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Winbond Electronics Corporation W631GU6KB15I TR
- Part No.:
- W631GU6KB15I TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 96-TFBGA
- Datasheet:
-
W631GU6KB15I TR.pdf
- Description:
- IC DRAM 1GBIT PAR 96WBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,870
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Product details
Overview
W631GU6KB15I TR from Winbond is a 1G-bit DDR3L SDRAM organized as 8M × 8 banks × 16 bits, operating at 1.35 V nominal supply with industrial temperature range (–40°C to +95°C), supporting DDR3L-1333 speed grade (9-9-9 CL-tRCD-tRP), and delivering 1333 Mb/sec/pin data rates for memory subsystems in embedded controllers and networking equipment.
For engineers reviewing the W631GU6KB15I TR datasheet, W631GU6KB15I TR pinout, W631GU6KB15I TR application, or W631GU6KB15I TR equivalent, key selection criteria include its industrial-grade thermal rating, backward compatibility with 1.5 V DDR3, programmable CAS Write Latency (CWL = 5–7), on-die termination (ODT) support, and ZQ calibration capability for signal integrity in high-density PCB layouts.
Technical Context
This DDR3L SDRAM implements an 8-bit prefetch architecture with eight internal banks enabling concurrent access, DLL-aligned DQ/DQS timing, and source-synchronous differential strobe (DQS/DQS#) I/O synchronized to CK/CK#. It supports posted CAS with additive latency (AL = 0, CL−1, CL−2) and programmable burst lengths (BL8/BC4).
Functional operation includes asynchronous RESET# for power-up initialization, multi-purpose register (MPR) for system-level timing calibration, write leveling for DQ-to-DQS skew compensation, and dynamic ODT (Rtt_WR) with selectable termination impedances during write cycles - all compliant with JEDEC DDR3L standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 G-bit (8M words × 8 banks × 16 bits) |
| Supply Voltage | 1.35 V nominal (1.283–1.45 V), backward-compatible with 1.5 V DDR3 |
| Data Rate | 1333 Mb/sec/pin (DDR3L-1333, tCK = 1.5 ns min) |
| CAS Latency | CL = 6, 8, 9, 10 (supported per speed bin; CL = 9 at DDR3L-1333) |
| CAS Write Latency | CWL = 5, 6, 7 (CWL = 5 at DDR3L-1333) |
| Operating Temperature | –40°C ≤ TCASE ≤ +95°C (industrial grade) |
| Refresh Interval | tREFI = 7.8 µs (0–85°C), 3.9 µs (85–95°C) with ASR/PASR support |
| Package | WBGA-96 (9 mm × 13 mm, RoHS-compliant, lead-free) |
Pinout & Package
W631GU6KB15I TR uses a 96-ball WBGA package (9 mm × 13 mm, 0.8 mm ball pitch) with defined ball mapping per JEDEC-standard DDR3L layout. Power, ground, and reference pins are distributed to minimize noise and ensure stable termination calibration.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input | Latches all command/address inputs at cross-point; defines timing reference for all operations |
| DQS / DQS# | Differential data strobe | Source-synchronous edge-aligned read / center-aligned write strobe; enables precise DQ capture |
| RESET# | Asynchronous reset input | Initiates power-up sequence and resets internal state machines without clock dependency |
| ZQ | Calibration reference terminal | Connects to external 240 Ω ±1 % resistor to ground for output driver and ODT impedance tuning |
| VREFCA / VREFDQ | Reference voltage inputs | Provide mid-supply reference for command/address and data input receivers (1.0 V typical) |
| ODT | On-die termination control | Enables/disables programmable termination resistors (Rtt_Nom = 60/120/40 Ω) on DQ/DQS/DM lines |
Key Features
| Feature | Design Value |
|---|---|
| Programmable CWL | Supports CWL = 5–7 to match tCK and system timing margins across DDR3L-1333/1600/1866 bins |
| ZQ Calibration | Performs one-time or periodic output driver and ODT impedance adjustment using external 240 Ω resistor |
