Winbond Electronics Corporation W632GG8NB-11 TR

Overview

W632GG8NB-11 TR from Winbond Electronics is a 2 Gb (256 MB) DDR3 SDRAM organized as 32M × 8 banks × 8 bits, supporting DDR3-1866 (13-13-13) operation at up to 933 MHz clock frequency with CAS Latency 13, 11, or 10. It features on-die termination (ODT), ZQ calibration, programmable CWL, and asynchronous RESET# for reliable memory subsystems in industrial computing and embedded controllers.

For engineers reviewing the W632GG8NB-11 TR datasheet, W632GG8NB-11 TR pinout, W632GG8NB-11 TR application, or W632GG8NB-11 TR equivalent, key selection criteria include its VFBGA-78 package, SSTL_15 interface compliance, -40°C to 95°C industrial temperature range, and support for write leveling, multi-purpose register (MPR), and dynamic ODT for high-signal-integrity DDR3 designs.

Technical Context

This DDR3 SDRAM implements an 8-bit prefetch architecture with eight internal banks enabling concurrent access. Its DLL-aligned DQS-DQ timing, posted CAS with programmable additive latency (AL = 0, CL−1, CL−2), and bi-directional differential strobes ensure precise source-synchronous data capture at 1866 MT/s.

It supports full JEDEC-compliant power management: Precharged/Active Power Down, Self-Refresh, Auto Self-Refresh (ASR), and Partial Array Self Refresh (PASR). The device uses asynchronous RESET# for initialization and includes ZQ calibration for output driver and ODT impedance tuning via external 240 Ω resistor.

Key Specifications

Pinout & Package

VFBGA-78 package (8 mm × 10.5 mm, 1.0 mm height) with ball pitch of 0.8 mm. RoHS-compliant, lead-free construction. Window BGA type enables optical alignment during assembly.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR3 SDRAM applications.

Compared with MT41K256M8DA-125:A, W632GG8NB-11 TR offers lower cost and identical timing at 95°C max, but lacks extended temp rating and ECC support; versus IS43TR16256B-125KBL, it avoids x16 layout complexity while delivering matched 1866 MT/s throughput per byte lane.

Availability

W632GG8NB-11 TR is available at Aetrix Electronics and suitable for industrial automation, network infrastructure, and medical electronics requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant sourcing.

Supply support for W632GG8NB-11 TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including NOR/NAND Flash, RAM, and trusted computing ICs.

The W632GG8NB series belongs to Winbond's industrial-grade DDR3 SDRAM product line, designed specifically for reliability-critical embedded systems operating across extended temperature ranges and demanding signal integrity requirements.

FAQ

What is the maximum supported CAS Latency for W632GG8NB-11 TR?

W632GG8NB-11 TR supports CAS Latency settings of 13, 11, and 10 per JEDEC DDR3-1866 specification. CL13 is the default and fully characterized timing for the -11 speed grade, delivering tAA = 13.91 ns and tRCD = 13.91 ns at 933 MHz. Lower CL values may be enabled via mode register programming but require validation against system timing margins.

Does W632GG8NB-11 TR support write leveling and how is it implemented?

Yes, W632GG8NB-11 TR supports write leveling as defined in JEDEC DDR3 standard. It uses the DQS strobe in conjunction with the MPR to perform per-device skew calibration during initialization. The controller issues a write leveling command, and the DRAM returns a known pattern on DQ while adjusting DQS delay until edge alignment with CK is achieved - a mandatory step for stable 1866 MT/s operation.

What package type and ball count does W632GG8NB-11 TR use?

W632GG8NB-11 TR uses a VFBGA-78 package: 8 mm × 10.5 mm body size, 1.0 mm height, 0.8 mm ball pitch, and 78 solder balls arranged in a window BGA configuration. This RoHS-compliant, lead-free package is optimized for automated assembly and thermal performance in dense industrial PCB layouts.

Can W632GG8NB-11 TR operate at temperatures above 95°C?

No, W632GG8NB-11 TR is rated for 0°C to 95°C case temperature per its speed grade designation. For operation up to 105°C, select the W632GG8NB11J variant, which includes extended temperature qualification, doubled auto-refresh rate, and MR2 configuration for ASR or Manual Self-Refresh mode.

What is the purpose of the MPR (Multi-Purpose Register) in W632GG8NB-11 TR?

The MPR in W632GG8NB-11 TR provides a predefined 128-bit calibration pattern accessible via standard READ commands. It enables system-level timing margin verification and write leveling without requiring external test equipment or custom firmware - simplifying bring-up and validation of DDR3 interfaces in resource-constrained embedded designs.