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Winbond Electronics Corporation W631GU8NB09I

Part No.:
W631GU8NB09I
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
78-VFBGA
Datasheet:
AetrixW631GU8NB09I.pdf
Description:
IC DRAM 1GBIT PAR 78VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:242

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Product details

Overview

W631GU8NB09I from Winbond is a 1G-bit DDR3L SDRAM organized as 16M × 8 banks × 8 bits, operating at 1.35V nominal supply with industrial temperature range (−40°C to +95°C), supporting DDR3L-2133 speed (14-14-14 CL/tRCD/tRP), and delivering up to 17.06 GB/s peak bandwidth in burst mode for embedded computing and networking memory subsystems.

For engineers reviewing the W631GU8NB09I datasheet, W631GU8NB09I pinout, W631GU8NB09I application, or W631GU8NB09I equivalent, this device requires attention to its VFBGA-78 package layout, DDR3L-2133 timing compliance, industrial-grade thermal validation, and ZQ calibration dependency for signal integrity in high-speed memory interfaces.

Technical Context

This DDR3L SDRAM implements an 8-bit prefetch architecture with eight internal banks enabling concurrent access, DLL-aligned DQ/DQS timing relative to CK/CK#, and programmable CAS Write Latency (CWL) matched to frequency bins. It supports posted CAS with additive latency (AL = 0, CL−1, CL−2) and dynamic on-die termination (Rtt_WR) for write-time impedance control.

The device uses asynchronous RESET# for power-up initialization and supports system-level calibration via write leveling and Multi-Purpose Register (MPR) readout of predefined timing bit patterns. Its ZQ calibration references an external 240 Ω resistor to adjust output driver and ODT impedances across voltage and temperature.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density1 Gbit (16M words × 8 banks × 8 bits)
Data Width8-bit bidirectional I/O bus with DQS/DQS# strobes
Speed GradeDDR3L-2133 (14-14-14 CL/tRCD/tRP) at 1066 MHz clock
Supply VoltageVDD/VDDQ = 1.283 V to 1.45 V (1.35 V typical); backward-compatible to 1.5 V ±75 mV
Operating Temp−40°C ≤ TCASE ≤ +95°C (industrial grade)
Burst LengthFixed BL8 or BC4; selectable on-the-fly via mode register
CAS LatencyProgrammable CL = 5–14; supports AL = 0, CL−1, CL−2
Refresh IntervaltREFI = 7.8 µs (0–85°C), 3.9 µs (85–95°C); ASR/PASR supported

Pinout & Package

VFBGA-78 package (8 mm × 10.5 mm, 1.0 mm height, RoHS-compliant, lead-free), ball pitch 0.8 mm, window-type BGA layout.

Pin/TerminalCircuit RoleDesign Meaning
A0–A13Address InputsRow/column address for bank and page access; multiplexed with BA0–BA2
BA0–BA2Bank AddressSelect one of eight internal banks; latched with A0–A13 on ACT command
CK / CK#Differential ClockEdge-triggered command/address sampling at crosspoint; defines all timing windows
DQ0–DQ7Data I/O8-bit bidirectional data bus; synchronized to DQS/DQS# edges in source-synchronous mode
DQS / DQS#Differential StrobeSource-synchronous strobe: edge-aligned on reads, center-aligned on writes
DMData MaskPer-byte write mask; active-high, sampled on DQS rising edge
RESET#Asynchronous ResetActive-low initialization trigger; required for power-up sequence and functional reset
ODTOn-Die Termination ControlDynamic enable/disable of Rtt_NOM/Rtt_WR termination resistors on DQ/DQS/DM
WE#, RAS#, CAS#Command InputsStandard DDR3 command encoding (e.g., ACT, READ, WRITE, PRE, REF)
VDD / VDDQPower SuppliesSeparate 1.35 V supplies for core (VDD) and I/O (VDDQ); decoupling critical for signal integrity

Key Features

FeatureDesign Value
ZQ CalibrationUses external 240 Ω reference resistor to calibrate output driver strength and ODT resistance across process/voltage/temperature
Dynamic ODT (Rtt_WR)Enables on-the-fly ODT activation during WRITE bursts only, improving signal integrity without affecting read paths
Write LevelingAllows controller to calibrate DQS-to-CK skew per byte lane using MPR-read feedback, essential for >1600 MT/s operation
Multi-Purpose Register (MPR)Provides predefined 128-bit pattern for system-level timing margin verification and calibration without disturbing memory contents
Partial Array Self Refresh (PASR)Reduces self-refresh current by refreshing only selected banks, extending battery life in portable applications
Auto Self Refresh (ASR)Automatically adjusts refresh rate based on die temperature, eliminating host software intervention above 85°C

Applications

Industrial HMI ControllerNetwork Edge Router

Use Scenario: Real-time display rendering and multi-task OS execution in factory-floor HMIs with extended temperature exposure.

IC Role / Device Role / Timing Role: Primary system memory buffer interfacing with ARM Cortex-A series MPU via 8-bit DDR3L bus.

Use Value: −40°C to +95°C rating ensures reliable boot and operation without thermal throttling; DDR3L-2133 bandwidth sustains dual-display video buffering.

Use Scenario: Packet buffering and forwarding table storage in compact Layer 3 edge routers deployed in uncontrolled environments.

IC Role / Device Role / Timing Role: High-throughput packet memory supporting simultaneous ingress/egress queues and lookup tables.

Use Value: Dynamic ODT and write leveling maintain signal integrity at 1066 MHz clock under variable load; PASR lowers idle power in low-traffic periods.

Medical Imaging ModuleAutomated Test Equipment (ATE)

Use Scenario: Frame capture and real-time image processing in portable ultrasound or endoscopy units requiring certified reliability.

