Winbond Electronics Corporation W631GU6KB15I

Overview

W631GU6KB15I from Winbond Electronics is a 1G-bit DDR3L SDRAM organized as 8M × 8 banks × 16-bit, operating at DDR3L-1333 speed (9-9-9 CL-tRCD-tRP), with 1.35V nominal VDD/VDDQ supply, industrial temperature range (–40°C to +95°C), and WBGA-96 package. It serves as main memory in embedded controllers, networking processors, and industrial HMIs requiring low-voltage, high-density synchronous DRAM.

For engineers reviewing the W631GU6KB15I datasheet, W631GU6KB15I pinout, W631GU6KB15I application, or W631GU6KB15I equivalent, key selection criteria include DDR3L-1333 timing compliance, industrial-grade thermal operation, on-die termination (ODT) configurability, ZQ calibration support, and compatibility with JEDEC-standard DDR3L controllers.

Technical Context

This device implements an 8-bank, 8-bit prefetch architecture synchronized to differential CK/CK# inputs, with DLL-aligned DQS/DQS# strobes for source-synchronous read/write data transfer. It supports programmable CAS Latency (CL = 6, 7, 8, 9, 10), CAS Write Latency (CWL = 5–7), additive latency (AL = 0, CL−1, CL−2), and burst lengths of 8 (BL8) or 4 (BC4).

Functional features include asynchronous RESET#, multi-purpose register (MPR) for timing calibration bitstream readout, write leveling for DQ-DQS skew compensation, dynamic ODT (Rtt_WR), and partial array self-refresh (PASR). Power management includes precharged and active power-down modes, auto self-refresh (ASR), and temperature-compensated refresh intervals.

Key Specifications

Pinout & Package

W631GU6KB15I uses a 96-ball Wafer-Level Ball Grid Array (WBGA) package measuring 9 mm × 13 mm with 0.8 mm ball pitch. Ball assignment follows JEDEC-standard DDR3L layout with dedicated VDD, VDDQ, VSS, VSSQ, VREFCA, and VREFDQ reference pins, plus differential clock (CK/CK#), strobe (DQS/DQS#), address/command (A0–A12, BA0–BA2, CS#, RAS#, CAS#, WE#), data (DQ0–DQ15), mask (DMU/DML), control (ODT, CKE, RESET#), and configuration (ZQ, A10/AP, A12/BC#) terminals.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR3L SDRAM applications.

Compared with MT41K128M16JT-125:K and IS43TR16128B-125KBL, W631GU6KB15I provides verified industrial-temperature operation at DDR3L-1333 with integrated PASR and MPR-enabling lower power in thermally constrained embedded systems and more robust timing margin validation than alternatives lacking those features.

Availability

W631GU6KB15I is available at Aetrix Electronics and suitable for industrial HMIs, networking processors, embedded vision systems, and medical imaging controls requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for W631GU6KB15I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including NOR/NAND Flash, SRAM, and DRAM products for industrial, automotive, and communications markets.

The W631GU6KB series belongs to Winbond's DDR3L SDRAM product line, designed specifically for cost-sensitive, thermally demanding embedded applications requiring JEDEC-compliant low-voltage memory with enhanced reliability features like PASR and write leveling.

FAQ

What is the maximum operating frequency supported by W631GU6KB15I?

W631GU6KB15I supports a maximum clock frequency of 667 MHz, corresponding to DDR3L-1333 data rates (1333 Mb/sec/pin). This is validated under industrial temperature conditions (–40°C to +95°C) with tCK(AVG) ≤ 1.5 ns for CL=9 and CWL=7 configurations, per the device's -15I speed grade specification.

Does W631GU6KB15I support backward compatibility with standard 1.5V DDR3 systems?

Yes, W631GU6KB15I supports backward compatibility with 1.5V DDR3 systems. Its VDD/VDDQ supply range extends to 1.5V ± 0.075 V, and it maintains full functional and timing compliance with JEDEC DDR3 standards when operated at 1.5V, enabling drop-in replacement in legacy 1.5V designs without hardware modification.

How does the ZQ calibration function work on W631GU6KB15I?

W631GU6KB15I performs ZQ calibration by referencing an external 240 Ω ±1 % resistor connected between the ZQ pin and ground. During ZQCAL commands, the device adjusts its output driver strength and ODT termination impedances to match this reference, ensuring consistent signal integrity across voltage and temperature variations. Calibration must be performed at power-up and after significant VDD/VDDQ or temperature shifts.

What is the purpose of the Multi-Purpose Register (MPR) in W631GU6KB15I?

The Multi-Purpose Register (MPR) in W631GU6KB15I stores a fixed 128-bit calibration pattern used for system-level timing margin analysis. When activated via mode register setting, the MPR outputs this pattern on DQ pins during reads, allowing test equipment to measure DQ-DQS eye width and validate write leveling convergence-critical for high-speed DDR3L layout validation.

Can W631GU6KB15I operate in Partial Array Self-Refresh (PASR) mode?

Yes, W631GU6KB15I supports Partial Array Self-Refresh (PASR) mode, configurable via MR2 bits A2–A0. PASR allows selective refresh of only active memory banks, reducing self-refresh current (IDD6) by up to 40 % compared to full-array refresh. This feature is especially valuable in battery-powered or thermally constrained embedded applications where power efficiency is critical.