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Winbond Electronics Corporation W631GU6MB-15
- Part No.:
- W631GU6MB-15
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 96-VFBGA
- Datasheet:
-
W631GU6MB-15.pdf
- Description:
- IC DRAM 1GBIT PAR 96VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,826
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Product details
Overview
W631GU6MB-15 from Winbond is a 1G-bit DDR3L SDRAM organized as 8M × 8 banks × 16 bits, operating at 1.35V nominal supply with DDR3L-1333 speed grade (9-9-9 timing), supporting CAS Latency 5–10 and CWL 5–7. It delivers 1333 MT/s data transfer rate in consumer-grade temperature range (0°C to 95°C) and is used in embedded computing, industrial HMIs, and low-power networking equipment requiring JEDEC-compliant memory with backward 1.5V DDR3 compatibility.
For engineers reviewing the W631GU6MB-15 datasheet, W631GU6MB-15 pinout, W631GU6MB-15 application, or W631GU6MB-15 equivalent, key selection considerations include its VFBGA-96 package, 1.35V operation with 1.5V fallback support, programmable ODT and ZQ calibration, DLL-enabled source-synchronous DQS alignment, and industrial-temperature-compatible variants (W631GU6MB-15I/J).
Technical Context
This DDR3L SDRAM implements an 8-bit prefetch architecture with eight internal banks for concurrent access and supports both burst length 8 (BL8) and burst chop 4 (BC4) modes via mode register or on-the-fly selection. Its differential CK/CK# input synchronizes all commands, while bi-directional DQS/DQS# strobes edge-align with read data and center-align with write data.
The device integrates asynchronous RESET#, programmable CAS Write Latency (CWL), additive latency (AL = 0, CL−1, CL−2), auto-precharge, and multi-purpose register (MPR) for system-level timing calibration. It supports ZQ calibration for output driver and ODT impedance tuning, dynamic ODT during writes, and partial array self-refresh (PASR) for power optimization.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 G-bit (8M words × 8 banks × 16 bits) |
| Data Rate | 1333 MT/s (DDR3L-1333, tCK = 1.5 ns min) |
| Supply Voltage | 1.35V nominal (1.283V–1.45V), backward compatible to 1.5V ±75 mV |
| CAS Latency | Programmable CL = 5, 6, 7, 8, 9, 10 |
| CAS Write Latency | Programmable CWL = 5, 6, 7 |
| Operating Temp | 0°C ≤ TCASE ≤ 95°C (consumer grade) |
| Package | VFBGA-96 (7.5 mm × 13 mm, 1.0 mm height, RoHS-compliant) |
| Refresh Interval | tREFI = 7.8 µs (0°C–85°C), 3.9 µs (85°C–95°C) |
Pinout & Package
VFBGA-96 package with 7.5 mm × 13 mm footprint, 0.8 mm ball pitch, and lead-free RoHS-compliant construction. Ball layout follows JEDEC-standard DDR3L pin assignment for address, command, data, and control signals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A14 | Address Inputs | Row/column address for bank and page access; A10 controls auto-precharge |
| BA0–BA2 | Bank Address | Selects one of eight internal banks for concurrent operation |
| CK, CK# | Differential Clock | Edge-triggered command latching; inputs sampled at CK rising / CK# falling crosspoint |
| CS#, RAS#, CAS#, WE# | Command Signals | Active-low command decode bus (chip select, row addr strobe, column addr strobe, write enable) |
| DM0–DM1 | Data Mask | Per-byte write masking for 16-bit data bus (two 8-bit lanes) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus synchronized to DQS/DQS# |
| DQS, DQS# | Differential Strobe | Source-synchronous strobe: edge-aligned on reads, center-aligned on writes |
| RESET# | Asynchronous Reset | Initiates power-up initialization sequence and resets internal state machines |
| ODT | On-Die Termination Control | Enables/disables programmable termination resistors on DQ/DQS/DM lines |
| ZQ | ZQ Calibration Reference | Connects to external 240 Ω ±1% resistor to ground for output driver and ODT impedance tuning |
Key Features
| Feature | Design Value |
|---|---|
| Posted CAS with AL | AL = 0, CL−1, or CL−2 improves command bus efficiency by decoupling command issuance from data availability |
| Dynamic ODT | Configurable Rtt_WR termination during write bursts enhances signal integrity without requiring external resistors |
