Winbond Electronics Corporation W632GG8KB15I

Overview

W632GG8KB15I from Winbond is a 2 Gb (256 MB) DDR3 SDRAM organized as 32M × 8 banks × 8 bits, operating at DDR3-1333 speed (667 MHz clock, 9-9-9 timing), with industrial temperature support (–40°C to +95°C), 1.5 V core/interface supply, and on-die termination (ODT). It serves as main memory in embedded computing, networking equipment, and industrial controllers requiring reliable high-bandwidth data buffering.

For engineers reviewing the W632GG8KB15I datasheet, W632GG8KB15I pinout, W632GG8KB15I application, or W632GG8KB15I equivalent, this page delivers verified DDR3-1333 timing parameters, ball-mapped I/O roles, industrial-grade thermal behavior, ZQ calibration support, and validated alternative parts for memory subsystem design and BOM continuity planning.

Technical Context

This DDR3 SDRAM implements an 8-bit prefetch architecture with eight internal banks enabling concurrent row activation and interleaved access. It supports programmable CAS Latency (CL = 6, 7, 8, 9, 10), CAS Write Latency (CWL = 5–7), additive latency (AL = 0, CL−1, CL−2), and dynamic ODT for write-data signal integrity.

The device uses differential CK/CK# and DQS/DQS# signaling with SSTL_15 I/O interface, DLL-aligned DQ-DQS timing, and asynchronous RESET# for power-up initialization. It includes ZQ calibration for output driver and ODT impedance tuning, multi-purpose register (MPR) for system-level timing calibration, and partial array self-refresh (PASR) for reduced power in idle bank subsets.

Key Specifications

Pinout & Package

Packaged in 78-ball WBGA (8 mm × 10.5 mm, 0.8 mm pitch), RoHS-compliant, lead-free. Ball grid follows JEDEC-standard DDR3 layout with dedicated VDD/VSS/VDDQ/VSSQ planes, split reference pins (VREFCA, VREFDQ), and dual-purpose balls (e.g., DM/TDQS, NU/TDQS#).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR3 SDRAM applications.

Compared with W632GG8KB15I, MT41K256M8DA-125:K offers higher speed but lacks industrial temperature support and requires DDR3L voltage, while IS43TR16256B-125KBL provides same temperature range but demands x16 bus redesign - W632GG8KB15I remains optimal for cost-sensitive, thermally demanding x8 DDR3-1333 implementations.

Availability

W632GG8KB15I is available at Aetrix Electronics and suitable for industrial automation, network infrastructure, and medical electronics requiring stable component supply, long-term lifecycle assurance, and guaranteed industrial temperature performance.

Supply support for W632GG8KB15I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including NOR/NAND Flash, SRAM, and DRAM for industrial, automotive, and communications markets.

The W632GG8KB series belongs to Winbond's industrial-grade DDR3 SDRAM product line, designed specifically for embedded systems needing extended temperature operation, robust power management, and JEDEC-compliant interoperability with mainstream memory controllers.

FAQ

What is the maximum operating frequency and timing specification for W632GG8KB15I?

W632GG8KB15I is rated for DDR3-1333 operation with a maximum clock frequency of 667 MHz and JEDEC-standard 9-9-9 timing (t_RCD = t_RP = t_RC = 9 ns). It supports CAS Latency settings of 6, 7, 8, 9, 10 and CAS Write Latency of 5–7, with minimum t_AA, t_RCD, and t_RP values of 13.5 ns at 667 MHz. The part is fully compliant with DDR3 SDRAM standard JESD79-3F.

Does W632GG8KB15I support industrial temperature operation, and what are the thermal limits?

Yes, W632GG8KB15I is qualified for industrial temperature operation across –40°C ≤ T_CASE ≤ 95°C. At 85–95°C, it requires either doubled refresh rate (t_REFI = 3.9 µs) or Auto Self-Refresh (ASR) mode enabled via MR2 bits A6/A7. This makes W632GG8KB15I suitable for fanless enclosures, outdoor telecom gear, and factory-floor controllers where ambient heat exceeds commercial-grade limits.

How does ZQ calibration function on W632GG8KB15I, and what external component is required?

W632GG8KB15I performs ZQ calibration using an external 240 Ω ±1 % precision resistor connected between the ZQ ball and ground. This calibration adjusts both output driver strength and on-die termination (ODT) impedance to maintain signal integrity across voltage and temperature variations. Calibration is initiated via ZQCL command after power-up and can be repeated using ZQCS for dynamic recalibration during operation.

What DDR3 features does W632GG8KB15I implement to reduce system-level power consumption?

W632GG8KB15I implements multiple power-saving features: Precharge Power Down and Active Power Down modes reduce IDD during idle periods; Partial Array Self-Refresh (PASR) lowers self-refresh current by refreshing only active banks; Auto Self-Refresh (ASR) dynamically scales refresh rate with temperature; and programmable ODT minimizes termination-related leakage. At 95°C, IDD6 remains at 19 mA due to ASR/PASR synergy.

Is W632GG8KB15I pin-compatible with other Winbond DDR3 parts such as W632GG8KB-15 or W632GG8KB12I?

Yes, W632GG8KB15I shares identical 78-ball WBGA package, pinout, and ball functionality with W632GG8KB-15 and W632GG8KB12I. All variants use the same mechanical footprint and electrical interface - only speed bin (-15 vs. 12I vs. 15I) and temperature grading differ. This allows drop-in replacement during qualification or production ramp without PCB redesign.