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Winbond Electronics Corporation W631GU8MB-15
- Part No.:
- W631GU8MB-15
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 78-VFBGA
- Datasheet:
-
W631GU8MB-15.pdf
- Description:
- IC DRAM 1GBIT PAR 78VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,690
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Product details
Overview
W631GU8MB-15 from Winbond is a 1G-bit DDR3L SDRAM organized as 16M × 8 banks × 8 bits, operating at 1.35 V nominal supply with DDR3L-1333 (9-9-9) timing, supporting CAS Latency 5–10 and CWL 5–7, and designed for low-power embedded and industrial memory subsystems requiring JEDEC-compliant 1.35 V operation.
For engineers reviewing the W631GU8MB-15 datasheet, W631GU8MB-15 pinout, W631GU8MB-15 application, or W631GU8MB-15 equivalent, this page delivers verified DDR3L timing parameters, ball configuration, ODT and ZQ calibration behavior, power-down modes, and industrial temperature support up to 95°C - all confirmed for the -15 speed grade.
Technical Context
The W631GU8MB-15 implements an 8-bank, 8-bit prefetch DDR3L architecture synchronized to differential CK/CK# inputs, with DLL-aligned DQS/DQS# strobes for source-synchronous read/write transfers. It supports programmable additive latency (AL = 0, CL−1, CL−2), posted CAS, auto-precharge, and burst lengths of 8 (BL8) or 4 (BC4).
It features asynchronous RESET#, on-die termination (ODT) with static and dynamic modes (Rtt_WR), ZQ calibration using external 240 Ω resistor, multi-purpose register (MPR) for timing calibration bitstream readout, and write leveling for per-lane skew compensation - all compliant with JEDEC DDR3L standard JESD79-3F.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Gbit (16M words × 8 banks × 8 bits) |
| Speed Grade | DDR3L-1333 (9-9-9 CL-tRCD-tRP); max fCK = 667 MHz |
| Supply Voltage | VDD/VDDQ = 1.283 V to 1.45 V (1.35 V typical); backward-compatible to 1.5 V ± 0.075 V |
| CAS Latency (CL) | Programmable CL = 5, 6, 7, 8, 9, 10 (JEDEC-compliant settings) |
| CAS Write Latency (CWL) | Programmable CWL = 5, 6, 7 (frequency-dependent; CWL = 7 at 667 MHz) |
| Operating Temperature | 0°C ≤ TCASE ≤ 95°C (commercial/industrial extended range) |
| Package | VFBGA-78 (8 mm × 10.5 mm, 1.0 mm height, RoHS-compliant, lead-free) |
Pinout & Package
VFBGA-78 package (8 mm × 10.5 mm, 1.0 mm height) with 78 solder balls arranged in 8×10 array plus 2 dummy balls (A1/B1), RoHS-compliant and lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1, B1 | Dummy Ball | No electrical connection; mechanical support only |
| A2–A9, B2–B9, C1–C9, D1–D9, E1–E9, F1–F9, G1–G9, H1–H9 | Address/Command/Data/Strobe/Control | Includes A0–A13, BA0–BA2, RAS#, CAS#, WE#, CS#, CKE, ODT, DQ0–DQ7, DM0–DM0, DQS/DQS#, CK/CK#, VDD, VDDQ, VSS, VSSQ |
| VDD, VDDQ | Power Supply | Separate 1.35 V supplies for core (VDD) and I/O (VDDQ); decoupling required per JEDEC layout guidelines |
| VSS, VSSQ | Ground | Dedicated ground planes for core (VSS) and I/O (VSSQ); critical for signal integrity and noise isolation |
| RESET# | Asynchronous Reset | Active-low initialization trigger; initiates power-up sequence and mode register reset independent of clock |
Key Features
| Feature | Design Value |
|---|---|
| ZQ Calibration | On-die driver and ODT impedance tuning using external 240 Ω reference resistor; enables consistent 34 Ω output and 60/120/150 Ω ODT settings |
| Dynamic ODT (Rtt_WR) | Per-write-cycle ODT activation on DQ/DQS lines; improves write signal integrity without affecting read termination |
| Write Leveling | Calibration protocol using MPR pattern and DQS delay adjustment; compensates for board-level flight-time skew between CK and DQS |
| Multi-Purpose Register (MPR) | Predefined 128-bit calibration pattern accessible via MRS; used for system-level timing margin verification and eye-diagram optimization |
| Partial Array Self-Refresh (PASR) | Selective refresh of active banks only; reduces self-refresh current by up to 50% when full-array refresh is unnecessary |
Applications
| Industrial HMI Panels | Network Edge Routers |
|---|---|
|
Use Scenario: Touch-enabled operator interfaces in factory automation systems requiring reliable memory operation across 0°C–95°C ambient. IC Role / Device Role / Timing Role: Primary working memory for ARM-based SoC running real-time Linux; handles GUI frame buffers and control data structures. Use Value: DDR3L-1333 timing and 1.35 V supply reduce thermal load and power delivery complexity versus 1.5 V DDR3, while maintaining JEDEC compatibility with legacy controllers. |
Use Scenario: Packet buffering and forwarding tables in fanless enterprise edge routers deployed in telecom cabinets. IC Role / Device Role / Timing Role: Low-latency, high-bandwidth buffer for network processor DMA engines; supports concurrent read/write bursts across 8 internal banks. Use Value: Programmable ODT and ZQ calibration ensure signal integrity on dense 6-layer PCBs with >10 cm trace lengths; PASR lowers standby power during traffic lulls. |
| Medical Diagnostic Displays | Automated Test Equipment (ATE) |
|
Use Scenario: High-resolution imaging displays in ultrasound and MRI consoles where memory reliability and thermal stability are safety-critical. IC Role / Device Role / Timing Role: Frame store for real-time image rendering pipeline; operates under strict thermal derating rules and periodic self-test. Use Value: Asynchronous RESET# enables deterministic recovery after brown-out events; industrial-grade 95°C case rating supports sealed, convection-cooled enclosures. |
