Winbond Electronics Corporation W632GG8KB-15 TR

Overview

W632GG8KB-15 TR from Winbond is a 2 Gb (256 MB) DDR3 SDRAM organized as 32M × 8 banks × 8 bits, operating at DDR3-1333 speed (667 MHz clock, 9-9-9 timing), with 1.5 V core/interface supply, SSTL_15 I/O interface, and WBGA-78 (8 mm × 10.5 mm) package. It supports CAS Latency 6/7/8/9/10, programmable CWL, ZQ calibration, dynamic ODT, and industrial-grade operation up to 95°C - deployed in embedded computing, network edge devices, and industrial HMIs requiring reliable, JEDEC-compliant memory.

For engineers reviewing the W632GG8KB-15 TR datasheet, W632GG8KB-15 TR pinout, W632GG8KB-15 TR application, or W632GG8KB-15 TR equivalent, this page delivers verified DDR3-1333 timing parameters, ball-level I/O mapping, ODT configuration modes, power-down behavior, and validated drop-in alternatives for memory subsystem design and BOM optimization.

Technical Context

This DDR3 SDRAM implements an 8-bit prefetch architecture with eight internal banks, enabling concurrent bank activation and high-bandwidth interleaved access. It uses differential CK/CK# inputs for command/address latching and source-synchronous DQS/DQS# strobes aligned to data edges - read data is edge-aligned, write data is center-aligned.

The device supports programmable features including additive latency (AL = 0, CL−1, CL−2), posted CAS#, auto-precharge, partial array self-refresh (PASR), and asynchronous RESET#. Its on-die termination (ODT) supports synchronous, dynamic, and asynchronous modes with selectable RTT values (60 Ω, 120 Ω, 40 Ω), calibrated via external 240 Ω ZQ resistor.

Key Specifications

Pinout & Package

W632GG8KB-15 TR uses a 78-ball fine-pitch WBGA package (8 mm × 10.5 mm, 0.8 mm ball pitch) with area-array layout optimized for signal integrity and thermal dissipation in dense PCB layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR3 SDRAM applications.

Compared with W632GG8KB-15 TR, MT41K256M8DA-125:K offers higher speed at lower voltage but demands full PCB redesign, while IS43TR16256B-15KBL matches DDR3-1333 performance and temperature range but adds thermal sensing at the cost of non-interchangeable packaging.

Availability

W632GG8KB-15 TR is available at Aetrix Electronics and suitable for industrial HMIs, network edge routers, medical diagnostic terminals, and automated test equipment requiring stable component supply, long-term lifecycle assurance, and JEDEC-compliant DDR3 memory with extended temperature capability.

Supply support for W632GG8KB-15 TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and DDR SDRAM for industrial, automotive, and communications markets.

The W632GG8KB series is part of Winbond's DDR3 SDRAM product line, designed specifically for cost-sensitive, thermally constrained embedded systems requiring JEDEC compliance, robust initialization, and flexible power management modes.

FAQ

What DDR3 speed grade does W632GG8KB-15 TR support?

W632GG8KB-15 TR supports DDR3-1333 operation at 667 MHz clock frequency, with JEDEC-compliant 9-9-9 timing (tAA/tRCD/tRP = 13.5 ns min). It is rated for CL = 6, 7, 8, 9, and 10, and CWL = 5, 6, or 7 depending on configured frequency - confirmed in the official datasheet revision A05, section 4 and Table 4-1.

Does W632GG8KB-15 TR support industrial temperature range?

Yes, W632GG8KB-15 TR is specified for 0°C ≤ TCASE ≤ 95°C operation, meeting extended commercial temperature requirements. While the -15I variant explicitly guarantees -40°C to +95°C, the -15 grade (W632GG8KB-15 TR) supports full JEDEC AC/DC specs up to 95°C - validated in Section 4 KEY PARAMETERS, Note 4, which confirms 95°C operation with doubled refresh and ASR mode enabled.

What package type and ball count does W632GG8KB-15 TR use?

W632GG8KB-15 TR uses a 78-ball WBGA package measuring 8 mm × 10.5 mm with 0.8 mm ball pitch. This is confirmed in Section 2 FEATURES ("Packaged in WBGA 78 Ball") and Section 5 BALL CONFIGURATION, which shows the full 78-position grid layout with labeled signals including CK, DQS, ODT, ZQ, and RESET#.

How is on-die termination (ODT) configured on W632GG8KB-15 TR?

W632GG8KB-15 TR supports three ODT modes: synchronous (via MR1), dynamic (Rtt_WR, activated during WRITE), and asynchronous. RTT values are programmable to 60 Ω, 120 Ω, or 40 Ω using MR1 bits A2–A0. Configuration requires ZQ calibration via external 240 Ω resistor on the ZQ pin - detailed in Sections 8.19 and 10.9 of the datasheet.

Is W632GG8KB-15 TR pin-compatible with other Winbond DDR3 parts like W632GG8KB-12?

No, W632GG8KB-15 TR is not pin-compatible with W632GG8KB-12 or other variants in the same family - all share identical WBGA-78 packaging and ball assignment, but pin compatibility is inherent to the shared mechanical and electrical footprint. The -12, -15, and -11 grades differ only in speed binning and AC timing; their pinouts, voltage requirements, and command sets are fully identical per datasheet Sections 5 and 6.