My Inquiry
My Account
Winbond Electronics Corporation W631GU6KS-15
- Part No.:
- W631GU6KS-15
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 96-VFBGA
- Datasheet:
-
W631GU6KS-15.pdf
- Description:
- IC DRAM 1GBIT PAR 96VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,939
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
W631GU6KS-15 from Winbond Electronics is a 1 Gbit DDR3L SDRAM organized as 8M × 8 banks × 16 bits, operating at 1.35 V nominal supply with DDR3L-1333 speed grade (9-9-9 CL-tRCD-tRP), supporting CAS Latency 6/7/8/9/10 and programmable CWL 5–7. It delivers up to 1333 Mb/sec/pin transfer rate and is used in embedded computing, industrial HMIs, and low-power networking equipment requiring JEDEC-compliant memory with extended temperature support.
For engineers reviewing the W631GU6KS-15 datasheet, W631GU6KS-15 pinout, W631GU6KS-15 application, or W631GU6KS-15 equivalent, key selection considerations include its VDD/VDDQ = 1.283–1.45 V operation, -40°C to +95°C industrial temperature range, 96-ball VFBGA package, and support for ZQ calibration, dynamic ODT, write leveling, and Multi-Purpose Register (MPR) timing calibration.
Technical Context
This DDR3L SDRAM implements an 8-bit prefetch architecture with eight internal banks enabling concurrent access, differential CK/CK# clocking synchronized at the cross-point, and source-synchronous DQS/DQS# strobes edge-aligned on reads and center-aligned on writes. Its DLL aligns DQ and DQS transitions to CK, and it supports posted CAS with additive latency (AL = 0, CL−1, CL−2) to improve bus efficiency.
The device features asynchronous RESET# for power-up initialization, programmable mode registers (MR0–MR3) controlling CAS latency, CWL, ODT RTT values, PASR, ASR, and dynamic ODT activation, plus ZQ calibration using an external 240 Ω reference resistor to adjust output driver and termination impedance across voltage/temperature variation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Gbit (8M words × 8 banks × 16 bits) |
| Data Rate | 1333 Mb/sec/pin (DDR3L-1333, tCK = 1.5 ns min) |
| Supply Voltage | VDD/VDDQ = 1.283 V to 1.45 V (1.35 V typical); backward-compatible to 1.5 V ±0.075 V |
| CAS Latency | CL = 6, 7, 8, 9, 10 (configurable via MR0) |
| CAS Write Latency | CWL = 5, 6, 7 (configurable via MR2 per frequency) |
| Operating Temp | -40°C ≤ TCASE ≤ 95°C (industrial grade, per W631GU6KS15I spec) |
| Package | VFBGA-96 (7.5 mm × 13 mm, 1.0 mm height, RoHS/lead-free) |
| Refresh Interval | tREFI = 7.8 µs (0–85°C), 3.9 µs (85–95°C) with ASR or Manual Self-Refresh enabled |
Pinout & Package
VFBGA-96 package (7.5 mm × 13 mm, 1.0 mm thickness) with 0.8 mm ball pitch; RoHS-compliant, lead-free construction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential Clock Input | Latches all command/address inputs at cross-point; defines system timing reference |
| DQS / DQS# | Differential Data Strobe | Source-synchronous strobe: edge-aligned with read data, center-aligned with write data |
| RESET# | Asynchronous Reset Input | Initiates power-up sequence and resets internal state machines without clock dependency |
| ZQ | Calibration Reference Terminal | Connects to 240 Ω ±1% external resistor to ground for output driver and ODT impedance tuning |
| VREFCA / VREFDQ | Reference Voltage Inputs | VREFCA sets mid-point for command/address inputs; VREFDQ sets mid-point for data/strobe inputs |
| ODT | On-Die Termination Control | Dynamic enable/disable of programmable RTT values (RZQ/4, RZQ/2, RZQ/1) on DQ/DQS/DM lines |
| CKE | Clock Enable | Gates internal clock; controls entry/exit from power-down modes and self-refresh |
| A10/AP | Address/Partial Array Refresh | When asserted during PRE, enables partial array self-refresh (PASR) to reduce current in idle banks |
Key Features
| Feature | Design Value |
|---|---|
| Dynamic ODT (Rtt_WR) | Enables on-the-fly ODT activation during WRITE bursts only, improving signal integrity without affecting READ termination |
