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Winbond Electronics Corporation W632GG8KB-15
- Part No.:
- W632GG8KB-15
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 78-TFBGA
- Datasheet:
-
W632GG8KB-15.pdf
- Description:
- IC DRAM 2GBIT PAR 78WBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,610
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Product details
Overview
W632GG8KB-15 from Winbond is a 2 Gb (256 MB) DDR3 SDRAM organized as 32M words × 8 banks × 8 bits, operating at DDR3-1333 speed (667 MHz clock, 9-9-9 CL-tRCD-tRP timing), with 1.5 V supply, SSTL_15 interface, and WBGA-78 package. It supports programmable CAS Write Latency (CWL = 5–7), on-die termination (ODT), ZQ calibration, and asynchronous RESET# for embedded computing, industrial controllers, and network infrastructure memory subsystems.
For engineers reviewing the W632GG8KB-15 datasheet, W632GG8KB-15 pinout, W632GG8KB-15 application, or W632GG8KB-15 equivalent, key selection considerations include its DDR3-1333 speed bin, industrial-grade temperature support (0°C to 95°C case), 78-ball WBGA footprint, ODT configuration flexibility, and compatibility with JEDEC-standard DDR3 controllers requiring tREFI = 7.8 µs at ≤85°C.
Technical Context
This DDR3 SDRAM implements an 8-bit prefetch architecture with eight internal banks enabling concurrent access, DLL-aligned DQ/DQS timing, and source-synchronous data transfer using differential DQS/DQS# strobes. It supports posted CAS with additive latency (AL = 0, CL−1, CL−2), auto-precharge, and burst lengths of 8 (BL8) or 4 (BC4) selectable on-the-fly.
Functional operation relies on mode register programming (MR0–MR3) for CAS Latency (CL = 6, 8, 9, 10), CWL, ODT RTT values, PASR, ASR, and dynamic ODT (Rtt_WR). Initialization requires stable VDD/VDDQ, CKE assertion, and RESET# deassertion followed by ZQ calibration and mode register setup before command execution.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gb (256 MB), organized as 32M × 8 banks × 8 bits - defines usable capacity and row/column/bank addressing space. |
| Data Rate | DDR3-1333 (1333 MT/s, 667 MHz fCK) - sets maximum sustained bandwidth per pin and system timing constraints. |
| Timing Grade | 9-9-9 (tCL/tRCD/tRP) - specifies minimum clock cycles for read latency, active-to-read/write, and precharge delays. |
| Supply Voltage | VDD = VDDQ = 1.5 V ± 0.075 V - mandates compatible power delivery and level-shifting for address/control and I/O domains. |
| Interface Standard | SSTL_15 - requires matched-impedance routing, 1.5 V reference, and differential clock/strobe signaling. |
| Package | WBGA-78 (8 mm × 10.5 mm, 0.8 mm pitch) - determines PCB layout area, thermal dissipation, and assembly compatibility. |
| Operating Temperature | 0°C ≤ TCASE ≤ 95°C - validates suitability for extended-temperature industrial environments without derating. |
| Refresh Interval | tREFI = 7.8 µs (0–85°C), 3.9 µs (85–95°C) - dictates controller refresh scheduling frequency and ASR/PASR enablement requirements. |
Pinout & Package
W632GG8KB-15 uses a 78-ball Wafer-Level Ball Grid Array (WBGA) package measuring 8 mm × 10.5 mm with 0.8 mm ball pitch, RoHS-compliant lead-free construction, and standard DDR3 ball assignment layout.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential Clock Input | Latches all command/address inputs at crossing point; defines system timing reference and maximum operating frequency. |
| CKE | Clock Enable | Asynchronous control for power-down entry/exit and Self-Refresh activation; must remain HIGH during active accesses. |
| CS# | Chip Select | Active-low enable for command decoding; enables rank-level selection in multi-RAM systems. |
| ODT | On-Die Termination Control | Registered input enabling internal termination resistors on DQ/DQS/DM lines; critical for signal integrity in point-to-point or stub-based topologies. |
| RESET# | Asynchronous Reset | Active-low initialization signal; required for power-up sequence and functional reset independent of clock state. |
| DQS / DQS# | Differential Data Strobe | Source-synchronous strobe pair; center-aligned with write data, edge-aligned with read data for timing capture. |
| ZQ | ZQ Calibration Reference | Connects to external 240 Ω ±1 % resistor to ground; calibrates output driver strength and ODT impedance across voltage/temperature. |
