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Winbond Electronics Corporation W632GG6KB15I TR
- Part No.:
- W632GG6KB15I TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 96-TFBGA
- Datasheet:
-
W632GG6KB15I TR.pdf
- Description:
- IC DRAM 2GBIT PAR 96WBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,232
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Product details
Overview
W632GG6KB15I TR from Winbond is a 2Gb (16M × 8 banks × 16-bit) DDR3 SDRAM supporting DDR3-1333 speed grade (9-9-9 timing), 1.5V VDD/VDDQ supply, industrial temperature range (–40°C to +95°C), and SSTL_15 interface - deployed in embedded controllers, network edge devices, and industrial HMIs requiring reliable memory with extended thermal operation.
For engineers reviewing the W632GG6KB15I TR datasheet, W632GG6KB15I TR pinout, W632GG6KB15I TR application, or W632GG6KB15I TR equivalent, this page delivers verified DDR3 timing parameters, ball-mapped I/O roles, ODT and ZQ calibration behavior, industrial-grade power-down modes, and JEDEC-compliant burst/refresh sequences - all specific to the -15I speed bin and WBGA-96 package.
Technical Context
This DDR3 SDRAM implements eight internal banks, 8-bit prefetch architecture, and source-synchronous DQS/DQS# strobes aligned to CK/CK# differential clocks. It supports programmable CAS Latency (CL = 6, 7, 8, 9, 10), CAS Write Latency (CWL = 5–7), additive latency (AL = 0, CL−1, CL−2), and posted CAS for command bus efficiency.
Key operational features include asynchronous RESET#, on-die termination (ODT) with dynamic Rtt_WR support, ZQ calibration using external 240Ω resistor, multi-purpose register (MPR) for system-level timing calibration, and dual power-down modes (precharged and active) with self-refresh current of 19 mA at 0–85°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gb (16M words × 8 banks × 16 bits), enabling 256 MB of 16-bit wide memory space |
| Data Rate | DDR3-1333 (667 MHz clock, 1333 MT/s per pin), validated for industrial temp (–40°C to +95°C) |
| Timing (CL-nRCD-nRP) | 9-9-9, defining tAA/tRCD/tRP min = 13.5 ns at 667 MHz for stable read/write setup |
| Supply Voltage | VDD/VDDQ = 1.5 V ± 0.075 V, requiring tight regulation for signal integrity and ODT impedance stability |
| Package | WBGA-96 (9 mm × 13 mm, 0.8 mm pitch), RoHS-compliant, lead-free, with defined ball map per JEDEC MO-270AB |
| Refresh Interval | tREFI = 7.8 µs at 0–85°C; 3.9 µs at 85–95°C (requires ASR or manual self-refresh mode activation) |
| Self-Refresh Current | IDD6 = 19 mA max, critical for low-power standby in battery-backed or fanless industrial systems |
Pinout & Package
W632GG6KB15I TR uses a 96-ball WBGA package (9 mm × 13 mm, 0.8 mm pitch) with SSTL_15-compatible I/Os, exposed die pad not present, and RoHS-compliant lead-free finish. Ball assignment follows JEDEC-standard DDR3 layout with dedicated VDDQ/VSSQ planes for I/O noise isolation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential Clock Input | Latches all address/control inputs at crossing point; defines timing reference for all operations |
| CKE | Clock Enable | Asynchronous control for power-down entry/exit and self-refresh activation; must remain HIGH during reads/writes |
| CS# | Chip Select | Active-low enable for command decoding; enables rank-level selection in multi-DRAM systems |
| ODT | On-Die Termination Control | Registered input enabling programmable termination on DQ/DQS/DM lines; supports dynamic Rtt_WR during writes |
| RESET# | Asynchronous Reset | Initiates power-up initialization sequence and clears internal state; required before first command |
| ZQ | ZQ Calibration Reference | Connects to external 240Ω ±1% resistor to ground for output driver and ODT impedance calibration |
| VREFCA / VREFDQ | Reference Voltage Inputs | Provide mid-supply reference for command/address and data input receivers; must be stable before CKE assertion |
Key Features
| Feature | Design Value |
|---|---|
| Programmable CAS Write Latency (CWL) | CWL = 5–7 selectable per frequency; enables precise write timing alignment with DQS edge in DDR3-1333 systems |
