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Winbond Electronics Corporation W632GG6KB-18
- Part No.:
- W632GG6KB-18
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 96-TFBGA
- Datasheet:
-
W632GG6KB-18.pdf
- Description:
- IC DRAM 2GBIT PAR 96WBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,059
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Product details
Overview
W632GG6KB-18 from Winbond is a 2Gb (16M × 8 banks × 16-bit) DDR3 SDRAM supporting DDR3-1866 speed grade (-11), CAS Latency 13, tRCD/tRP = 13 ns, and 1.5V VDD/VDDQ supply. It features eight internal banks, 8-bit prefetch, programmable CWL, ZQ calibration, and asynchronous RESET# for power-up initialization in memory subsystems of embedded controllers and industrial SoC platforms.
For engineers reviewing the W632GG6KB-18 datasheet, W632GG6KB-18 pinout, W632GG6KB-18 application, or W632GG6KB-18 equivalent, this page delivers verified DDR3 timing parameters, ball-level I/O mapping, ODT configuration options, and JEDEC-compliant power-down modes - all critical for signal integrity validation, PCB layout, and memory controller register programming.
Technical Context
The W632GG6KB-18 implements a source-synchronous interface with differential CK/CK# and DQS/DQS# pairs, where inputs are latched at the crossing of CK rising and CK# falling edges. Its DLL aligns DQ and DQS transitions to clock edges, enabling stable 933 MHz operation (tCK = 1.07 ns min) under DDR3-1866 timing constraints.
It supports programmable additive latency (AL = 0, CL−1, CL−2), posted CAS, dynamic ODT (Rtt_WR), and multi-purpose register (MPR) readout for system-level timing calibration. The device uses SSTL_15 I/O standard and includes ZQ calibration for output driver and ODT impedance tuning via external 240Ω resistor.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gb (16,777,216 words × 8 banks × 16 bits) |
| Data Rate | 1866 Mb/sec/pin (DDR3-1866, fCKMAX = 933 MHz) |
| CAS Latency (CL) | 13 (tAA = 13.91 ns min, supports CL 6/8/10/13) |
| CAS Write Latency (CWL) | 9 (tCK(AVG) = 1.07–1.25 ns range) |
| tRCD / tRP | 13 ns (JEDEC DDR3-1866 13-13-13 timing bin) |
| Supply Voltage | VDD/VDDQ = 1.5 V ± 0.075 V (SSTL_15 compatible) |
| Operating Temp | 0°C ≤ TCASE ≤ 95°C (standard grade, non-industrial) |
| Package | WBGA-96 (9 mm × 13 mm, RoHS-compliant, lead-free) |
Pinout & Package
W632GG6KB-18 is packaged in a 96-ball WBGA (9 mm × 13 mm) with 0.8 mm ball pitch, compliant with JEDEC MO-273B. Ball assignment follows standard DDR3 SDRAM layout with dedicated VDDQ, VSSQ, VREFCA, VREFDQ, ZQ, and ODT pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input | Latches all command/address inputs at crossing point; defines system timing reference |
| DQS / DQS# | Differential data strobe | Source-synchronous edge-aligned read / center-aligned write strobe; enables DDR timing margining |
| ODT | On-die termination control | Enables programmable termination on DQ/DQS/DM lines during reads/writes to suppress reflections |
| RESET# | Asynchronous reset input | Triggers power-up initialization sequence and resets internal state without requiring stable clocks |
| ZQ | Calibration reference terminal | Connects to external 240Ω ±1% resistor to ground for factory-trimmed output driver and ODT impedance tuning |
| VREFCA / VREFDQ | Reference voltage inputs | Provide mid-supply reference for command/address (VREFCA) and data (VREFDQ) receivers; must remain stable during all operations |
Key Features
| Feature | Design Value |
|---|---|
| Dynamic ODT (Rtt_WR) | Enables on-the-fly termination switching during write bursts to optimize signal integrity without external resistors |
| Write leveling support | Allows memory controller to calibrate DQS-to-CK skew per byte lane using MPR read pattern and feedback loop |
