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Winbond Electronics Corporation W632GU6KB12I
- Part No.:
- W632GU6KB12I
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 96-TFBGA
- Datasheet:
-
W632GU6KB12I.pdf
- Description:
- IC DRAM 2GBIT 96-WBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,282
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Product details
Overview
W632GU6KB12I from Winbond Electronics is a 2 Gb (16M × 8 banks × 16-bit) DDR3L SDRAM operating at 1.35 V nominal supply, compliant with DDR3L-1600 (11-11-11) timing, rated for industrial temperature range (−40°C to +95°C), and packaged in a 96-ball WBGA (9 mm × 13 mm). It serves as main memory in embedded controllers, industrial HMIs, and network edge devices requiring low-voltage, high-reliability DRAM.
For engineers reviewing the W632GU6KB12I datasheet, W632GU6KB12I pinout, W632GU6KB12I application, or W632GU6KB12I equivalent, key selection considerations include its 1.35 V operation with 1.5 V backward compatibility, programmable CAS Write Latency (CWL = 5–8), on-die termination (ODT) with dynamic Rtt_WR support, and industrial-grade thermal stability up to 95°C case temperature.
Technical Context
This DDR3L SDRAM implements an 8-bit prefetch architecture with eight internal banks, supporting concurrent bank activation and auto-precharge. Its differential clock (CK/CK#) and bi-directional DQS/DQS# strobes enable source-synchronous double-data-rate transfers aligned by an integrated DLL.
It supports system-level calibration features including ZQ calibration for output driver and ODT impedance tuning, write leveling for timing margin optimization, and Multi-Purpose Register (MPR) readout of predefined calibration bit patterns - all essential for robust signal integrity in high-speed memory interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gb (16,777,216 words × 8 banks × 16 bits) |
| Interface Standard | JEDEC-compliant DDR3L SDRAM with 1.35 V VDD/VDDQ (1.283–1.45 V range) |
| Speed Grade | DDR3L-1600 (11-11-11), fCKMAX = 800 MHz |
| CAS Latency (CL) | Programmable CL = 6, 7, 8, 9, 10, 11 (supports down-binning to CL=7/9) |
| CAS Write Latency (CWL) | Programmable CWL = 5, 6, 7, 8 per frequency |
| Operating Temperature | Industrial grade: −40°C ≤ TCASE ≤ 95°C |
| Package | WBGA-96 (9 mm × 13 mm, RoHS-compliant, lead-free) |
| Power Modes | Self-Refresh (IDD6 ≤ 19 mA), Precharged/Active Power Down, Auto Self-Refresh (ASR) |
Pinout & Package
W632GU6KB12I uses a 96-ball fine-pitch WBGA package (9 mm × 13 mm, 0.8 mm ball pitch) with mixed power/ground distribution and dedicated VREFCA/VREFDQ reference pins for stable command/address and data I/O referencing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input | Latches all commands and addresses at cross-point; defines timing reference for all operations |
| DQS / DQS# | Differential data strobe | Source-synchronous edge-aligned with read data, center-aligned with write data; enables precise timing capture |
| RESET# | Asynchronous reset input | Triggers power-up initialization sequence and functional reset independent of clock state |
| ODT | On-die termination control | Enables/disables programmable termination resistors (RTT_NOM, RTT_WR) on DQ/DQS/DM lines |
| ZQ | Calibration reference terminal | Connects to external 240 Ω ±1 % resistor to ground for factory-trimmed output driver and ODT impedance calibration |
| VREFCA / VREFDQ | Reference voltage inputs | VREFCA sets command/address threshold (0.5 × VDD); VREFDQ sets data I/O threshold (0.5 × VDDQ) |
Key Features
| Feature | Design Value |
|---|---|
| Backward-compatible 1.5 V operation | Supports legacy DDR3 systems without hardware redesign; VDD/VDDQ tolerant to 1.5 V ± 0.075 V |
| Dynamic ODT (Rtt_WR) | Configurable termination during write bursts only, improving signal integrity without affecting read eye opening |
| Write leveling capability | Enables per-DQS group delay calibration to compensate for PCB trace skew in multi-rank layouts |
| Multi-Purpose Register (MPR) | Provides standardized 128-bit calibration pattern for system-level timing margin validation and MRS verification |
| Partial Array Self-Refresh (PASR) | Reduces self-refresh current by refreshing only active banks, extending battery life in portable industrial devices |
| Programmable additive latency (AL) | AL = 0, CL−1, or CL−2 allows flexible command scheduling to maximize bus utilization under varying load conditions |
Applications
| Industrial HMI Systems | Network Edge Routers |
|---|---|
|
Use Scenario: Touch-enabled operator interface running Linux-based UI with real-time graphics rendering. IC Role / Device Role / Timing Role: Primary system memory buffer for frame buffers, application code, and OS kernel data structures. Use Value: Industrial temperature rating (−40°C to +95°C) ensures reliable boot and operation in uncontrolled cabinet environments; DDR3L-1600 bandwidth sustains 60 fps GUI updates with minimal latency jitter. |
Use Scenario: Layer-3 packet forwarding engine handling 1 Gbps traffic with deep packet inspection. IC Role / Device Role / Timing Role: Packet buffer memory for ingress/egress queues and flow table storage in ASIC/FPGA-based datapath. Use Value: Programmable ODT and write leveling maintain signal integrity across 4-layer PCB traces up to 8 inches; PASR reduces idle power during low-traffic periods. |
| Medical Diagnostic Controllers | Railway Signaling Gateways |
|
Use Scenario: Embedded controller acquiring and preprocessing ultrasound image frames before transmission to host PC. IC Role / Device Role / Timing Role: High-throughput frame store interfacing directly to FPGA image processing pipeline via 16-bit DDR3L bus. Use Value: 1.35 V operation lowers thermal dissipation in sealed enclosures; ZQ calibration compensates for long-term drift in medical-grade power supplies. |
Use Scenario: Safety-critical ERTMS/ETCS Level 2 gateway performing protocol translation between GSM-R radio and interlocking systems. IC Role / Device Role / Timing Role: Non-volatile configuration and log storage memory accessed during cold start and fault recovery sequences. Use Value: Asynchronous RESET# enables deterministic initialization after brown-out events; ASR mode maintains data retention during extended power interruptions common in rail infrastructure. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR3L SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS43TR16256B-125KBL | Same density (2 Gb), same 96-ball WBGA, but rated for commercial temp (0°C to +95°C); no industrial −40°C guarantee | Lacks full industrial qualification; unsuitable for cold-start deployments in outdoor or transport equipment | Select only if ambient temperature remains ≥ 0°C and JEDEC industrial compliance is not required. |
| MT41K128M16JT-125K | 2 Gb DDR3L, 96-ball FBGA (same footprint), but requires separate VDDQ decoupling and lacks PASR support | No partial array self-refresh; higher IDD6 (25 mA vs. 19 mA) limits battery-backed operation duration | Prefer when using Micron-optimized PHY IP or where vendor-specific calibration features (e.g., MPR pattern) are not needed. |
Compared with IS43TR16256B-125KBL and MT41K128M16JT-125K, W632GU6KB12I uniquely delivers guaranteed −40°C operation with integrated PASR and unified ZQ calibration for both drivers and ODT - critical for energy-constrained, thermally variable industrial deployments.