Use Scenario: Pattern memory and result storage in modular ATE platforms performing high-speed digital IC validation. IC Role / Device Role / Timing Role: Burst-access scratchpad for test vector loading and pass/fail result accumulation; synchronized to tester clock domain via CK/CK#. Use Value: Write leveling and MPR support enable precise timing closure on variable-load fixtures; BL8/BC4 flexibility accommodates both wide and narrow data path test patterns. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR3L SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT41K128M8RH-125:E (Micron) | Same density, VFBGA-78, DDR3L-1600 (11-11-11); higher speed bin, tighter tAA/tRCD min (13.125 ns) | Requires controller support for CL=11/CWL=8; not drop-in for CL=9 systems without firmware update | Select if system demands >1333 MT/s bandwidth and can accommodate revised timing initialization |
| IS43TR16128B-15HBL (ISSI) | 16-bit bus width (x16), same DDR3L-1333 speed; different ballout (96-ball FBGA), no PASR or ASR support | Needs PCB redesign due to pin count and layout mismatch; lacks extended temperature self-refresh modes | Consider only for new designs targeting wider data paths and simplified ODT configuration |
Compared with W631GU8MB-15, the Micron part offers higher bandwidth but requires timing revalidation, while the ISSI part changes interface width and package - neither is pin-compatible, and both demand hardware or firmware adaptation for replacement.
Availability
W631GU8MB-15 is available at Aetrix Electronics and suitable for industrial HMI panels, network edge routers, medical diagnostic displays, automated test equipment, and embedded vision systems requiring stable component supply across commercial and extended temperature ranges.
Supply support for W631GU8MB-15 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and DRAM products for industrial, automotive, and communications markets.
The W631GU8MB-15 belongs to Winbond's DDR3L SDRAM product line, engineered for energy-efficient, thermally robust memory subsystems in space-constrained embedded applications where 1.35 V operation and JEDEC compliance are mandatory.
FAQ
What is the maximum clock frequency supported by W631GU8MB-15?
The W631GU8MB-15 supports a maximum input clock frequency of 667 MHz, corresponding to DDR3L-1333 data transfer rate (1333 MT/s). This is validated under JEDEC conditions with CL=9, tRCD=9, tRP=9, and VDD/VDDQ = 1.283–1.45 V. The device does not support higher speed bins such as DDR3L-1600 or DDR3L-1866.
Does W631GU8MB-15 support operation at 1.5 V?
Yes, W631GU8MB-15 is backward compatible with 1.5 V DDR3 operation per JEDEC JESD79-3F. It accepts VDD/VDDQ = 1.5 V ± 0.075 V and maintains full functionality, including all timing parameters and command sets. However, 1.35 V operation is recommended to achieve DDR3L power savings.
What temperature range is guaranteed for W631GU8MB-15?
W631GU8MB-15 is specified for 0°C ≤ TCASE ≤ 95°C. It meets full JEDEC AC/DC specifications across this range, including refresh interval scaling (tREFI = 7.8 µS at ≤85°C, 3.9 µS at 85–95°C) and IDD current limits. Industrial variants (e.g., W631GU8MB-15I) extend to −40°C.
How is on-die termination (ODT) configured on W631GU8MB-15?
ODT on W631GU8MB-15 is programmed via MR1 and MR2 registers. Static ODT values (Rtt_Nom = 60/120/150 Ω) are set in MR1, while dynamic ODT (Rtt_WR) is enabled in MR2. ZQ calibration must be performed after power-up and after any VDD/VDDQ change to maintain impedance accuracy within ±5%.
Is write leveling supported on W631GU8MB-15?
Yes, W631GU8MB-15 fully supports write leveling per JEDEC DDR3L specification. It uses the MPR to output a fixed pattern while the memory controller adjusts DQS delay to center-align write strobes with CK. This procedure is mandatory for timing closure on high-speed layouts and is implemented in MR2 and MRS commands.
W631GU8MB-15 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 78-VFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - DDR3L
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- 667 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 20 ns
- Voltage - Supply:
- 1.283V ~ 1.45V
- Operating Temperature:
- 0°C ~ 95°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 78-VFBGA (10.5x8)
W631GU8MB-15 FAQ
1.How can I place an order for W631GU8MB-15 through Aetrix?
Please submit a Request for Quotation (RFQ) for W631GU8MB-15 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W631GU8MB-15 reliable?
The price and inventory of W631GU8MB-15 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W631GU8MB-15 is usually 5 days.
3.What payment methods are accepted for W631GU8MB-15?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W631GU8MB-15 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W631GU8MB-15?
W631GU8MB-15 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W631GU8MB-15 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W631GU8MB-15?
For technical support, including W631GU8MB-15 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W631GU8MB-15 requirements.
6.How does Aetrix verify that W631GU8MB-15 is sourced from the original manufacturer or authorized distributors?
All W631GU8MB-15 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W631GU8MB-15 meets industry standards.
7.What is the process for return or replacement of W631GU8MB-15?
All W631GU8MB-15 units undergo pre-shipment inspection (PSI). If there is an issue with W631GU8MB-15, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W631GU8MB-15 part is unused and in its original packaging.
Return procedure for W631GU8MB-15:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W631GU8MB-15 Tags
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