| Dynamic ODT (Rtt_WR) | Activates configurable termination during write bursts only, improving signal integrity without affecting read paths |
| Write Leveling | Enables controller-driven DQ-to-DQS delay calibration to compensate for board trace skew in high-speed layouts |
| Multi-Purpose Register (MPR) | Outputs predefined bit pattern for system-level timing margin verification and MPR-based read training |
| Auto Self-Refresh (ASR) | Automatically doubles refresh rate at elevated temperatures (≥85°C), eliminating host intervention for thermal management |
Applications
| Industrial PLC Memory Buffer | Network Switch Packet Buffer |
|---|---|
Use Scenario: Real-time deterministic control logic execution with persistent data buffering in programmable logic controllers under extended thermal cycling. IC Role / Device Role / Timing Role: Primary working memory for firmware execution and I/O data staging, interfacing directly with ARM Cortex-M7 or RISC-V SoCs via 16-bit DDR3L bus. Use Value: Industrial temperature rating (–40°C to +95°C) and ASR support ensure uninterrupted operation during ambient thermal excursions without host refresh management overhead. | Use Scenario: High-throughput packet buffering in Layer 2/3 Ethernet switches handling 10/25/40 GbE line rates with low-latency forwarding decisions. IC Role / Device Role / Timing Role: Shared packet buffer memory accessed concurrently by multiple traffic manager engines and MAC interfaces over DDR3L-1333 interface. Use Value: 1333 Mb/sec/pin bandwidth and bank-interleaved access (IDD7 = 380 mA) sustain >10 Gbps aggregate throughput while maintaining <15 ns tRCD/tRP timing. |
| Medical Imaging Data Cache | Automotive ADAS Vision Preprocessor |
Use Scenario: Temporary storage of raw sensor frames (e.g., ultrasound, X-ray detectors) prior to GPU-accelerated reconstruction in portable diagnostic devices. IC Role / Device Role / Timing Role: Burst-capable frame cache with BL8 reads/writes, supporting 16-bit parallel transfers synchronized to imaging pipeline clocks. Use Value: Low-voltage 1.35 V operation reduces power density in thermally constrained enclosures, while PASR enables selective self-refresh of inactive image regions to cut IDD6 to 14 mA. | Use Scenario: Real-time preprocessing of camera and radar point clouds in automotive domain controllers requiring functional safety-aware memory subsystems. IC Role / Device Role / Timing Role: Safety-critical data buffer for vision algorithms, leveraging RESET# for fail-safe reinitialization and ODT for EMI-controlled signal integrity. Use Value: Asynchronous RESET# ensures deterministic recovery after power transients, and industrial temp grade meets AEC-Q100 Grade 3 requirements for under-hood environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR3L SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT41K128M16JT-125:K | 1 G-bit DDR3L, 96-ball FBGA, CL = 9 at 1333 MT/s, but rated only to +90°C (not +95°C) | Lacks extended industrial upper limit; requires derating above 90°C ambient | Select when full +95°C operation is not required and Micron's qualification ecosystem is preferred |
| IS43TR16128B-125KBL | 1 G-bit DDR3L, 96-ball WBGA, CL = 9 at 1333 MT/s, –40°C to +95°C, but no ASR support | No auto self-refresh; host must manage doubled refresh rate manually above 85°C | Select when thermal profile stays below 85°C or host firmware can implement custom refresh scheduling |
Compared with MT41K128M16JT-125:K and IS43TR16128B-125KBL, W631GU6KB15I TR uniquely combines guaranteed +95°C operation, ASR, and PASR in a single industrial-grade DDR3L device - reducing thermal management complexity and eliminating need for host-level refresh adaptation.
Availability
W631GU6KB15I TR is available at Aetrix Electronics and suitable for industrial automation, network infrastructure, and medical electronics requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.
