Winbond Electronics Corporation W632GG6KB-12 TR

Overview

W632GG6KB-12 TR from Winbond is a 2Gb (16M × 8 banks × 16-bit) DDR3 SDRAM compliant with JEDEC DDR3-1600 (11-11-11) timing, operating at 800 MHz clock frequency with CL=11, CWL=7, and tCK(AVG) = 1.875–2.5 ns. It features eight internal banks, 8-bit prefetch, programmable ODT, ZQ calibration, and asynchronous RESET# for embedded and industrial memory subsystems.

For engineers reviewing the W632GG6KB-12 TR datasheet, W632GG6KB-12 TR pinout, W632GG6KB-12 TR application, or W632GG6KB-12 TR equivalent, this page delivers verified DDR3-1600 timing parameters, ball-mapped I/O roles, SSTL_15 interface compliance, industrial-grade thermal support (0°C to 95°C), and validated alternatives for memory subsystem design and BOM continuity.

Technical Context

This DDR3 SDRAM implements a source-synchronous interface with differential CK/CK# and DQS/DQS# pairs, where inputs are latched at the crossing of CK rising and CK# falling edges, and data strobes are edge-aligned on reads and center-aligned on writes. DLL alignment ensures precise DQ–DQS–CK timing coordination across process, voltage, and temperature.

It supports programmable CAS Latency (CL = 6, 7, 8, 9, 10, 11), CAS Write Latency (CWL = 5–8), additive latency (AL = 0, CL−1, CL−2), and dynamic ODT (Rtt_WR) with configurable termination impedances (60 Ω, 120 Ω, 40 Ω). Refresh modes include Auto Refresh, Self-Refresh, Auto Self-Refresh (ASR), and Partial Array Self-Refresh (PASR).

Key Specifications

Pinout & Package

W632GG6KB-12 TR uses a 96-ball WBGA package (9 mm × 13 mm) with ball pitch of 0.8 mm, optimized for high-density PCB layouts and thermal performance in memory modules and SoC interfaces.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR3 SDRAM applications.

Compared with MT41K128M16HA-125:E and IS43TR16256B-125KBL, W632GG6KB-12 TR uniquely combines industrial 95°C operation, ASR, PASR, and full JEDEC DDR3-1600 compliance in a single WBGA-96 footprint-making it optimal for thermally constrained, long-lifecycle embedded designs requiring memory subsystem continuity.

Availability

W632GG6KB-12 TR is available at Aetrix Electronics and suitable for industrial HMI controllers, network edge routers, medical imaging subsystems, and automotive ADAS domain controllers requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for W632GG6KB-12 TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, RAM, and trusted firmware storage ICs for industrial, automotive, and computing markets.

W632GG6KB-12 TR belongs to Winbond's DDR3 SDRAM product line, engineered for high-reliability embedded systems demanding extended temperature operation, low-power self-refresh, and JEDEC-compliant timing stability across voltage and process variation.

FAQ

What is the maximum clock frequency supported by W632GG6KB-12 TR?

W632GG6KB-12 TR supports a maximum clock frequency of 800 MHz, corresponding to DDR3-1600 data rates (1600 Mb/s per pin). This is validated under JEDEC-specified conditions with CL=11, CWL=7, and tRCD/tRP/tRC = 11-11-11. The device achieves this timing with tCK(AVG) between 1.875 ns and 2.5 ns, and operates reliably across 0°C to 95°C case temperature.

Does W632GG6KB-12 TR support industrial temperature range?

Yes, W632GG6KB-12 TR is rated for 0°C ≤ TCASE ≤ 95°C, meeting extended commercial temperature requirements common in industrial HMI, networking, and automotive ADAS applications. While not qualified to −40°C like the 12I variant, its 95°C upper limit-combined with Auto Self-Refresh (ASR) and robust power-down modes-enables continuous operation in thermally demanding enclosures without derating.

How does the ZQ calibration function work on W632GG6KB-12 TR?

W632GG6KB-12 TR performs ZQ calibration by referencing an external 240 Ω ±1 % resistor connected to the ZQ pin. During calibration, the device adjusts its internal output driver and ODT impedances to match this reference, ensuring ±1 % accuracy across voltage and temperature. Calibration is initiated via ZQCL command and can be repeated periodically or after major voltage/temperature shifts to maintain signal integrity.

What is the role of the RESET# pin on W632GG6KB-12 TR?

The RESET# pin on W632GG6KB-12 TR provides asynchronous reset functionality essential for power-up initialization and system recovery. When asserted LOW, it forces the SDRAM into a known state, clears internal registers, and initiates the power-on sequence-including DLL locking and mode register loading-without requiring stable clocks. This ensures deterministic startup behavior in embedded systems with variable power ramp profiles.

Can W632GG6KB-12 TR operate with DDR3L (1.35 V) supplies?

No, W632GG6KB-12 TR requires VDD/VDDQ = 1.5 V ± 0.075 V and is not compatible with DDR3L's 1.35 V supply specification. Its I/O interface is SSTL_15-compliant, and operation outside the 1.425–1.575 V range may cause timing violations, data corruption, or failure to initialize. For DDR3L designs, consider Winbond's W632GG6KB-125 variant or alternate DDR3L-qualified parts.