| VREFCA / VREFDQ | Reference Voltage Inputs | Provide 0.5 × VDD reference for command/address and data input receivers; require stable, low-noise decoupling. |
Key Features
| Feature | Design Value |
|---|---|
| Programmable CAS Write Latency (CWL) | Supports CWL = 5, 6, or 7 depending on frequency; enables precise write timing alignment with controller clock domain. |
| Dynamic ODT (Rtt_WR) | Allows runtime switching of ODT resistance during write bursts only; improves write signal integrity without affecting read termination. |
| Multi-Purpose Register (MPR) | Provides predefined calibration bit pattern for system-level timing margin verification via read commands; eliminates need for external test equipment. |
| Write Leveling Support | Enables controller-driven DQS-to-CK skew calibration during initialization; compensates for board trace length mismatches in high-speed layouts. |
| Partial Array Self-Refresh (PASR) | Reduces self-refresh current by refreshing only selected banks; extends battery life in portable or low-power standby modes. |
| ZQ Calibration | Performs periodic output driver and ODT impedance tuning using external 240 Ω resistor; maintains signal fidelity across voltage/temperature drift. |
Applications
| Industrial PLC Memory | Network Switch Buffer |
|---|---|
Use Scenario: Real-time deterministic control logic execution with persistent data logging in factory automation cabinets. IC Role / Device Role / Timing Role: Primary working memory for ARM Cortex-M7 or RISC-V SoC-based controllers, interfacing via AXI or AHB bus with DDR3 PHY. Use Value: 9-9-9 timing and 0–95°C operation ensure reliable boot and runtime behavior under thermal cycling and EMI-rich plant-floor conditions. | Use Scenario: Packet buffering and forwarding table storage in Layer 2/L3 managed Ethernet switches. IC Role / Device Role / Timing Role: Shared packet buffer memory for multi-port switch ASICs, supporting concurrent read/write access across eight internal banks. Use Value: BL8 burst mode and bank interleaving deliver >5 GB/s effective bandwidth to sustain full-line-rate 10Gbps port aggregation. |
| Medical Imaging Controller | Video Surveillance DVR |
Use Scenario: Frame buffering and image processing pipeline memory in ultrasound or digital X-ray acquisition systems. IC Role / Device Role / Timing Role: High-bandwidth frame store for FPGA-accelerated image reconstruction engines, synchronized to pixel clock domain via DDR3 PHY. Use Value: SSTL_15 interface and 78-ball WBGA enable compact, low-inductance routing essential for noise-sensitive analog/digital mixed-signal boards. | Use Scenario: Multi-channel HD video encode/decode buffer in embedded NVR appliances with 4–16 camera inputs. IC Role / Device Role / Timing Role: Dual-role memory serving both video encoder (H.264/H.265) and OS/application runtime, managed via Linux kernel DDR3 driver stack. Use Value: ASR and PASR features reduce idle power consumption by up to 40% versus full-array self-refresh, extending fanless thermal design margins. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR3 SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT41K256M8DA-125:A | 2 Gb DDR3L (1.35 V), -125 speed grade (DDR3L-1600), 96-ball FBGA; lower voltage, higher speed, different package. | Targets ultra-low-power mobile or battery-backed systems where 1.35 V operation reduces system power; incompatible with 1.5 V-only designs. | Select when migrating to DDR3L ecosystem or requiring higher bandwidth; verify voltage regulator and PCB layout compatibility. |
| IS43TR16256B-15KBL | 2 Gb DDR3, DDR3-1333 (-15K), 96-ball FBGA; same speed grade but larger package and 16-bit bus width (x16 vs x8). | Designed for x16 data path architectures (e.g., Intel Atom E3800); requires redesign of data bus width and controller configuration. | Choose only if x16 interface is available and board space permits 96-ball footprint; not drop-in compatible with W632GG8KB-15's x8/WBGA-78 layout. |
Compared with MT41K256M8DA-125:A and IS43TR16256B-15KBL, W632GG8KB-15 provides strict DDR3-1333 compliance at 1.5 V in a compact 78-ball WBGA, making it optimal for cost-sensitive, thermally constrained industrial designs where voltage flexibility or x16 bandwidth are not required.
