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Winbond Electronics Corporation W632GG6KB15I
- Part No.:
- W632GG6KB15I
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 96-TFBGA
- Datasheet:
-
W632GG6KB15I.pdf
- Description:
- IC DRAM 2GBIT PAR 96WBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,070
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Product details
Overview
W632GG6KB15I from Winbond is a 2 Gb (16M × 8 banks × 16-bit) DDR3 SDRAM operating at DDR3-1333 speed (667 MHz clock, 9-9-9 timing), rated for industrial temperature (−40°C to +95°C), with 1.5 V VDD/VDDQ supply, SSTL_15 interface, and 96-ball WBGA (9 × 13 mm²) package. It serves as main system memory in embedded controllers, networking edge devices, and industrial HMIs requiring reliable, JEDEC-compliant DDR3 operation under extended thermal stress.
For engineers reviewing the W632GG6KB15I datasheet, W632GG6KB15I pinout, W632GG6KB15I application, or W632GG6KB15I equivalent, this page delivers verified DDR3 timing parameters, ball-level I/O mapping, ODT and ZQ calibration behavior, industrial-grade power-down modes, and validated alternative parts - all specific to the -15I speed grade and its guaranteed −40°C to +95°C operation.
Technical Context
This device implements an 8-bank, 8-bit prefetch DDR3 architecture with synchronous differential clocking (CK/CK#), bi-directional DQS/DQS# strobes, and programmable CAS Latency (CL = 6, 7, 8, 9, 10), CAS Write Latency (CWL = 5–7), and Additive Latency (AL = 0, CL−1, CL−2). It supports posted CAS, auto-precharge, burst lengths of 8 (BL8) or 4 (BC4), and interleaved/nibble-sequential read ordering.
Key operational features include asynchronous RESET#, on-die termination (ODT) with static and dynamic modes (Rtt_WR), ZQ calibration using external 240 Ω resistor, Multi-Purpose Register (MPR) for timing calibration pattern readout, and system-level calibration support via write leveling. Power management includes Precharge Power Down, Active Power Down, Self-Refresh, Auto Self-Refresh (ASR), and Partial Array Self-Refresh (PASR).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gb (16,777,216 words × 8 banks × 16 bits), enabling 256 MB of 16-bit wide memory space |
| Data Rate / Speed Grade | DDR3-1333 (1333 Mb/s per pin), 667 MHz clock frequency, 9-9-9 timing (tRCD/tRP/tRAS = 9 ns @ 667 MHz) |
| Operating Temperature | −40°C ≤ TCASE ≤ 95°C, qualified for industrial environments with mandatory ASR or Manual Self-Refresh above 85°C |
| Supply Voltages | VDD = VDDQ = 1.5 V ± 0.075 V; VREFCA and VREFDQ required for stable command/address and data reference |
| Interface Standard | SSTL_15 I/O standard with differential CK/CK# and DQS/DQS#; supports 34 Ω output driver impedance calibrated via ZQ |
| Power Consumption | IDD6 (Self-Refresh) = 19 mA max; IDD0 (Active, one bank) = 100 mA max; supports low-power modes including Precharge Power Down |
| Refresh Interval | tREFI = 7.8 µs at 0–85°C; reduced to 3.9 µs at 85–95°C, requiring ASR enable (MR2[7:6] = 10b) or Manual Self-Refresh mode |
Pinout & Package
W632GG6KB15I is packaged in a lead-free, RoHS-compliant 96-ball WBGA (9 mm × 13 mm, 0.8 mm pitch) with 1.0 mm body height. Ball assignment follows JEDEC-standard DDR3 layout optimized for signal integrity and routing density.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input | Commands latched at crosspoint; defines all timing windows; requires matched trace length and controlled impedance (100 Ω diff) |
| CKE | Clock enable | Asynchronous entry/exit from Self-Refresh; controls internal clock gating and input buffer enable during Power Down |
| CS# | Chip select | Active-low command qualifier; enables decoding of RAS#/CAS#/WE# when asserted; supports multi-rank systems |
| RAS# / CAS# / WE# | Command inputs | Define ACT, READ, WRITE, PRE, REF, MRS commands; sampled synchronously with CK rising edge |
| A0–A13 / BA0–BA2 | Address & bank inputs | A10/AP used for auto-precharge or partial array refresh; A12/BC# selects burst chop; BA0–BA2 select one of eight banks |
| DQ0–DQ15 / DQU0–DQU7 / DQL0–DQL7 | Data I/O | 16-bit bidirectional data bus split into upper/lower bytes; DQSU/DQSU# and DQSL/DQSL# are corresponding strobes |
| DMU / DML | Data mask | Byte-level write masking: DMU masks upper 8 bits (DQU), DML masks lower 8 bits (DQL); sampled with DQS edges |
| ODT | On-die termination control | Registered input enabling dynamic or static termination on DQ/DQS/DM lines; supports Rtt_Nom = 60/120/40 Ω per MR1 |
| ZQ | ZQ calibration reference | Connects to 240 Ω ±1 % external resistor to ground; calibrates output driver and ODT impedances every ~128 ms or after exit from Self-Refresh |
