Winbond Electronics Corporation W632GG6KB-15

Overview

W632GG6KB-15 from Winbond is a 2Gb (16M × 8 banks × 16-bit) DDR3 SDRAM operating at DDR3-1333 speed (667 MHz clock, 9-9-9 timing), with 1.5V VDD/VDDQ supply, SSTL_15 interface, and WBGA-96 (9×13 mm²) package. It supports CAS Latency 6/7/8/9/10, programmable CWL, on-die termination (ODT), ZQ calibration, and asynchronous RESET# for embedded computing, industrial controllers, and network infrastructure memory subsystems.

For engineers reviewing the W632GG6KB-15 datasheet, W632GG6KB-15 pinout, W632GG6KB-15 application, or W632GG6KB-15 equivalent, key selection considerations include its DDR3-1333 speed bin, -40°C to +95°C industrial temperature support (via 15I variant), 96-ball WBGA layout, ODT configuration flexibility, and compatibility with JEDEC-standard DDR3 controllers requiring tRC = 49.5 ns, tRAS = 36 ns, and tREFI = 7.8 µs at 0–85°C.

Technical Context

This DDR3 SDRAM implements an 8-bit prefetch architecture with eight internal banks, enabling concurrent bank activation and interleaved burst access. It uses differential CK/CK# inputs synchronized at their crossing point and source-synchronous DQS/DQS# strobes aligned edge-to-read-data and center-to-write-data.

Timing control relies on programmable mode registers (MR0–MR3) for CAS Latency, additive latency (AL = 0/CL−1/CL−2), CWL, PASR, ASR, and dynamic ODT (Rtt_WR). The device supports write leveling, MPR-based calibration, and ZQ calibration using an external 240 Ω resistor to ground for output driver and ODT impedance tuning.

Key Specifications

Pinout & Package

W632GG6KB-15 is packaged in a 96-ball Wafer-Level Ball Grid Array (WBGA), 9 mm × 13 mm footprint, with 0.8 mm ball pitch and RoHS-compliant lead-free finish. Ball assignment follows JEDEC-standard DDR3 layout with dedicated VDD, VDDQ, VSS, VSSQ, VREFCA, VREFDQ, ZQ, and RESET# terminals.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR3 SDRAM applications.

Compared with W632GG6KB-15, the Micron MT41K256M16HA-125:E requires voltage redesign and sacrifices 95°C operation, while ISSI's IS43TR16256B-15KBL offers identical voltage, temp, timing, and pinout - making it the only validated pin-compatible alternative for industrial thermal environments.

Availability

W632GG6KB-15 is available at Aetrix Electronics and suitable for industrial automation, network infrastructure, and medical imaging systems requiring stable component supply, long-term lifecycle assurance, and guaranteed -40°C to +95°C performance.

Supply support for W632GG6KB-15 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including NOR/NAND Flash, RAM, and trusted firmware storage.

The W632GG6KB series belongs to Winbond's industrial-grade DDR3 SDRAM product line, designed specifically for applications demanding extended temperature operation, JEDEC-compliant reliability, and robust signal integrity in space-constrained embedded platforms.

FAQ

What is the maximum clock frequency supported by the W632GG6KB-15?

The W632GG6KB-15 supports a maximum clock frequency (fCK) of 667 MHz, corresponding to DDR3-1333 data rate (1333 Mb/s per pin). This is confirmed in the datasheet's KEY PARAMETERS table, where fCKMAX = 667 MHz for the -15 speed grade. The device achieves this with CL=9, tAA=13.5 ns, and tRCD/tRP=13.5 ns minimum values under 0–85°C conditions. Operation above 667 MHz violates JEDEC timing and is not guaranteed.

Does the W632GG6KB-15 support industrial temperature range?

Yes, the W632GG6KB-15 is rated for 0°C ≤ TCASE ≤ 95°C and maintains full JEDEC AC/DC specifications across this range. For operation down to -40°C, the pin-compatible W632GG6KB15I variant must be used - the -15 suffix denotes commercial temperature grade, while 15I explicitly guarantees -40°C to +95°C. Both share identical electrical specs and timing, but only 15I is qualified for sub-zero environments.

How is on-die termination (ODT) configured on the W632GG6KB-15?

ODT on the W632GG6KB-15 is controlled via the ODT pin (ball K1) and mode registers MR1/MR2. Static ODT values (RTT_NOM = 75/150/∞ Ω, RTT_WR = 75/150/∞ Ω) are set in MR1 bits A9–A7 and MR2 bits A2–A0. Dynamic ODT (Rtt_WR) is enabled by setting MR2 A2–A0 = 010 and asserting ODT HIGH during write bursts. The ZQ pin (ball E2) connects to a 240 Ω ±1% resistor for factory-calibrated impedance matching.

What package type and ball count does the W632GG6KB-15 use?

The W632GG6KB-15 uses a 96-ball Wafer-Level Ball Grid Array (WBGA) package measuring 9 mm × 13 mm with 0.8 mm ball pitch. This is explicitly stated in Section 2 ("FEATURES") and confirmed in Section 11 ("PACKAGE SPECIFICATION"). The ball map (Section 5) and terminal descriptions (Section 6) validate all 96 positions, including dedicated VDD/VDDQ/VSS/VSSQ rails, differential clocks (CK/CK#), and calibration pins (ZQ, VREFCA, VREFDQ).

Can the W632GG6KB-15 operate with CAS Latency 7 or 9?

Yes, the W632GG6KB-15 supports CAS Latency settings of 6, 7, 8, 9, and 10 as specified in Section 2 ("FEATURES") and Table 4 ("KEY PARAMETERS"). CL=7 and CL=9 are explicitly listed under "Supported CL Settings" for the -15 speed grade. When using CL=7 or CL=9, tAA/tRCD/tRP minimums remain at 13.5 ns per JEDEC DDR3-1333 specification, and SPD byte programming must reflect these values to ensure controller compatibility.