| Multi-purpose register (MPR) | Provides predefined calibration bit sequence for system-level timing margin analysis and eye diagram optimization |
| Programmable CWL | Permits matching write latency to operating frequency (CWL = 9 at DDR3-1866), reducing write turnaround overhead |
| Partial array self-refresh (PASR) | Reduces IDD6 current by refreshing only active banks, extending battery life in portable applications |
| Posted CAS with AL | Improves bus efficiency by decoupling command issuance from data availability; RL = AL + CL allows flexible scheduling |
Applications
| Industrial HMI Controller | Network Edge Router |
|---|---|
Use Scenario: Real-time display rendering and local data buffering in panel-mounted HMIs with ARM-based SoCs. IC Role / Device Role / Timing Role: Primary DDR3 memory bank interfacing directly to Cortex-A series memory controller with 16-bit bus width. Use Value: 13-13-13 timing and 1.07 ns tCK enable deterministic latency for GUI frame buffer access and interrupt-driven I/O handling. | Use Scenario: Packet buffering and forwarding table storage in fanless enterprise edge routers with thermal constraints. IC Role / Device Role / Timing Role: High-bandwidth packet buffer supporting concurrent read/write operations across eight internal banks. Use Value: Dynamic ODT and write leveling ensure signal integrity at 1866 MT/s over 4-layer PCB traces up to 8 inches long. |
| Medical Imaging Module | Automated Test Equipment |
Use Scenario: Raw sensor data capture and preprocessing in ultrasound or digital X-ray modules with FPGA-based pipelines. IC Role / Device Role / Timing Role: Burst-oriented memory for high-throughput streaming into FPGA DDR3 PHY with precise tRAS/tRC control. Use Value: 2K-byte page size and tRAS = 34 ns minimize row activation overhead during continuous 128-bit burst transfers. | Use Scenario: Pattern memory for high-speed digital I/O test vectors in ATE systems requiring deterministic timing margins. IC Role / Device Role / Timing Role: Low-jitter, calibrated memory subsystem synchronized to system clock domain via DLL-locked DQS. Use Value: MPR readout and ZQ calibration allow factory-grade timing closure verification without external instrumentation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR3 SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT41K256M16HA-125:A | 2Gb DDR3L (1.35V), -125 speed grade (DDR3L-1600), 96-ball FBGA, supports 0°C–95°C | Lower voltage reduces power but requires separate VDDQ rail; not pin-compatible due to different ball map and VREFDQ placement | Select when system design targets DDR3L compatibility and lower static power, with board redesign for ballout and voltage regulation. |
| IS43TR16256B-125KBL | 2Gb DDR3, -125 speed grade (DDR3-1600), 96-ball WBGA, same package footprint but different pin assignments for ODT/ZQ/VREF | Supports identical temperature range but lacks PASR and has fixed CWL; no write leveling mode | Choose for cost-sensitive designs where DDR3-1600 bandwidth suffices and advanced calibration features are unnecessary. |
Compared with W632GG6KB-18, MT41K256M16HA-125:A offers lower voltage operation at reduced speed, while IS43TR16256B-125KBL matches the WBGA-96 form factor but omits write leveling and PASR-making W632GG6KB-18 the only option supporting full DDR3-1866 timing with system-level calibration capabilities.
Availability
W632GG6KB-18 is available at Aetrix Electronics and suitable for industrial HMI controllers, network edge routers, medical imaging modules, and automated test equipment requiring stable component supply, long-lifecycle support, and JEDEC-compliant DDR3-1866 performance.
Supply support for W632GG6KB-18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including NOR/NAND Flash, SRAM, and DDR SDRAM for industrial, automotive, and communications markets.