| ZQ Calibration | One-time or periodic calibration using external 240 Ω resistor ensures consistent 34 Ω output driver and ODT impedance across voltage/temperature |
| Write Leveling Support | Hardware-assisted timing calibration aligns DQ launch edges to DQS window for reliable high-speed writes |
| Multi-Purpose Register (MPR) | Predefined bit pattern readout enables system-level timing margin verification without disturbing normal memory operation |
| Partial Array Self-Refresh | PASR reduces self-refresh current by refreshing only active banks, lowering IDD6 in power-constrained applications |
Applications
| Industrial HMI Panels | Network Edge Routers |
|---|---|
Use Scenario: Touch-enabled operator interfaces in factory automation systems requiring responsive GUI rendering and local data buffering. IC Role / Device Role / Timing Role: Main system memory for ARM-based SoC, providing 16-bit wide data path and low-latency access to display frame buffers and firmware. Use Value: DDR3L-1333 speed and 1.35V operation reduce thermal load in sealed enclosures; PASR and self-refresh modes extend uptime during intermittent power loss. | Use Scenario: Packet buffering and forwarding tables in compact Layer 3 switches deployed in telecom cabinets. IC Role / Device Role / Timing Role: Shared packet buffer memory interfaced to network processor's DDR3L controller, supporting burst-intensive traffic shaping. Use Value: Programmable ODT and write leveling ensure signal integrity at 1333 MT/s across variable PCB trace lengths; ZQ calibration maintains impedance stability over temperature swings. |
| Embedded Vision Systems | Medical Diagnostic Terminals |
Use Scenario: Real-time image preprocessing pipelines in portable ultrasound or endoscopy devices with FPGA-accelerated processing. IC Role / Device Role / Timing Role: Frame store for raw sensor data and intermediate convolution results, accessed concurrently by FPGA and ARM core. Use Value: Eight-bank architecture enables interleaved access to multiple image regions; BL8/BC4 flexibility matches varying DMA burst sizes without bus contention. | Use Scenario: Clinical data terminals running certified medical software stacks where component longevity and qualification are critical. IC Role / Device Role / Timing Role: Primary working memory for safety-critical applications, operating within validated temperature and voltage margins per IEC 62304. Use Value: Backward 1.5V DDR3 compatibility allows reuse of legacy board designs; -15 speed grade guarantees stable 9-9-9 timing across full 0°C–95°C range without derating. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR3L SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT41K128M16JT-125:K | 1G-bit DDR3L, 125-ball FBGA, 1600 MT/s base speed (CL=11), 1.35V only (no 1.5V fallback) | Higher performance tier; requires tighter layout control for 1600 MT/s; no 1.5V compatibility | Choose when higher bandwidth is needed and design can accommodate stricter signal integrity requirements. |
| IS43TR16128B-15KBL | 1G-bit DDR3L, 96-ball VFBGA, DDR3L-1333 (9-9-9), 1.35V nominal, supports 1.5V but with reduced timing margin | Same package and speed grade; slightly higher IDD0/IDD1 current draw; different MPR implementation | Valid drop-in alternative if board layout and thermal budget allow minor power increase and MPR usage is not required. |
Compared with W631GU6MB-15, MT41K128M16JT-125:K offers higher bandwidth but sacrifices 1.5V compatibility and increases layout complexity, while IS43TR16128B-15KBL matches speed and package but trades off tighter power envelope for identical functional coverage.
Availability
W631GU6MB-15 is available at Aetrix Electronics and suitable for industrial HMIs, network edge routers, embedded vision systems, and medical diagnostic terminals requiring stable component supply with guaranteed long-term sourcing.
Supply support for W631GU6MB-15 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory, flash storage, and security ICs, with global manufacturing and quality certifications including ISO 9001 and IATF 16949.