| Dynamic ODT (Rtt_WR) | Termination applied only during write bursts on DQ/DQS lines, reducing stub reflections and improving write eye margin |
| ZQ Calibration | One-time or periodic calibration using external 240Ω resistor ensures ±10% output driver and ODT impedance accuracy over voltage/temperature |
| Multi-Purpose Register (MPR) | Predefined 128-bit pattern readout supports system-level timing calibration (e.g., write leveling) without disturbing DRAM data arrays |
| Industrial Temperature Support | Guaranteed operation from –40°C to +95°C with full AC/DC specs and mandatory ASR or manual self-refresh above 85°C |
Applications
| Industrial HMI Controllers | Network Edge Routers |
|---|---|
Use Scenario: Fanless human-machine interface panel with ARM-based SoC running Linux GUI stack and real-time PLC logic. IC Role / Device Role / Timing Role: Primary system memory providing 16-bit wide DDR3-1333 bandwidth for frame buffer, OS kernel, and application code execution. Use Value: Industrial temperature rating (–40°C to +95°C) and 19 mA self-refresh current ensure uninterrupted operation in uncontrolled cabinet environments. |
Use Scenario: Layer-3 edge router handling packet buffering, ACL table storage, and firmware updates in telecom access networks. IC Role / Device Role / Timing Role: Packet buffer memory interfacing with network processor via 16-bit DDR3 bus; supports burst reads/writes for header processing and queue management. Use Value: Dynamic ODT and write leveling reduce signal integrity risk across 4-layer PCB traces, enabling reliable 1333 MT/s operation at board edge. |
| Medical Diagnostic Terminals | Smart Energy Gateways |
Use Scenario: Portable ultrasound imaging terminal requiring deterministic memory access for real-time image reconstruction and DICOM export. IC Role / Device Role / Timing Role: Low-latency memory subsystem supporting burst transfers between FPGA-accelerated DSP engine and ARM application processor. Use Value: 9-9-9 timing and programmable AL/CWL allow fine-grained tuning of read/write turnaround to meet sub-100 ns jitter budgets. |
Use Scenario: DIN-rail mounted smart meter gateway aggregating AMI data, running TLS stacks, and storing firmware patches locally. IC Role / Device Role / Timing Role: Non-volatile configuration and firmware cache memory operating in extended temperature cycles with frequent power cycling. Use Value: Asynchronous RESET# and robust power-up initialization ensure deterministic boot after brownout recovery without external sequencer dependency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR3 SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT41K256M16HA-125:A | 2Gb DDR3L (1.35V), -125 speed grade (DDR3L-1600), 96-ball FBGA, supports 0–95°C but not rated for full spec at –40°C | Lower VDDQ reduces power by ~15%, but requires separate 1.35V rail and lacks guaranteed –40°C AC timing | Select if system uses DDR3L infrastructure and operates above –20°C; avoid for true industrial cold-start scenarios. |
| IS43TR16256B-15HBL | 2Gb DDR3, DDR3-1333 (-15H), 96-ball WBGA, industrial temp (–40°C to +95°C), same 1.5V supply and 9-9-9 timing | Identical speed bin and temperature range; differs in ZQ pin location (J1 vs K1) and MPR pattern definition | Drop-in replacement only after verifying PCB ball mapping and recalibrating ZQ/MPR sequences; requires layout review for VREFDQ routing. |
Compared with MT41K256M16HA-125:A and IS43TR16256B-15HBL, W632GG6KB15I TR provides guaranteed –40°C AC timing compliance with minimal board-level changes, while offering identical DDR3-1333 performance and industrial thermal margin - making it optimal for legacy 1.5V DDR3 designs requiring long-term availability and cold-temperature validation.
Availability
W632GG6KB15I TR is available at Aetrix Electronics and suitable for industrial HMIs, network edge routers, medical diagnostic terminals, and smart energy gateways requiring stable component supply across extended temperature ranges and multi-year production cycles.
