling robust signal integrity in high-speed memory subsystems.

Key Specifications

Pinout & Package

VFBGA-78 package with 8×10.5 mm² footprint, 1.0 mm thickness, and 0.8 mm ball pitch. Balls arranged in 9 rows (A–J, excluding row H) and 9 columns (1–9), with corner balls A1 and J9 omitted.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR3 SDRAM applications.

Compared with MT41K128M8RH-125:E and IS43TR16128B-15KBL, the W631GG8MB-15 offers guaranteed 1.5 V operation, exact CL9-9-9 timing at 667 MHz, and VFBGA-78 compatibility - making it optimal for cost-sensitive industrial designs where voltage stability and layout reuse are prioritized over bandwidth scaling.

Availability

W631GG8MB-15 is available at Aetrix Electronics and suitable for industrial automation, network infrastructure, and medical electronics requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant sourcing.

Supply support for W631GG8MB-15 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and DRAM products for industrial, automotive, and communications markets.

The W631GG8MB series belongs to Winbond's industrial-grade DDR3 SDRAM product line, engineered for reliability in extended temperature environments and designed to meet JEDEC standards while supporting advanced features like ZQ calibration and dynamic ODT.

FAQ

What is the maximum data rate supported by the W631GG8MB-15?

The W631GG8MB-15 supports a maximum data rate of 1333 MT/s (megatransfers per second), corresponding to a 667 MHz clock frequency and DDR3-1333 timing specification (CL-tRCD-tRP = 9-9-9). This is confirmed in the device's order information table and electrical characteristics section, where the -15 speed grade is explicitly rated for DDR3-1333 operation under 0°C to 95°C case temperature conditions.

Does the W631GG8MB-15 support write leveling?

Yes, the W631GG8MB-15 supports write leveling as a mandatory feature per JEDEC DDR3 specification. It uses the DQS strobe and internal DLL to enable controller-driven skew calibration between DQS and CK during initialization, ensuring timing alignment for reliable writes at 1333 MT/s. This capability is documented in Sections 8.9 and 10.16 of the datasheet.

What package type and ball count does the W631GG8MB-15 use?

The W631GG8MB-15 uses a VFBGA-78 package measuring 8 mm × 10.5 mm with 1.0 mm thickness and 0.8 mm ball pitch. It contains 78 solder balls arranged in a 9×9 grid (rows A–J excluding H, columns 1–9), conforming to JEDEC MO-270AB standard. This is specified in Section 11 (Package Specification) and Section 5 (Ball Configuration) of the datasheet.

Can the W631GG8MB-15 operate at temperatures above 85°C?

Yes, the W631GG8MB-15 is rated for operation up to 95°C case temperature (TCASE), as stated in the Order Information table for the -15 speed grade. At 85°C < TCASE ≤ 95°C, the device requires doubling the auto-refresh frequency (tREFI = 3.9 µs) and supports either Manual Self-Refresh with Extended Temperature Range mode (MR2[A6:A7] = 0b1) or Auto Self-Refresh (ASR) mode (MR2[A6] = 1b).

What termination options are available on the W631GG8MB-15?

The W631GG8MB-15 provides programmable on-die termination (ODT) with static RTT values of 60 Ω, 120 Ω, and 40 Ω (via MR1), plus dynamic ODT (Rtt_WR) during writes using the same impedance options. Termination applies to DQ, DQS/DQS#, and DM signals. These settings are configured through mode registers and validated in Section 8.3.2.3 and Table 10.9.2 of the datasheet.