Availability
W632GU6KB12I is available at Aetrix Electronics and suitable for industrial HMIs, network edge routers, and medical diagnostic controllers requiring stable component supply with long-term lifecycle assurance and consistent parametric performance across temperature extremes.
Supply support for W632GU6KB12I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including serial NOR/NAND Flash, RAM, and DRAM products for industrial, automotive, and computing markets.
The W632GU6KB12I belongs to Winbond's DDR3L SDRAM product line, designed specifically for cost-sensitive, thermally demanding embedded systems needing JEDEC-compliant low-voltage memory with industrial reliability and advanced calibration features.
FAQ
What is the maximum clock frequency supported by W632GU6KB12I?
W632GU6KB12I supports a maximum clock frequency of 800 MHz, corresponding to DDR3L-1600 data rates (1600 MT/s). This is validated under industrial temperature conditions (−40°C to +95°C) and requires tCK(AVG) ≤ 2.5 ns for CL=6/CWL=5 operation. The device also supports down-binned operation at lower frequencies with adjusted CL/CWL settings per JEDEC specification.
Does W632GU6KB12I support both 1.35 V and 1.5 V operation?
Yes, W632GU6KB12I is fully backward compatible with standard DDR3 1.5 V operation (VDD/VDDQ = 1.5 V ± 0.075 V) while maintaining full AC/DC specifications. This dual-voltage capability allows seamless migration from legacy DDR3 designs without PCB changes, provided VREFCA and VREFDQ are set to 0.5 × applied VDD/VDDQ.
How does the ZQ calibration function work on W632GU6KB12I?
W632GU6KB12I uses the ZQ pin to connect to an external 240 Ω ±1 % precision resistor to ground. During ZQ calibration commands, internal current sources adjust output driver strength and ODT resistance values to match the reference, compensating for process, voltage, and temperature variations. Calibration must be performed at power-up and periodically during operation per JEDEC requirements.
What is the purpose of the MPR (Multi-Purpose Register) in W632GU6KB12I?
The MPR in W632GU6KB12I provides a fixed 128-bit calibration pattern readable via standard READ commands. It enables system-level validation of timing margins, verifies mode register settings, and supports automated test procedures during manufacturing and field diagnostics - all without requiring custom firmware or external pattern generators.
Can W632GU6KB12I operate in Partial Array Self-Refresh (PASR) mode?
Yes, W632GU6KB12I supports PASR via MR2 programming (A2–A0 bits), allowing refresh cycles to target only selected banks. This reduces self-refresh current (IDD6) proportionally - for example, refreshing half the banks cuts IDD6 by ~30%. PASR is especially valuable in battery-powered or thermally constrained industrial devices where minimizing standby power is critical.
W632GU6KB12I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 96-TFBGA
- Packaging:
- Tray
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - DDR3L
- Memory Size:
- 2Gbit
- Memory Organization:
- 128M x 16
- Memory Interface:
- -
- Clock Frequency:
- 800 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 20 ns
- Voltage - Supply:
- 1.283V ~ 1.45V
- Operating Temperature:
- -40°C ~ 95°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 96-WBGA (9x13)
W632GU6KB12I FAQ
1.How can I place an order for W632GU6KB12I through Aetrix?
Please submit a Request for Quotation (RFQ) for W632GU6KB12I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W632GU6KB12I reliable?
The price and inventory of W632GU6KB12I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W632GU6KB12I is usually 5 days.
3.What payment methods are accepted for W632GU6KB12I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W632GU6KB12I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W632GU6KB12I?
W632GU6KB12I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W632GU6KB12I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W632GU6KB12I?
For technical support, including W632GU6KB12I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W632GU6KB12I requirements.
6.How does Aetrix verify that W632GU6KB12I is sourced from the original manufacturer or authorized distributors?
All W632GU6KB12I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W632GU6KB12I meets industry standards.
7.What is the process for return or replacement of W632GU6KB12I?
All W632GU6KB12I units undergo pre-shipment inspection (PSI). If there is an issue with W632GU6KB12I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W632GU6KB12I part is unused and in its original packaging.
Return procedure for W632GU6KB12I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W632GU6KB12I Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
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Microchip Technology
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