Availability
W632GG8KB-15 is available at Aetrix Electronics and suitable for industrial PLCs, network infrastructure buffers, and medical imaging controllers requiring stable component supply, long-term lifecycle assurance, and JEDEC-compliant DDR3 interoperability.
Supply support for W632GG8KB-15 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and DDR SDRAM for industrial, automotive, and communications markets.
The W632GG8KB series belongs to Winbond's industrial-grade DDR3 SDRAM product line, designed specifically for reliability-critical embedded systems requiring extended temperature operation, robust initialization sequences, and JEDEC-compliant signal integrity under real-world EMI and thermal stress.
FAQ
What is the maximum supported CAS Latency for W632GG8KB-15?
W632GG8KB-15 supports CAS Latency settings of CL = 6, 8, 9, and 10. CL = 9 is the default and guaranteed setting for DDR3-1333 (9-9-9) operation. CL = 6 and CL = 8 are also fully supported, while CL = 10 is validated for specific timing margin scenarios. CL = 7 and CL = 11 are not supported for this speed grade per the datasheet's Sup_CL specification.
Does W632GG8KB-15 support Auto Self-Refresh (ASR) mode?
Yes, W632GG8KB-15 supports Auto Self-Refresh (ASR) mode, controlled via Mode Register MR2 bits A6 and A7. When enabled (MR2 A6 = 1b), ASR automatically adjusts refresh rate based on die temperature, allowing operation up to 95°C case temperature with tREFI = 3.9 µS. This feature is essential for maintaining data retention in thermally demanding industrial environments without host controller intervention.
What is the purpose of the ZQ pin on W632GG8KB-15?
The ZQ pin on W632GG8KB-15 connects to an external 240 Ω ±1 % precision resistor to ground and enables on-die calibration of output driver strength and ODT impedance. This calibration occurs at power-up and can be re-triggered via ZQCL or ZQCS commands. It ensures consistent signal integrity across voltage and temperature variations, directly impacting setup/hold timing margins for high-speed DDR3 interfaces.
Can W632GG8KB-15 operate at temperatures above 85°C?
Yes, W632GG8KB-15 is rated for 0°C ≤ TCASE ≤ 95°C. Operation above 85°C requires either enabling Auto Self-Refresh (ASR) mode (MR2 A6 = 1b) or entering Manual Self-Refresh with Extended Temperature Range (MR2 A6 = 0b, A7 = 1b), both of which mandate doubling the refresh rate to tREFI = 3.9 µS. This capability makes W632GG8KB-15 suitable for sealed industrial enclosures without forced air cooling.
Is W632GG8KB-15 pin-compatible with other Winbond DDR3 parts like W632GG8KB-12?
Yes, W632GG8KB-15 shares identical WBGA-78 pinout, ball assignment, and electrical interface with other members of the W632GG8KB family (e.g., -11, -12, -15, 12I, 15I). All variants use the same 78-ball layout, VDD/VDDQ supply scheme, and command/address/data mapping. Speed grade differences affect only AC timing parameters and supported CL/CWL values-not physical or logical connectivity.
W632GG8KB-15 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 78-TFBGA
- Packaging:
- Tray
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - DDR3
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- 667 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 20 ns
- Voltage - Supply:
- 1.425V ~ 1.575V
- Operating Temperature:
- 0°C ~ 95°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 78-WBGA (10.5x8)
W632GG8KB-15 FAQ
1.How can I place an order for W632GG8KB-15 through Aetrix?
Please submit a Request for Quotation (RFQ) for W632GG8KB-15 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W632GG8KB-15 reliable?
The price and inventory of W632GG8KB-15 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W632GG8KB-15 is usually 5 days.
3.What payment methods are accepted for W632GG8KB-15?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W632GG8KB-15 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W632GG8KB-15?
W632GG8KB-15 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W632GG8KB-15 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W632GG8KB-15?
For technical support, including W632GG8KB-15 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W632GG8KB-15 requirements.
6.How does Aetrix verify that W632GG8KB-15 is sourced from the original manufacturer or authorized distributors?
All W632GG8KB-15 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W632GG8KB-15 meets industry standards.
7.What is the process for return or replacement of W632GG8KB-15?
All W632GG8KB-15 units undergo pre-shipment inspection (PSI). If there is an issue with W632GG8KB-15, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W632GG8KB-15 part is unused and in its original packaging.
Return procedure for W632GG8KB-15:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W632GG8KB-15 Tags
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M24C02-WMN6TP
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