Winbond Electronics Corporation W631GU6MB12I

Overview

W631GU6MB12I from Winbond is a 1G-bit DDR3L SDRAM organized as 8M × 8 banks × 16 bits, operating at 1.35 V nominal supply with industrial temperature range (–40°C to +95°C), compliant with DDR3L-1600 (11-11-11) timing, and packaged in a 96-ball VFBGA (7.5 × 13 mm). It delivers 1600 MT/s data rates for memory subsystems in embedded controllers, networking edge devices, and industrial HMIs.

For engineers reviewing the W631GU6MB12I datasheet, W631GU6MB12I pinout, W631GU6MB12I application, or W631GU6MB12I equivalent, key selection considerations include its DDR3L-1600 speed bin, industrial-grade thermal rating, programmable CAS latency (CL = 5–11), on-die termination (ODT), ZQ calibration support, and compatibility with JEDEC-standard DDR3L command protocols and power-down modes.

Technical Context

This device implements an 8-bank, 8-bit prefetch architecture synchronized to differential CK/CK# clocks, with DLL-aligned DQS/DQS# strobes for source-synchronous read/write timing. It supports posted CAS with additive latency (AL = 0, CL−1, CL−2), enabling efficient command bus utilization during high-bandwidth transfers.

W631GU6MB12I integrates asynchronous RESET#, dynamic ODT (Rtt_WR), multi-purpose register (MPR) for system-level timing calibration, and write leveling for precise DQ-to-DQS skew compensation-critical for stable operation at 800 MHz clock frequency (tCK = 1.25 ns).

Key Specifications

Pinout & Package

VFBGA-96 package (7.5 mm × 13 mm, 1.0 mm thickness) with 0.8 mm ball pitch; RoHS-compliant, lead-free construction.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR3L SDRAM applications.

Compared with MT41K128M16JT-125K and IS43TR16128B-125KBL, W631GU6MB12I offers broader CAS latency flexibility, integrated PASR for ultra-low-power self-refresh, and standardized MPR-based timing validation-making it preferable for heterogeneous SoC designs requiring robust interoperability and thermal resilience.

Availability

W631GU6MB12I is available at Aetrix Electronics and suitable for industrial HMIs, network edge routers, embedded vision systems, medical diagnostic terminals, and other applications requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for W631GU6MB12I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions, including SPI NOR Flash, DDR SDRAM, and mobile LPDRAM products.

W631GU6MB12I belongs to Winbond's DDR3L SDRAM product line, designed specifically for cost-sensitive, thermally demanding industrial and networking applications requiring JEDEC-compliant low-voltage memory with extended temperature support.

FAQ

What is the maximum clock frequency supported by W631GU6MB12I?

W631GU6MB12I supports a maximum clock frequency of 800 MHz (tCK = 1.25 ns), corresponding to DDR3L-1600 operation with 11-11-11 timing. This is validated across the full industrial temperature range (–40°C to +95°C) and requires stable 1.35 V ±6.3 % supply rails per JEDEC specification.

Does W631GU6MB12I support backward compatibility with standard DDR3 (1.5 V) systems?

Yes, W631GU6MB12I supports dual-voltage operation: it functions at 1.35 V nominal for DDR3L mode and is fully backward compatible with 1.5 V ±0.075 V DDR3 systems. Voltage switching between modes is controlled via VDD/VDDQ supply sequencing and does not require changes to command protocol or timing parameters.

How does the Write Leveling feature work in W631GU6MB12I?

W631GU6MB12I implements JEDEC-compliant write leveling using its MPR and dedicated DQS gating logic. During initialization, the memory controller issues a write leveling command, and W631GU6MB12I returns a known pattern on DQ while adjusting DQS delay until edge alignment is achieved-enabling precise per-lane skew compensation at 800 MHz.

What package type and dimensions does W631GU6MB12I use?

W631GU6MB12I uses a 96-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA) package measuring 7.5 mm × 13 mm with 1.0 mm maximum height and 0.8 mm ball pitch. The package is RoHS-compliant, lead-free, and designed for standard reflow soldering profiles used in industrial PCB assembly.

Can W631GU6MB12I operate in Partial Array Self-Refresh (PASR) mode?

Yes, W631GU6MB12I supports PASR via MR2 programming (A1–A3 bits), allowing refresh cycles to target only selected banks. This reduces self-refresh current by up to 50 % compared to full-array refresh, making W631GU6MB12I suitable for battery-backed or energy-constrained industrial applications requiring extended low-power operation.