Winbond Electronics Corporation W632GG8NB-12

Overview

W632GG8NB-12 from Winbond Electronics is a 2 Gb (256 MB) DDR3 SDRAM organized as 32M words × 8 banks × 8 bits, operating at DDR3-1600 speed (800 MHz clock, 1600 MT/s data rate) with CL=11, tRCD=tRP=11 ns timing, and 1.5 V core/I/O supply. It serves as main system memory in embedded computing, industrial controllers, and network infrastructure where reliable high-bandwidth data buffering is required.

For engineers reviewing the W632GG8NB-12 datasheet, W632GG8NB-12 pinout, W632GG8NB-12 application, or W632GG8NB-12 equivalent, this device supports programmable CAS Write Latency (CWL=5–8), ZQ calibration, on-die termination (ODT), asynchronous RESET#, and multi-purpose register (MPR)-assisted write leveling - critical for signal integrity in dense DDR3 layouts.

Technical Context

This DDR3 SDRAM implements an 8-bit prefetch architecture with eight internal banks enabling concurrent access, and uses differential CK/CK# inputs synchronized at the cross-point for command/address latching. Its DLL aligns DQ and DQS transitions to the clock edge, supporting both posted CAS (AL = 0, CL−1, CL−2) and bi-directional differential DQS/DQS# strobes center-aligned on writes and edge-aligned on reads.

It supports full JEDEC-compliant power management including precharged and active power-down modes, self-refresh (IDD6 ≤ 15 mA), auto self-refresh (ASR), partial array self-refresh (PASR), and dynamic ODT (Rtt_WR) with programmable RTT values (60 Ω, 120 Ω, 40 Ω). The -12 speed grade guarantees operation from 0°C to 95°C with tREFI = 7.8 µs at TCASE ≤ 85°C and 3.9 µs at 85°C < TCASE ≤ 95°C.

Key Specifications

Pinout & Package

Packaged in a RoHS-compliant, lead-free 78-ball VFBGA (8 mm × 10.5 mm, 1.0 mm height, Window BGA type) with 0.8 mm ball pitch.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR3 SDRAM applications.

Compared with MT41K256M8DA-125:A and IS43TR16256B-125KBL, the W632GG8NB-12 offers identical DDR3-1600 performance in a compact 78-ball VFBGA with relaxed 1.5 V ± 75 mV tolerance - simplifying power design and PCB area usage in space-constrained industrial modules.

Availability

W632GG8NB-12 is available at Aetrix Electronics and suitable for industrial automation, network infrastructure, and medical imaging systems requiring stable component supply, long-lifecycle support, and guaranteed 0°C to 95°C operation.

Supply support for W632GG8NB-12 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and DDR SDRAM for industrial, automotive, and communications markets.

The W632GG8NB series belongs to Winbond's industrial-grade DDR3 SDRAM product line, designed specifically for reliability-critical applications demanding extended temperature operation, robust signal integrity features (ZQ, MPR, dynamic ODT), and JEDEC compliance without premium cost premiums.

FAQ

What is the maximum data rate supported by the W632GG8NB-12?

The W632GG8NB-12 supports DDR3-1600 operation, delivering a maximum data rate of 1600 MT/s with an 800 MHz differential clock input. This is confirmed by its speed grade suffix "-12", JEDEC-compliant tAA/tRCD/tRP = 11-11-11 timing, and AC specifications in Section 11.15.2 of the datasheet. The W632GG8NB-12 does not support DDR3-1866 or higher bins.

Does the W632GG8NB-12 support automatic self-refresh (ASR)?

Yes, the W632GG8NB-12 supports Auto Self-Refresh (ASR) as defined in MR2 bit A6. When enabled (MR2[A6]=1), ASR automatically doubles the refresh rate to tREFI = 3.9 µs above 85°C, satisfying JEDEC requirements for operation up to 95°C. This feature is mandatory for thermal stability in the W632GG8NB-12's rated temperature range and is documented in Section 9.3.3.3.

What package type and ball count does the W632GG8NB-12 use?

The W632GG8NB-12 uses a 78-ball Very Fine Pitch Ball Grid Array (VFBGA) package measuring 8 mm × 10.5 mm with 1.0 mm thickness and 0.8 mm ball pitch. This Window BGA construction is RoHS-compliant and lead-free, as specified in Section 12 of the datasheet and confirmed in the "ORDER INFORMATION" table.

Can the W632GG8NB-12 operate at temperatures below 0°C?

No, the W632GG8NB-12 is rated for 0°C ≤ TCASE ≤ 95°C only. The base -12 speed grade does not support sub-zero operation; for industrial-grade (-40°C) capability, the W632GG8NB12I or W632GG8NB12J variants must be selected. This limitation is explicitly stated in Section 3 (ORDER INFORMATION) and Note 2 of Section 4.

How is on-die termination (ODT) configured on the W632GG8NB-12?

ODT on the W632GG8NB-12 is configured via Mode Registers MR1 (RTT_NOM) and MR2 (Rtt_WR), supporting nominal termination values of 60 Ω or 120 Ω, and dynamic write-time values of 40 Ω, 60 Ω, or 120 Ω. ODT activation is controlled by the ODT pin and timing parameters like tODT and tDQSS, as detailed in Sections 9.19 and 11.10 of the datasheet.