| RESET# | Asynchronous reset | Forces initialization sequence on power-up or system recovery; must be held low ≥ 200 µs before stable VDD/VDDQ and VREF |
| VREFCA / VREFDQ | Reference voltage inputs | VREFCA = 0.5 × VDD for CA inputs; VREFDQ = 0.5 × VDDQ for DQ inputs; must remain stable during all operations including Self-Refresh |
Key Features
| Feature | Design Value |
|---|---|
| Programmable CAS Write Latency (CWL) | CWL = 5, 6, or 7 nCK, dynamically set per frequency to align write data capture window with DQS edge |
| Dynamic On-Die Termination (Rtt_WR) | Enables ODT only during write bursts on DQ/DQS/DM lines, reducing standby power and improving write signal integrity |
| ZQ Calibration | Uses external 240 Ω resistor to calibrate 34 Ω output drivers and ODT impedances across voltage/temperature, meeting JEDEC DDR3 spec |
| Multi-Purpose Register (MPR) | Reads fixed calibration bit pattern (0x00000000) via READ command to verify DQS-to-DQ alignment and system timing margin |
| Write Leveling Support | Allows controller to adjust DQS launch delay relative to CK to compensate for board skew; uses MPR read and ODT-controlled DQ feedback |
| Industrial Temperature Operation | Guaranteed −40°C to +95°C operation with full AC/DC specs, enabled by MR2[7:6] configuration for ASR or Manual Self-Refresh above 85°C |
Applications
| Industrial HMI Systems | Network Edge Routers |
|---|---|
|
Use Scenario: Touch-enabled operator panels in factory automation with real-time UI rendering and local data logging. IC Role / Device Role / Timing Role: Primary working memory for ARM Cortex-A series SoC, buffering display frame buffers, firmware execution, and protocol stack buffers. Use Value: The W632GG6KB15I's −40°C to +95°C rating and ASR support ensure uninterrupted memory operation during ambient thermal cycling, while DDR3-1333 bandwidth meets 60 fps GUI refresh requirements. |
Use Scenario: Layer 3 packet forwarding in compact enterprise switches with integrated CPU and traffic analytics. IC Role / Device Role / Timing Role: System memory for MIPS or ARM-based network processors handling concurrent routing tables, ACL lookups, and packet buffering. Use Value: W632GG6KB15I's 16-bit bus width and low IDD6 (19 mA) reduce PCB layer count and thermal load, while ZQ calibration maintains signal integrity across variable line-card temperatures. |
| Medical Diagnostic Terminals | Smart Energy Gateways |
|
Use Scenario: Portable ultrasound or ECG terminals requiring deterministic boot, secure firmware update, and real-time waveform processing. IC Role / Device Role / Timing Role: Main memory for safety-certified microcontrollers or FPGA-based processing engines performing FFT and digital filtering. Use Value: Asynchronous RESET# and guaranteed tREFI = 3.9 µS at 95°C allow safe memory initialization and refresh under battery-backed brown-out conditions without data loss. |
Use Scenario: DIN-rail mounted smart meters aggregating AMI data, running Linux RTOS, and supporting encrypted OTA updates. IC Role / Device Role / Timing Role: Boot and runtime memory for dual-core ARM Cortex-A7 SoCs executing metering firmware, TLS stacks, and local web servers. Use Value: W632GG6KB15I's SSTL_15 interface and 96-ball WBGA footprint simplify layout in space-constrained enclosures, while PASR reduces self-refresh current during idle periods to extend backup battery life. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR3 SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS43TR16256B-15KBLI | Same density (2 Gb), DDR3-1333, −40°C to +95°C, 96-ball FBGA (9 × 13 mm), but uses 1.35 V DDR3L-compatible supply (1.28–1.45 V) | Lower VDD/VDDQ range reduces power by ~12 % at same frequency; not drop-in compatible due to different VDD tolerance and SPD programming | Select if system already uses DDR3L infrastructure and requires lower static power; verify VREFCA/VREFDQ generation and SPD byte compatibility |
| MT41K256M16HA-125:E | 2 Gb DDR3L, −40°C to +95°C, 96-ball FBGA, supports DDR3L-1600 (800 MHz), but only rated to 125 °C case temp (not 95 °C) | Higher speed bin allows future-proofing; tighter tRC/tRAS specs improve refresh efficiency; requires updated controller timing tables | Choose for new designs targeting higher bandwidth headroom or where JEDEC DDR3L compliance is mandated; not a direct replacement for W632GG6KB15I's DDR3-1333 timing |
Compared with IS43TR16256B-15KBLI and MT41K256M16HA-125:E, the W632GG6KB15I offers strict DDR3 (not DDR3L) 1.5 V operation, proven industrial thermal reliability at 95°C with ASR, and simplified power delivery - making it optimal for cost-sensitive, thermally stable embedded platforms where DDR3L migration is unnecessary.
