Winbond Electronics Corporation W632GG6MB15I

Overview

W632GG6MB15I from Winbond Electronics is a 2G-bit DDR3 SDRAM organized as 16M × 8 banks × 16 bits, supporting DDR3-1333 (9-9-9) operation at up to 667 MHz clock frequency with CAS Latency 9, CWL 7, and industrial temperature range (−40°C to +95°C). It features on-die termination (ODT), ZQ calibration, programmable additive latency, and asynchronous RESET# for reliable memory subsystems in networking and industrial control applications.

For engineers reviewing the W632GG6MB15I datasheet, W632GG6MB15I pinout, W632GG6MB15I application, or W632GG6MB15I equivalent, key selection criteria include its VFBGA-96 package, SSTL_15 interface compliance, 2K-byte page size, support for dynamic ODT and write leveling, and JEDEC-compliant DDR3-1333 timing across extended temperature.

Technical Context

This DDR3 SDRAM implements an 8-bit prefetch architecture with eight internal banks enabling concurrent access. Its differential CK/CK# inputs synchronize all commands, while bi-directional DQS/DQS# strobes align read data edges and write data centers using an integrated DLL.

It supports programmable mode registers (MR0–MR3) for CAS Latency (CL = 5–10), CAS Write Latency (CWL = 5–7), additive latency (AL = 0, CL−1, CL−2), partial array self-refresh (PASR), and auto self-refresh (ASR). ZQ calibration adjusts output driver and ODT impedance using an external 240 Ω resistor.

Key Specifications

Pinout & Package

VFBGA-96 package with 7.5 mm × 13 mm footprint and 0.8 mm ball pitch; 1.0 mm maximum thickness; lead-free, RoHS-compliant construction.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR3 SDRAM applications.

Compared with MT41K256M16HA-125:E and IS43TR16256B-15KBL, the W632GG6MB15I offers unique industrial-grade DDR3-1333 performance with PASR, ASR, and dynamic ODT-enabling lower system power and robust signal integrity in thermally variable embedded designs without voltage scaling trade-offs.

Availability

W632GG6MB15I is available at Aetrix Electronics and suitable for industrial automation, network infrastructure, and medical imaging systems requiring stable component supply, long-term lifecycle assurance, and guaranteed −40°C to +95°C operation.

Supply support for W632GG6MB15I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including NOR/NAND Flash, SRAM, and DDR SDRAM for industrial, automotive, and communications markets.

The W632GG6MB series targets cost-sensitive, thermally demanding embedded applications requiring JEDEC-compliant DDR3 with enhanced power management and system-level calibration features-not just raw bandwidth.

FAQ

What is the maximum clock frequency supported by W632GG6MB15I?

The W632GG6MB15I supports a maximum clock frequency of 667 MHz, corresponding to DDR3-1333 data rates (1333 MT/s). This is validated under industrial temperature conditions (−40°C to +95°C) with CL9/CWL7 timing and meets JEDEC specification tCK(AVG) = 1.5 ns min for CL9 operation. The device does not support higher speed bins like DDR3-1600 or DDR3-1866.

Does W632GG6MB15I support on-die termination (ODT) and how is it configured?

Yes, W632GG6MB15I supports both static and dynamic ODT. Static termination (RTT_NOM) is enabled via MR1 bits A9–A10; dynamic ODT (Rtt_WR) is activated during write operations using MR2 bit A2. Impedance values (60 Ω, 120 Ω, 40 Ω) are selected through MR1/A9–A10 and MR2/A2–A3. Configuration requires proper mode register programming before use.

How does the ZQ calibration function work on W632GG6MB15I?

ZQ calibration on W632GG6MB15I uses an external 240 Ω ±1% resistor connected to the ZQ pin to calibrate internal output driver and ODT impedances. A ZQCL command initiates one-time calibration at power-up; ZQCS supports periodic recalibration. The process compensates for voltage and temperature drift, ensuring SSTL_15 I/O compliance across the full −40°C to +95°C range.

Can W632GG6MB15I operate in Partial Array Self-Refresh (PASR) mode, and what benefit does it provide?

Yes, W632GG6MB15I supports PASR via MR2 bits A1–A0 to refresh only selected banks (¼, ½, or full array). In industrial applications with intermittent data activity, PASR reduces self-refresh current (IDD6) by up to 45% compared to full-array refresh-extending uptime in thermally isolated enclosures and lowering system cooling requirements.

What is the purpose of the Multi-Purpose Register (MPR) in W632GG6MB15I?

The MPR in W632GG6MB15I stores a fixed 128-bit calibration pattern (0x00000000) readable via standard READ commands. It enables system-level timing validation-particularly for write leveling-by providing a known, jitter-free reference sequence that the memory controller uses to measure and correct DQS-to-CK skew across all DQ lanes.