Winbond Electronics Corporation W631GU8KB15I TR

Overview

W631GU8KB15I TR from Winbond is a 1G-bit DDR3L SDRAM organized as 16M × 8 banks × 8 bits, operating at 1.35V nominal supply with industrial temperature range (–40°C to +95°C), supporting DDR3L-1333 speed grade (9-9-9 timing), and featuring on-die termination, ZQ calibration, and asynchronous RESET# for reliable memory subsystems in embedded controllers and networking equipment.

For engineers reviewing the W631GU8KB15I TR datasheet, W631GU8KB15I TR pinout, W631GU8KB15I TR application, or W631GU8KB15I TR equivalent, key selection considerations include its industrial-grade thermal rating, DDR3L-1333 timing compliance, 78-ball WBGA package, and support for dynamic ODT, write leveling, and partial array self-refresh-critical for power-constrained, thermally demanding designs.

Technical Context

This DDR3L SDRAM implements an 8-bit prefetch architecture with eight internal banks enabling concurrent access, differential CK/CK# and DQS/DQS# signaling for source-synchronous data transfer, and DLL-based alignment of DQ and DQS edges to clock. It supports programmable CAS latency (CL = 6, 7, 8, 9, 10), CAS write latency (CWL = 5–7), and additive latency (AL = 0, CL−1, CL−2) to optimize command bus efficiency.

Functional operation includes posted CAS, auto-precharge, burst lengths of 8 (BL8) or burst chop 4 (BC4), multi-purpose register (MPR) for system-level timing calibration, and dual-mode ODT (synchronous and dynamic) with RTT_NOM and RTT_WR impedance control. Refresh modes cover standard, self-refresh, auto self-refresh (ASR), and partial array self-refresh (PASR) with temperature-aware tREFI scaling.

Key Specifications

Pinout & Package

W631GU8KB15I TR uses a 78-ball WBGA package (8 mm × 10.5 mm, 0.8 mm pitch) with RoHS-compliant lead-free construction. Ball layout follows JEDEC-standard DDR3L pinout with dedicated VREFCA/VREFDQ references, ZQ calibration terminal, and separate VDDQ/VSSQ planes for I/O noise isolation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR3L SDRAM applications.

Compared with MT41K128M8RH-125:E and IS43TR16128B-125KBL, W631GU8KB15I TR delivers optimized power efficiency at DDR3L-1333 speeds, integrated thermal-aware refresh (ASR/PASR), and factory-calibrated write leveling-making it preferred for space-constrained, thermally aggressive, and safety-aware embedded systems.

Availability

W631GU8KB15I TR is available at Aetrix Electronics and suitable for industrial automation, network infrastructure, and medical imaging applications requiring stable component supply, long-term lifecycle assurance, and full industrial temperature qualification.

Supply support for W631GU8KB15I TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and DRAM products for industrial, automotive, and communications markets.

The W631GU8KB series belongs to Winbond's industrial-grade DDR3L SDRAM product line, designed specifically for applications demanding extended temperature operation, low-voltage efficiency, and JEDEC-compliant reliability in harsh environments.

FAQ

What is the maximum operating frequency supported by W631GU8KB15I TR?

W631GU8KB15I TR supports DDR3L-1333 operation with a maximum clock frequency of 667 MHz (tCK = 1.5 ns). Its speed bin is defined as 9-9-9 (CL-tRCD-tRP), and it achieves this performance across the full industrial temperature range of –40°C to +95°C when used with appropriate VDD/VDDQ (1.283–1.45 V) and timing configuration.

Does W631GU8KB15I TR support backward compatibility with standard 1.5 V DDR3 systems?

Yes, W631GU8KB15I TR is fully backward compatible with 1.5 V DDR3 systems. It operates within VDD/VDDQ = 1.5 V ± 0.075 V (1.425–1.575 V) and maintains functional equivalence-including identical command encoding, timing parameters, and pinout-while retaining DDR3L-specific features like lower IDD6 and ASR.

How does the ZQ calibration function work on W631GU8KB15I TR?

W631GU8KB15I TR performs ZQ calibration by measuring an external 240 Ω ±1% resistor connected between the ZQ pin and ground. This one-time or periodic calibration adjusts internal output driver and ODT impedances to maintain ±2.5% accuracy over voltage and temperature variations, ensuring consistent signal integrity in high-speed DDR3L interfaces.

What is the purpose of the Multi-Purpose Register (MPR) in W631GU8KB15I TR?

The MPR in W631GU8KB15I TR provides a predefined 128-bit read-only pattern used for system-level timing calibration. During MPR read mode, the device outputs this fixed sequence instead of user data, enabling precise DQS-to-CK skew measurement and write leveling without requiring external test vectors or memory initialization software.

Can W631GU8KB15I TR operate reliably at +95°C case temperature?

Yes, W631GU8KB15I TR is fully specified for operation at TCASE = +95°C. At this temperature, it requires either Manual Self-Refresh with Extended Temperature Range (MR2[7:6] = 0b10) or Auto Self-Refresh (ASR) enabled (MR2[6] = 1b) to double refresh frequency (tREFI = 3.9 µs), ensuring data retention integrity without derating.