The W632GG6KB-18 belongs to Winbond's DDR3 SDRAM product line, designed specifically for high-reliability embedded systems demanding JEDEC-compliant timing, extended temperature operation, and advanced signal integrity features like write leveling and dynamic ODT.
FAQ
What speed grade does W632GG6KB-18 correspond to?
W632GG6KB-18 corresponds to the DDR3-1866 speed grade with timing specification 13-13-13 (tRCD/tRP/tRAS = 13 ns). It is rated for operation up to 933 MHz clock frequency (tCK = 1.07 ns minimum), and supports CAS Latency 13 and CAS Write Latency 9. This speed grade is confirmed in the official Winbond datasheet revision A06, section 4 (KEY PARAMETERS).
Does W632GG6KB-18 support industrial temperature range?
No, W632GG6KB-18 is specified for 0°C ≤ TCASE ≤ 95°C, which is the commercial/extended temperature grade-not the industrial -40°C to +95°C range. Industrial variants are designated with "I" suffixes (e.g., W632GG6KB12I or W632GG6KB15I); the -18 suffix indicates DDR3-1866 speed bin but does not imply extended temperature capability.
What is the function of the ZQ pin on W632GG6KB-18?
The ZQ pin on W632GG6KB-18 connects to an external 240Ω ±1% precision resistor to ground and enables factory-trimmed calibration of output driver strength and on-die termination (ODT) impedances. This ZQ calibration ensures consistent 34Ω output drive and selectable ODT values (60Ω/120Ω/150Ω) across voltage and temperature variations, critical for DDR3 signal integrity.
Can W632GG6KB-18 operate with DDR3L voltage levels?
No, W632GG6KB-18 requires VDD/VDDQ = 1.5V ± 0.075V and is not compatible with DDR3L's 1.35V supply. It implements SSTL_15 I/O standard and lacks DDR3L-specific DC characteristics. Using 1.35V will result in undefined behavior, failed initialization, or excessive bit errors. For DDR3L compatibility, consider Winbond's W632GG6KB-125:L series instead.
How is the RESET# pin used during power-up of W632GG6KB-18?
The RESET# pin on W632GG6KB-18 initiates asynchronous power-up initialization: it must be held LOW for ≥200 µs after VDD/VDDQ stabilize and before releasing HIGH, ensuring internal DLL, registers, and mode settings are properly reset. Unlike CKE-controlled entry, RESET# does not require clock stability and is mandatory before issuing any commands - per section 8.2.1 of the Winbond datasheet.
W632GG6KB-18 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 96-TFBGA
- Packaging:
- Tray
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - DDR3
- Memory Size:
- 2Gbit
- Memory Organization:
- 128M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 533 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 20 ns
- Voltage - Supply:
- 1.425V ~ 1.575V
- Operating Temperature:
- 0°C ~ 95°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 96-WBGA (9x13)
W632GG6KB-18 FAQ
1.How can I place an order for W632GG6KB-18 through Aetrix?
Please submit a Request for Quotation (RFQ) for W632GG6KB-18 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W632GG6KB-18 reliable?
The price and inventory of W632GG6KB-18 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W632GG6KB-18 is usually 5 days.
3.What payment methods are accepted for W632GG6KB-18?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W632GG6KB-18 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W632GG6KB-18?
W632GG6KB-18 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W632GG6KB-18 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W632GG6KB-18?
For technical support, including W632GG6KB-18 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W632GG6KB-18 requirements.
6.How does Aetrix verify that W632GG6KB-18 is sourced from the original manufacturer or authorized distributors?
All W632GG6KB-18 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W632GG6KB-18 meets industry standards.
7.What is the process for return or replacement of W632GG6KB-18?
All W632GG6KB-18 units undergo pre-shipment inspection (PSI). If there is an issue with W632GG6KB-18, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W632GG6KB-18 part is unused and in its original packaging.
Return procedure for W632GG6KB-18:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W632GG6KB-18 Tags
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M24C02-WMN6TP
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