Winbond Electronics Corporation W631GU6KB-15

Overview

W631GU6KB-15 from Winbond Electronics is a 1 Gbit DDR3L SDRAM organized as 8M × 8 banks × 16-bit, operating at 1.35 V nominal supply with DDR3L-1333 (9-9-9) timing, supporting CAS Latency 6/7/8/9/10 and programmable CWL 5–7 for use in embedded computing, industrial HMIs, and low-power networking equipment.

For engineers reviewing the W631GU6KB-15 datasheet, W631GU6KB-15 pinout, W631GU6KB-15 application, or W631GU6KB-15 equivalent, key selection considerations include its -15 speed grade compliance with JEDEC DDR3L-1333, 9×13 mm² WBGA-96 package, support for ZQ calibration and dynamic ODT, and compatibility with both 1.35 V DDR3L and legacy 1.5 V DDR3 systems.

Technical Context

This DDR3L SDRAM implements an 8-bit prefetch architecture with eight internal banks enabling concurrent memory access. It uses differential CK/CK# inputs synchronized at the clock crosspoint and source-synchronous DQS/DQS# strobes aligned to read data edges and write data centers.

The device supports asynchronous RESET#, programmable mode registers (MR0–MR3), multi-purpose register (MPR) for timing calibration, write leveling, and on-die termination (ODT) with synchronous, dynamic, and asynchronous modes. Its DLL aligns DQ and DQS transitions to CK, and ZQ calibration adjusts output driver and ODT impedance using an external 240 Ω resistor.

Key Specifications

Pinout & Package

W631GU6KB-15 is packaged in a 96-ball Wafer-Level Ball Grid Array (WBGA) measuring 9 mm × 13 mm with 0.8 mm ball pitch. The package uses lead-free, RoHS-compliant materials and supports standard reflow profiles.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR3L SDRAM applications.

Compared with MT41K128M16JT-125:K and IS43TR16128B-15HBL, W631GU6KB-15 offers guaranteed 95°C operation with minimal layout impact (same WBGA-96 footprint), full ZQ calibration control, and native support for PASR-making it optimal for thermally constrained industrial designs where drop-in replacement and long-term supply stability are critical.

Availability

W631GU6KB-15 is available at Aetrix Electronics and suitable for industrial HMIs, embedded networking routers, and medical imaging terminals requiring stable component supply, extended temperature support, and JEDEC-compliant DDR3L interoperability.

Supply support for W631GU6KB-15 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and DRAM products for industrial, automotive, and consumer markets.

The W631GU6KB-15 belongs to Winbond's DDR3L SDRAM product line, designed specifically for cost-sensitive, thermally demanding embedded applications where low-voltage operation, long-term supply assurance, and JEDEC compliance are mandatory.

FAQ

What is the maximum operating frequency of the W631GU6KB-15?

The W631GU6KB-15 is rated for DDR3L-1333 operation with a maximum clock frequency (f_CKMAX) of 667 MHz. This corresponds to a data transfer rate of 1333 MT/s per pin. The device achieves this performance while maintaining full JEDEC AC and DC specifications across its specified 0°C to 95°C case temperature range, as confirmed in the official datasheet revision A10.

Does the W631GU6KB-15 support both 1.35 V and 1.5 V operation?

Yes, the W631GU6KB-15 supports dual-voltage operation: it is fully compliant with DDR3L specifications at 1.35 V (VDD/VDDQ = 1.283 V to 1.45 V) and maintains backward compatibility with standard 1.5 V DDR3 systems (VDD/VDDQ = 1.5 V ± 0.075 V). This allows seamless integration into legacy designs without hardware modification, as documented in Section 11 of the W631GU6KB datasheet.

What package type and dimensions does the W631GU6KB-15 use?

The W631GU6KB-15 uses a 96-ball Wafer-Level Ball Grid Array (WBGA) package measuring 9 mm × 13 mm with 0.8 mm ball pitch. It is lead-free and RoHS-compliant, and its ball configuration matches JEDEC MO-270AB standard. Pin assignments-including CK/CK#, DQS/DQS#, ZQ, RESET#, and ODT-are defined in Sections 5 and 6 of the datasheet.

How does the W631GU6KB-15 handle thermal management at elevated temperatures?

The W631GU6KB-15 is qualified for operation up to 95°C case temperature (T_CASE) with full AC/DC specification compliance. At temperatures above 85°C, it doubles auto-refresh frequency (tREFI = 3.9 µs) and supports Auto Self-Refresh (ASR) or Manual Self-Refresh with Extended Temperature Range mode (MR2[7:6] = 10b), ensuring data retention without host intervention-critical for fanless industrial deployments.

What calibration features are built into the W631GU6KB-15 for signal integrity?

The W631GU6KB-15 integrates ZQ calibration for output driver and ODT impedance tuning using an external 240 Ω resistor, plus write leveling for per-byte DQS-to-CK skew compensation. It also includes a Multi-Purpose Register (MPR) that outputs a fixed calibration pattern for system-level timing margin validation-all confirmed in Sections 8.18, 8.9, and 8.10 of the datasheet.