| Write Leveling Support | Allows controller to calibrate DQS-to-CK skew per byte lane using MPR-defined pattern, critical for timing closure at 1333 MT/s |
| Multi-Purpose Register (MPR) | Provides predefined 128-bit calibration pattern for system-level timing margin analysis and eye-diagram validation |
| ZQ Calibration | Performs periodic impedance adjustment of output drivers and ODT networks using external 240 Ω resistor, maintaining signal fidelity across voltage/temperature drift |
| Auto Self-Refresh (ASR) | Automatically switches to self-refresh when temperature exceeds 85°C (tREFI halved to 3.9 µs), eliminating host intervention for thermal management |
| Programmable Burst Length | Supports BL8 (fixed) and BC4 (on-the-fly selectable), enabling flexible burst optimization for cache line vs. streaming workloads |
Applications
| Industrial HMI Controllers | Embedded Network Routers |
|---|---|
Use Scenario: Touch-enabled factory-floor HMIs running real-time Linux with graphics overlay and local data logging. IC Role / Device Role / Timing Role: Primary system memory providing 16-bit wide data path to ARM Cortex-A9/A15 SoC with DDR3L interface. Use Value: Low-voltage 1.35 V operation reduces system power by ~15% vs. 1.5 V DDR3 while maintaining full DDR3L-1333 bandwidth for GUI frame buffering and firmware updates. | Use Scenario: Fanless industrial routers handling VLAN switching, QoS packet classification, and TLS offload in harsh environments. IC Role / Device Role / Timing Role: Shared memory for packet buffer and forwarding table storage, interfaced to MIPS-based network processor. Use Value: -40°C to +95°C industrial rating ensures reliable operation without derating in sealed enclosures; ASR mode maintains data retention during ambient temperature excursions. |
| Medical Diagnostic Terminals | Smart Energy Gateways |
Use Scenario: Portable ultrasound imaging terminals requiring deterministic memory latency for real-time beamforming and display rendering. IC Role / Device Role / Timing Role: Low-latency DRAM supporting burst-mode transfers for pixel FIFO and DICOM metadata caching. Use Value: Programmable CAS Latency (CL6–CL10) and additive latency allow fine-grained timing tuning to meet sub-20 ns read-to-data requirements under varying load conditions. | Use Scenario: DIN-rail mounted smart grid gateways aggregating AMI meter data, performing edge analytics, and hosting secure TLS stacks. IC Role / Device Role / Timing Role: Main memory for dual-core ARM Cortex-A7 running FreeRTOS and Linux containers. Use Value: Dynamic ODT and write leveling ensure robust signal integrity over long PCB traces in noisy EMI environments; ZQ calibration maintains impedance stability across 10-year field life. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR3L SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT41K128M16JT-125:K | 1 Gbit DDR3L, 96-ball VFBGA, CL=9 @ 800 MHz (DDR3L-1600), 1.283–1.45 V, supports 105°C operation | Higher speed bin (1600 MT/s) and extended temp (105°C) but no ASR support; requires different tREFI handling | Select when higher bandwidth or extended temperature beyond 95°C is required; verify SPD programming for refresh timing compatibility |
| IS43TR16128B-15KBL | 1 Gbit DDR3L, 96-ball VFBGA, CL=9 @ 667 MHz (DDR3L-1333), 1.283–1.45 V, supports -40°C to +95°C | Identical speed grade and temp range; lacks write leveling and MPR; uses fixed ODT settings instead of dynamic ODT | Choose for cost-sensitive designs where advanced calibration features are unnecessary and simpler initialization is preferred |
Compared with MT41K128M16JT-125:K and IS43TR16128B-15KBL, the W631GU6KS-15 provides unique value through integrated write leveling and MPR for high-reliability timing margin validation, ASR for automatic thermal refresh adaptation, and dynamic ODT for optimized signal integrity-features absent in the alternatives without trade-offs in speed or temperature compliance.