Supply support for W632GG6KB15I TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, PSRAM, and DDR SDRAM for industrial, automotive, and networking markets.
W632GG6KB15I TR belongs to Winbond's industrial-grade DDR3 SDRAM product line, designed specifically for applications demanding guaranteed AC/DC performance across –40°C to +95°C with JEDEC-compliant power management and signal integrity features.
FAQ
What is the maximum operating frequency supported by W632GG6KB15I TR?
W632GG6KB15I TR supports DDR3-1333 operation with a maximum clock frequency of 667 MHz (1333 MT/s data rate). Its speed bin is defined as -15I, meaning it meets all JEDEC DDR3-1333 (9-9-9) AC and DC specifications across the full industrial temperature range of –40°C to +95°C. The device does not support higher-speed bins like DDR3-1600 or DDR3-1866.
Does W632GG6KB15I TR require an external resistor for ZQ calibration?
Yes, W632GG6KB15I TR requires a precision 240Ω ±1% resistor connected between the ZQ ball (J1) and VSS to perform factory and runtime ZQ calibration. This resistor calibrates both output driver strength and on-die termination (ODT) impedances, ensuring signal integrity across voltage and temperature variations. The resistor must be placed within 5 mm of the ZQ ball with minimal trace inductance.
How is the industrial temperature rating implemented in W632GG6KB15I TR?
W632GG6KB15I TR guarantees full JEDEC AC/DC specifications from –40°C to +95°C. At temperatures above 85°C, it mandates either Auto Self-Refresh (ASR) mode (MR2[7:6] = 10b or 11b) or manual self-refresh with doubled refresh rate (tREFI = 3.9 µS). This ensures reliable data retention without external thermal monitoring or refresh controller modifications.
What are the supported CAS Latency (CL) and CAS Write Latency (CWL) values for W632GG6KB15I TR?
W632GG6KB15I TR supports CL = 6, 7, 8, 9, and 10, and CWL = 5, 6, and 7. These settings are programmed via mode registers MR0 and MR2 respectively. The default JEDEC SPD configuration for DDR3-1333 corresponds to CL=9 and CWL=7, yielding tAA = 13.5 ns and write latency WL = AL + CWL (with AL = 0, CL−1, or CL−2).
Can W632GG6KB15I TR be used as a direct replacement for other DDR3-1333 2Gb SDRAMs?
W632GG6KB15I TR is pin-compatible with standard 96-ball WBGA DDR3-1333 SDRAMs (e.g., IS43TR16256B-15HBL), but substitution requires verification of ball mapping (especially ZQ, VREFDQ, and ODT locations), MPR pattern compatibility, and refresh mode configuration. While electrical and timing specs align, Winbond-specific initialization sequences and register defaults may necessitate firmware adjustments.
W632GG6KB15I TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 96-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - DDR3
- Memory Size:
- 2Gbit
- Memory Organization:
- 128M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 667 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 20 ns
- Voltage - Supply:
- 1.425V ~ 1.575V
- Operating Temperature:
- -40°C ~ 95°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 96-WBGA (9x13)
W632GG6KB15I TR FAQ
1.How can I place an order for W632GG6KB15I TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W632GG6KB15I TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W632GG6KB15I TR reliable?
The price and inventory of W632GG6KB15I TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W632GG6KB15I TR is usually 5 days.
3.What payment methods are accepted for W632GG6KB15I TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W632GG6KB15I TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W632GG6KB15I TR?
W632GG6KB15I TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W632GG6KB15I TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W632GG6KB15I TR?
For technical support, including W632GG6KB15I TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W632GG6KB15I TR requirements.
6.How does Aetrix verify that W632GG6KB15I TR is sourced from the original manufacturer or authorized distributors?
All W632GG6KB15I TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W632GG6KB15I TR meets industry standards.
7.What is the process for return or replacement of W632GG6KB15I TR?
All W632GG6KB15I TR units undergo pre-shipment inspection (PSI). If there is an issue with W632GG6KB15I TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W632GG6KB15I TR part is unused and in its original packaging.
Return procedure for W632GG6KB15I TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W632GG6KB15I TR Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
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Microchip Technology
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