IC Role / Device Role / Timing Role: Frame buffer memory for FPGA-accelerated image pipeline with strict timing closure requirements.

Use Value: MPR-based calibration enables production-line timing margin validation; ASR eliminates refresh management overhead during long diagnostic runs.

Use Scenario: High-speed digital pattern memory in PXI-based ATE systems performing parallel device testing at 200+ MHz data rates.

IC Role / Device Role / Timing Role: Pattern storage and playback engine synchronized to precision clock generator and DUT interface.

Use Value: BL8 burst mode delivers deterministic 8-word transfers; ZQ calibration ensures repeatable impedance matching across test head temperature swings.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR3L SDRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MT41K128M8RH-125:E1 Gbit DDR3L, VFBGA-78, DDR3L-1600 (11-11-11), CL=11, tCK = 1.25 ns; rated −40°C to +95°CLower speed bin limits max bandwidth to 12.8 GB/s; lacks support for DDR3L-2133 timing and CWL=10Select when design targets 800 MHz clock domain and prioritizes Micron's long-term supply assurance over peak bandwidth.
IS43TR16128B-125KBL2 Gbit DDR3L, FBGA-96, DDR3L-1600, CL=11, 16-bit bus; −40°C to +95°C industrial gradeDoubles density but requires 16-bit interface redesign and larger footprint; no DDR3L-2133 supportChoose for higher capacity needs where board space allows 96-ball layout and controller supports x16 data width.

Compared with MT41K128M8RH-125:E and IS43TR16128B-125KBL, W631GU8NB09I delivers 33% higher peak bandwidth (17.06 vs. 12.8 GB/s) and supports tighter 14-14-14 timing at 1066 MHz, making it optimal for bandwidth-constrained industrial controllers where VFBGA-78 footprint and DDR3L-2133 compliance are mandatory.

Availability

W631GU8NB09I is available at Aetrix Electronics and suitable for industrial HMI controllers, network edge routers, medical imaging modules, automated test equipment, and embedded vision systems requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for W631GU8NB09I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including NOR/NAND Flash, SRAM, and DRAM products for industrial, automotive, and communications markets.

The W631GU8NB series belongs to Winbond's industrial-grade DDR3L SDRAM product line, designed specifically for embedded systems demanding extended temperature operation, JEDEC-compliant timing robustness, and system-level calibration features like write leveling and MPR.

FAQ

What is the maximum clock frequency supported by W631GU8NB09I?

W631GU8NB09I supports DDR3L-2133 operation with a maximum clock frequency (fCK) of 1066 MHz. This corresponds to a minimum clock period (tCK) of 0.938 ns at CL=14/CWL=10. The device achieves this speed while maintaining full JEDEC AC/DC specifications across its industrial temperature range of −40°C to +95°C.

Does W631GU8NB09I require external termination resistors?

No, W631GU8NB09I integrates programmable on-die termination (ODT) for DQ, DQS/DQS#, and DM signals. It supports static Rtt_NOM and dynamic Rtt_WR modes, calibrated via internal ZQ circuitry referencing an external 240 Ω resistor. No external parallel termination is needed on the data/strobe lines.

How does W631GU8NB09I handle refresh at elevated temperatures?

At case temperatures above 85°C, W631GU8NB09I doubles its auto-refresh frequency (tREFI = 3.9 µS instead of 7.8 µS). This is managed automatically via Auto Self Refresh (ASR) mode when enabled (MR2[7]=1), or manually via Self Refresh entry with Extended Temperature Range capability (MR2[6]=0, MR2[7]=1).

Can W631GU8NB09I operate at 1.5V supply voltage?

Yes, W631GU8NB09I is backward compatible with standard DDR3 1.5V operation (VDD/VDDQ = 1.5V ± 0.075V). However, it must be configured for DDR3 mode via mode registers, and performance is limited to DDR3-1333/1600 speed grades - DDR3L-2133 timing is not guaranteed at 1.5V.

What is the purpose of the Multi-Purpose Register (MPR) in W631GU8NB09I?

The MPR in W631GU8NB09I outputs a fixed 128-bit calibration pattern upon read command, enabling system-level timing margin analysis and write leveling setup without accessing user memory. It is essential for validating DQ-DQS alignment and establishing reliable eye diagrams during high-speed DDR3L-2133 initialization.

W631GU8NB09I Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
78-VFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM - DDR3L
Memory Size:
1Gbit
Memory Organization:
128M x 8
Memory Interface:
Parallel
Clock Frequency:
1.066 GHz
Write Cycle Time - Word, Page:
15ns
Access Time:
20 ns
Voltage - Supply:
1.283V ~ 1.45V, 1.425V ~ 1.575V
Operating Temperature:
-40°C ~ 95°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
78-VFBGA (8x10.5)

W631GU8NB09I FAQ

1.How can I place an order for W631GU8NB09I through Aetrix?

Please submit a Request for Quotation (RFQ) for W631GU8NB09I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W631GU8NB09I reliable?

The price and inventory of W631GU8NB09I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W631GU8NB09I is usually 5 days.

3.What payment methods are accepted for W631GU8NB09I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W631GU8NB09I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W631GU8NB09I?

W631GU8NB09I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W631GU8NB09I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W631GU8NB09I?

For technical support, including W631GU8NB09I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W631GU8NB09I requirements.

6.How does Aetrix verify that W631GU8NB09I is sourced from the original manufacturer or authorized distributors?

All W631GU8NB09I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W631GU8NB09I meets industry standards.

7.What is the process for return or replacement of W631GU8NB09I?

All W631GU8NB09I units undergo pre-shipment inspection (PSI). If there is an issue with W631GU8NB09I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W631GU8NB09I part is unused and in its original packaging.

Return procedure for W631GU8NB09I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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