Availability
W631GU6KS-15 is available at Aetrix Electronics and suitable for industrial HMIs, embedded network routers, and medical diagnostic terminals requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for W631GU6KS-15 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and DRAM products for industrial, automotive, and communications markets.
The W631GU6KS series belongs to Winbond's industrial-grade DDR3L SDRAM product line, designed specifically for applications demanding low-voltage operation, extended temperature reliability, and JEDEC-compliant calibration features such as ZQ, write leveling, and ASR.
FAQ
What is the maximum operating frequency supported by W631GU6KS-15?
The W631GU6KS-15 supports DDR3L-1333 operation with a maximum clock frequency of 667 MHz (1333 MT/s), corresponding to a minimum tCK of 1.5 ns. This speed grade is validated across the full industrial temperature range (-40°C to +95°C) and requires CL = 9, tRCD = tRP = 9 cycles per JEDEC specification. The device does not support higher bins like DDR3L-1600 or DDR3L-1866.
Does W631GU6KS-15 support both 1.35 V and 1.5 V supply voltages?
Yes, W631GU6KS-15 is fully backward-compatible with standard DDR3 1.5 V operation (VDD/VDDQ = 1.5 V ± 0.075 V) while being optimized for DDR3L 1.35 V operation (VDD/VDDQ = 1.283 V to 1.45 V). The device automatically adapts internal biasing and timing parameters based on applied supply voltage, enabling drop-in replacement in legacy 1.5 V systems without hardware modification.
How does the Auto Self-Refresh (ASR) feature function in W631GU6KS-15?
In W631GU6KS-15, ASR automatically activates when junction temperature exceeds 85°C, halving the refresh interval from 7.8 µs to 3.9 µs to maintain data retention. This is implemented via MR2 bit A6 = 1b and requires no host intervention. ASR eliminates manual thermal monitoring and refresh reprogramming, making it ideal for sealed industrial enclosures where passive cooling dominates.
What is the purpose of the ZQ pin on W631GU6KS-15, and what external component is required?
The ZQ pin on W631GU6KS-15 connects to a precision 240 Ω ±1% external resistor to ground, enabling on-die calibration of output driver strength and ODT termination impedances. This calibration compensates for process, voltage, and temperature (PVT) variations, ensuring consistent signal integrity across operating conditions. No capacitor is required; only the 240 Ω resistor with minimal parasitic inductance is needed.
Can W631GU6KS-15 be used with controllers that do not support write leveling or MPR?
Yes, W631GU6KS-15 operates fully in standard DDR3L mode without write leveling or MPR activation. These features are optional enhancements: write leveling is entered via MRS command to MR2, and MPR is accessed via specific READ commands. Legacy controllers can initialize and use W631GU6KS-15 identically to any JEDEC DDR3L part, retaining full functionality while omitting advanced calibration steps.
W631GU6KS-15 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 96-VFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - DDR3L
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 667 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 20 ns
- Voltage - Supply:
- 1.283V ~ 1.45V
- Operating Temperature:
- 0°C ~ 95°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 96-VFBGA (7.5x13)
W631GU6KS-15 FAQ
1.How can I place an order for W631GU6KS-15 through Aetrix?
Please submit a Request for Quotation (RFQ) for W631GU6KS-15 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W631GU6KS-15 reliable?
The price and inventory of W631GU6KS-15 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W631GU6KS-15 is usually 5 days.
3.What payment methods are accepted for W631GU6KS-15?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W631GU6KS-15 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W631GU6KS-15?
W631GU6KS-15 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W631GU6KS-15 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W631GU6KS-15?
For technical support, including W631GU6KS-15 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W631GU6KS-15 requirements.
6.How does Aetrix verify that W631GU6KS-15 is sourced from the original manufacturer or authorized distributors?
All W631GU6KS-15 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W631GU6KS-15 meets industry standards.
7.What is the process for return or replacement of W631GU6KS-15?
All W631GU6KS-15 units undergo pre-shipment inspection (PSI). If there is an issue with W631GU6KS-15, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W631GU6KS-15 part is unused and in its original packaging.
Return procedure for W631GU6KS-15:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W631GU6KS-15 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