The W631GU6MB-15 belongs to Winbond's DDR3L SDRAM product line, designed specifically for cost-sensitive, thermally constrained embedded applications requiring JEDEC compliance, low-voltage operation, and extended temperature reliability without sacrificing timing consistency.
FAQ
What is the maximum operating frequency supported by the W631GU6MB-15?
The W631GU6MB-15 is rated for DDR3L-1333 operation, meaning it supports a maximum clock frequency of 667 MHz (1333 MT/s data rate). Its tCK(AVG) specification is 1.5 ns minimum for CL=9/CWL=7 configurations, and it complies fully with JEDEC JESD79-3F for this speed bin under 0°C to 95°C case temperature conditions. The W631GU6MB-15 does not support higher speed grades like DDR3L-1600 or DDR3L-1866.
Does the W631GU6MB-15 support 1.5V DDR3 operation?
Yes, the W631GU6MB-15 is backward compatible with standard 1.5V DDR3 systems. Its VDD/VDDQ supply accepts 1.5V ±75 mV per JEDEC specifications, enabling drop-in replacement in legacy 1.5V designs. However, when operated at 1.5V, timing parameters such as tRCD and tRP must be verified against the 1.5V-specific AC table in the datasheet, and certain low-power features like deep power-down may not be available.
What package type and ball count does the W631GU6MB-15 use?
The W631GU6MB-15 uses a 96-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA) package measuring 7.5 mm × 13 mm with 0.8 mm ball pitch. This JEDEC-standard footprint matches other DDR3L SDRAMs in the same density class and supports automated assembly with standard reflow profiles. The W631GU6MB-15's VFBGA-96 layout is documented in Section 5 ("Ball Configuration") of its datasheet.
How does the W631GU6MB-15 handle refresh at elevated temperatures?
At case temperatures above 85°C, the W631GU6MB-15 requires halving the refresh interval from 7.8 µS to 3.9 µS - effectively doubling the refresh command rate - to maintain data retention. This is mandated per JEDEC for DDR3L devices operating up to 95°C. The W631GU6MB-15 supports both Auto Self-Refresh (ASR) and Manual Self-Refresh modes to manage this requirement without host intervention during thermal excursions.
Can the W631GU6MB-15 be used with write leveling and MPR for system calibration?
Yes, the W631GU6MB-15 fully supports write leveling and Multi-Purpose Register (MPR) functionality as defined in JEDEC DDR3L standards. Write leveling calibrates DQ-to-DQS timing skew per byte lane, while MPR provides a predefined read pattern for verifying timing margins. These features are accessible via standard mode register writes and are essential for robust high-speed interface bring-up in systems using the W631GU6MB-15.
W631GU6MB-15 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 96-VFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - DDR3L
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 667 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 20 ns
- Voltage - Supply:
- 1.283V ~ 1.45V
- Operating Temperature:
- 0°C ~ 95°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 96-VFBGA (7.5x13)
W631GU6MB-15 FAQ
1.How can I place an order for W631GU6MB-15 through Aetrix?
Please submit a Request for Quotation (RFQ) for W631GU6MB-15 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W631GU6MB-15 reliable?
The price and inventory of W631GU6MB-15 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W631GU6MB-15 is usually 5 days.
3.What payment methods are accepted for W631GU6MB-15?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W631GU6MB-15 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W631GU6MB-15?
W631GU6MB-15 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W631GU6MB-15 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W631GU6MB-15?
For technical support, including W631GU6MB-15 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W631GU6MB-15 requirements.
6.How does Aetrix verify that W631GU6MB-15 is sourced from the original manufacturer or authorized distributors?
All W631GU6MB-15 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W631GU6MB-15 meets industry standards.
7.What is the process for return or replacement of W631GU6MB-15?
All W631GU6MB-15 units undergo pre-shipment inspection (PSI). If there is an issue with W631GU6MB-15, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W631GU6MB-15 part is unused and in its original packaging.
Return procedure for W631GU6MB-15:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W631GU6MB-15 Tags
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M24C02-WMN6TP
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