Winbond Electronics Corporation W631GG8MB15I TR

Overview

W631GG8MB15I TR from Winbond Electronics is a 1G-bit DDR3 SDRAM organized as 16M × 8 banks × 8 bits, operating at DDR3-1333 speed (9-9-9 CL-tRCD-tRP), with 1.5V VDD/VDDQ supply, industrial temperature range (−40°C to +95°C), and VFBGA78 (8 mm × 10.5 mm) packaging. It serves as main system memory in embedded controllers, network edge devices, and industrial HMIs requiring reliable high-density DRAM with programmable ODT and ZQ calibration.

For engineers reviewing the W631GG8MB15I TR datasheet, W631GG8MB15I TR pinout, W631GG8MB15I TR application, or W631GG8MB15I TR equivalent, key selection considerations include its DDR3-1333 timing compliance, −40°C to +95°C industrial qualification, VFBGA78 ball map, on-die termination (RTT_NOM/RTT_WR), and support for write leveling and MPR-based timing calibration.

Technical Context

This DDR3 SDRAM implements an 8-bit prefetch architecture with eight internal banks, differential CK/CK# clocking, and bi-directional DQS/DQS# strobes aligned to data edges. It supports programmable CAS Latency (CL = 5–10), CAS Write Latency (CWL = 5–7), additive latency (AL = 0, CL−1, CL−2), and posted CAS for command bus efficiency.

Functional features include asynchronous RESET#, ZQ calibration using external 240 Ω resistor, dynamic ODT (Rtt_WR), partial array self-refresh (PASR), auto self-refresh (ASR), and multi-purpose register (MPR) for system-level timing calibration. All control/address inputs are sampled at the CK rising / CK# falling crosspoint.

Key Specifications

Pinout & Package

VFBGA78 package (8 mm × 10.5 mm, 1.0 mm thickness) with 78 solder balls arranged in 9×9 staggered grid (center ball omitted). Ball pitch is 0.8 mm. Compatible with standard DDR3 PCB layout rules including controlled impedance routing and symmetric DQS/DQ fanout.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR3 SDRAM applications.

Compared with MT41K128M8RH-125:E and IS43TR16128B-125KBL, the W631GG8MB15I TR provides guaranteed industrial temperature operation at standard 1.5 V, exact pin compatibility with other Winbond DDR3-1333 VFBGA78 parts, and tighter tAA specification (13.5 ns min) for deterministic low-latency access.

Availability

W631GG8MB15I TR is available at Aetrix Electronics and suitable for industrial HMIs, network edge routers, medical imaging controllers, and automated test equipment requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for W631GG8MB15I TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, PSRAM, and DDR SDRAM for industrial, automotive, and networking markets.

The W631GG8MB series targets cost-sensitive, thermally demanding embedded systems requiring JEDEC-compliant DDR3 performance with industrial-grade reliability and simplified qualification paths.

FAQ

What is the maximum clock frequency supported by the W631GG8MB15I TR?

The W631GG8MB15I TR supports a maximum clock frequency of 667 MHz, enabling DDR3-1333 operation at 1333 MT/s. This is confirmed by its speed grade suffix "15I", JEDEC DDR3-1333 (9-9-9) timing bin, and fCKMAX = 667 MHz in the AC characteristics table. The device maintains full timing compliance across its industrial temperature range (−40°C to +95°C) at this rate.

Does the W631GG8MB15I TR support write leveling and how is it implemented?

Yes, the W631GG8MB15I TR supports write leveling per JEDEC DDR3 specification. It uses the DQS/DQS# strobe pair and internal DLL to allow the memory controller to adjust DQS-to-CK skew during initialization. The W631GG8MB15I TR enters write leveling mode via MR1 bit A11, and the MPR outputs a fixed pattern for margin verification. This capability is explicitly documented in Sections 8.9 and 8.10 of the datasheet.

What package type and ball count does the W631GG8MB15I TR use?

The W631GG8MB15I TR uses a VFBGA78 package: 78-ball very thin fine-pitch ball grid array measuring 8 mm × 10.5 mm with 0.8 mm ball pitch and 1.0 mm maximum height. This is specified in Section 2 (Features) and Section 11 (Package Specification) of the datasheet, and matches the ball configuration shown in Figure 5 and Table 5.

Can the W631GG8MB15I TR operate at temperatures above +85°C?

Yes, the W631GG8MB15I TR is rated for operation from −40°C to +95°C case temperature. At temperatures above +85°C, the device requires either Auto Self-Refresh (ASR) mode (MR2 A6 = 1b) or Manual Self-Refresh with Extended Temperature Range (MR2 A6 = 0b, A7 = 1b) to maintain refresh compliance, as specified in Note 4 of Section 4 (Key Parameters).

What termination options does the W631GG8MB15I TR provide for signal integrity?

The W631GG8MB15I TR provides programmable on-die termination (ODT) with RTT_NOM (nominal) and RTT_WR (dynamic write-time) settings, configurable via MR1 and MR2. It supports synchronous, dynamic, and asynchronous ODT modes, and includes ZQ calibration using an external 240 Ω reference resistor to maintain impedance accuracy across voltage and temperature variations.