Supply support for W631GU6KB15I TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including NOR/NAND Flash, SRAM, and DRAM products for industrial, automotive, and communications markets.
W631GU6KB15I TR belongs to Winbond's DDR3L SDRAM product line, designed specifically for cost-sensitive, thermally demanding embedded systems requiring JEDEC-compliant low-voltage memory with extended temperature reliability and advanced power management features.
FAQ
What is the maximum operating frequency supported by W631GU6KB15I TR?
W631GU6KB15I TR supports DDR3L-1333 operation with a maximum clock frequency of 667 MHz (1333 MT/s data rate). Its tCK(AVG) minimum is 1.5 ns, and it achieves CL = 9, tRCD = 9 ns, tRP = 9 ns timing at this speed grade. The part is not rated for DDR3L-1600 or DDR3L-1866 operation - those require -12/12I/12J or -11/11I speed grades respectively.
Does W631GU6KB15I TR support both 1.35 V and 1.5 V operation?
Yes, W631GU6KB15I TR is fully backward-compatible with standard 1.5 V DDR3 systems. It operates at 1.35 V nominal (1.283–1.45 V) for DDR3L mode and accepts 1.5 V ±0.075 V for legacy DDR3 compatibility. VDDQ/VDD switching between modes is supported per JEDEC specification, and both voltage domains must be supplied simultaneously during transition.
How does the ZQ calibration function work on W631GU6KB15I TR?
W631GU6KB15I TR uses its ZQ pin to connect to a 240 Ω ±1 % external resistor to ground. Upon receiving a ZQCL (ZQ Calibration Long) command, the device measures this reference and adjusts internal output driver strength and ODT resistance values to maintain tight impedance matching across voltage and temperature. Calibration is required after power-up and periodically during operation to ensure signal integrity.
What is the purpose of the RESET# pin on W631GU6KB15I TR?
The RESET# pin on W631GU6KB15I TR provides asynchronous, level-sensitive reset initiation independent of clock signals. It triggers the power-up initialization sequence, clears internal registers, and forces entry into a known state - essential for deterministic boot behavior in safety-critical or field-upgradable systems where clock stability cannot be assumed at power-on.
Can W631GU6KB15I TR operate in Partial Array Self-Refresh (PASR) mode?
Yes, W631GU6KB15I TR supports PASR via MR2 programming (A2–A0 bits), allowing selective self-refresh of ¼, ½, or full memory array. This feature reduces IDD6 current during idle periods - critical for battery-backed or energy-constrained applications - while preserving data integrity in active regions. PASR is fully compatible with ASR and standard self-refresh modes.
W631GU6KB15I TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 96-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - DDR3L
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 667 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 20 ns
- Voltage - Supply:
- 1.283V ~ 1.45V
- Operating Temperature:
- -40°C ~ 95°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 96-WBGA (9x13)
W631GU6KB15I TR FAQ
1.How can I place an order for W631GU6KB15I TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W631GU6KB15I TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W631GU6KB15I TR reliable?
The price and inventory of W631GU6KB15I TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W631GU6KB15I TR is usually 5 days.
3.What payment methods are accepted for W631GU6KB15I TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W631GU6KB15I TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W631GU6KB15I TR?
W631GU6KB15I TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W631GU6KB15I TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W631GU6KB15I TR?
For technical support, including W631GU6KB15I TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W631GU6KB15I TR requirements.
6.How does Aetrix verify that W631GU6KB15I TR is sourced from the original manufacturer or authorized distributors?
All W631GU6KB15I TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W631GU6KB15I TR meets industry standards.
7.What is the process for return or replacement of W631GU6KB15I TR?
All W631GU6KB15I TR units undergo pre-shipment inspection (PSI). If there is an issue with W631GU6KB15I TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W631GU6KB15I TR part is unused and in its original packaging.
Return procedure for W631GU6KB15I TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W631GU6KB15I TR Tags
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M24C02-WMN6TP
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