Availability
W632GG6KB15I is available at Aetrix Electronics and suitable for industrial HMIs, network edge routers, medical diagnostic terminals, and smart energy gateways requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for W632GG6KB15I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and DRAM products for industrial, automotive, and communications markets.
The W632GG6KB series belongs to Winbond's industrial-grade DDR3 SDRAM product line, designed specifically for embedded systems demanding robust thermal performance, JEDEC compliance, and long-term supply stability in harsh operating environments.
FAQ
What is the maximum clock frequency supported by W632GG6KB15I?
The W632GG6KB15I is rated for DDR3-1333 operation, supporting a maximum clock frequency of 667 MHz (tCK = 1.5 ns nominal). Its AC specifications guarantee stable operation up to this rate under industrial temperature conditions (−40°C to +95°C), with tRCD/tRP/tRAS = 9 ns minimum. It does not support DDR3-1600 or DDR3-1866 speeds - those require the -12I or -11 variants of the W632GG6KB family.
Does W632GG6KB15I support automatic refresh at 95°C case temperature?
Yes, W632GG6KB15I supports automatic refresh at 95°C case temperature, but requires either Auto Self-Refresh (ASR) mode (MR2[7:6] = 10b) or Manual Self-Refresh mode (MR2[7:6] = 01b) to halve the refresh interval from 7.8 µs to 3.9 µs. This ensures tREFI compliance per JEDEC JESD79-3F at elevated temperature, preventing data retention failure.
What is the function of the ZQ pin on W632GG6KB15I?
The ZQ pin on W632GG6KB15I connects to a 240 Ω ±1 % external resistor to ground and enables on-die calibration of both output driver impedance (34 Ω target) and on-die termination (ODT) values. Calibration occurs automatically after power-up, exit from Self-Refresh, and approximately every 128 ms during normal operation to maintain signal integrity across voltage and temperature variations.
Can W632GG6KB15I operate with VDD and VDDQ supplied at 1.35 V?
No, W632GG6KB15I is a standard DDR3 (not DDR3L) device and requires VDD and VDDQ = 1.5 V ± 0.075 V (1.425 V to 1.575 V). Supplying 1.35 V violates its DC operating conditions and will result in undefined behavior, failed initialization, or intermittent data corruption. For 1.35 V operation, a DDR3L-compatible part such as IS43TR16256B-15KBLI must be used instead.
How is the RESET# pin used during power-up initialization of W632GG6KB15I?
The RESET# pin on W632GG6KB15I must be held LOW for ≥200 µs after VDD, VDDQ, and VREF voltages reach regulation and stability. This initiates the power-up initialization sequence, which includes internal DLL locking, ZQ calibration, and mode register loading. RESET# is asynchronous and remains active throughout initialization - releasing it before timing completion may cause incomplete configuration or bus contention.
W632GG6KB15I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 96-TFBGA
- Packaging:
- Tray
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - DDR3
- Memory Size:
- 2Gbit
- Memory Organization:
- 128M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 667 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 20 ns
- Voltage - Supply:
- 1.425V ~ 1.575V
- Operating Temperature:
- -40°C ~ 95°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 96-WBGA (9x13)
W632GG6KB15I FAQ
1.How can I place an order for W632GG6KB15I through Aetrix?
Please submit a Request for Quotation (RFQ) for W632GG6KB15I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W632GG6KB15I reliable?
The price and inventory of W632GG6KB15I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W632GG6KB15I is usually 5 days.
3.What payment methods are accepted for W632GG6KB15I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W632GG6KB15I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W632GG6KB15I?
W632GG6KB15I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W632GG6KB15I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W632GG6KB15I?
For technical support, including W632GG6KB15I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W632GG6KB15I requirements.
6.How does Aetrix verify that W632GG6KB15I is sourced from the original manufacturer or authorized distributors?
All W632GG6KB15I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W632GG6KB15I meets industry standards.
7.What is the process for return or replacement of W632GG6KB15I?
All W632GG6KB15I units undergo pre-shipment inspection (PSI). If there is an issue with W632GG6KB15I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W632GG6KB15I part is unused and in its original packaging.
Return procedure for W632GG6KB15I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W632GG6KB15I Tags
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M24C02-WMN6TP
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