Winbond Electronics Corporation W632GU6KB12I TR

Overview

W632GU6KB12I TR from Winbond is a 2G-bit DDR3L SDRAM organized as 16M × 8 banks × 16 bits, operating at 1.35 V nominal supply with industrial temperature range (–40°C to +95°C), compliant with DDR3L-1600 (11-11-11) timing, and packaged in 96-ball WBGA (9 mm × 13 mm). It delivers 1600 MT/s data rates for memory subsystems in networking edge devices, industrial HMIs, and embedded controllers requiring low-voltage, high-reliability DRAM.

For engineers reviewing the W632GU6KB12I TR datasheet, W632GU6KB12I TR pinout, W632GU6KB12I TR application, or W632GU6KB12I TR equivalent, key selection criteria include its DDR3L-1600 speed grade, industrial temperature support, on-die termination (ODT) programmability, ZQ calibration capability, and asynchronous RESET# functionality - all critical for stable memory interface design in thermally demanding environments.

Technical Context

This DDR3L SDRAM implements an 8-bit prefetch architecture with eight internal banks enabling concurrent access, differential CK/CK# clocking synchronized at the cross-point, and source-synchronous DQS/DQS# strobes aligned edge-to-read-data and center-to-write-data. Its DLL aligns DQ and DQS transitions to CK, supporting precise timing control across voltage and temperature variations.

The device supports programmable CAS Latency (CL = 6, 7, 8, 9, 10, 11), CAS Write Latency (CWL = 5–8), additive latency (AL = 0, CL−1, CL−2), and dynamic ODT (Rtt_WR) with multiple RTT values. It also features Multi-Purpose Register (MPR)-based system timing calibration, write leveling, and partial array self-refresh (PASR) for power optimization in idle bank subsets.

Key Specifications

Pinout & Package

Packaged in 96-ball WBGA (9 mm × 13 mm, RoHS-compliant, lead-free), with ball pitch of 0.8 mm and standard JEDEC DDR3L footprint.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR3L SDRAM applications.

Compared with IS43TR16256B-125KBL and MT41K256M16HA-125:E, the W632GU6KB12I TR uniquely combines industrial temperature support, PASR, and full write leveling capability in a drop-in WBGA package - making it optimal for space-constrained, thermally aggressive embedded systems where memory power, timing margin, and qualification rigor are co-prioritized.

Availability

W632GU6KB12I TR is available at Aetrix Electronics and suitable for industrial HMIs, networking edge routers, medical imaging gateways, and automated test equipment requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for W632GU6KB12I TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based global supplier of specialty memory and microcontroller solutions, serving industrial, automotive, and communications markets since 1987.

The W632GU6KB series belongs to Winbond's DDR3L SDRAM product line, engineered specifically for industrial and embedded applications demanding extended temperature operation, low-voltage efficiency, and JEDEC-compliant signal integrity without design compromises.

FAQ

What is the maximum operating frequency supported by W632GU6KB12I TR?

The W632GU6KB12I TR is rated for DDR3L-1600 operation, supporting a maximum clock frequency of 800 MHz and data transfer rates up to 1600 MT/s. This is validated under industrial temperature conditions (–40°C to +95°C) with VDD/VDDQ = 1.283 V to 1.45 V and meets all AC timing parameters specified in the -12I speed bin, including tAA ≤ 13.75 ns and tRCD ≤ 13.75 ns.

Does W632GU6KB12I TR support backward compatibility with standard DDR3 (1.5 V) systems?

Yes, W632GU6KB12I TR supports backward compatibility with 1.5 V DDR3 systems. It operates with VDD/VDDQ = 1.5 V ± 0.075 V per JEDEC JESD79-3F, retaining full functionality including CAS latency settings, ODT control, and refresh modes. No hardware modification is required, though SPD programming must reflect the 1.5 V operating point for reliable initialization.

How does the ZQ calibration function work on W632GU6KB12I TR?

The W632GU6KB12I TR performs ZQ calibration by referencing an external 240 Ω ±1 % resistor connected between the ZQ pin and ground. During calibration, the device adjusts its 34 Ω output driver and ODT impedances to match this reference, compensating for process, voltage, and temperature variation. Calibration is initiated via ZQCL command and can be repeated dynamically using ZQCS for ongoing accuracy.

What is the purpose of the RESET# pin on W632GU6KB12I TR?

The RESET# pin on W632GU6KB12I TR provides asynchronous reset functionality, enabling power-up initialization and recovery from fault states without requiring stable clocks or supply ramp monitoring. When asserted low, it forces the device into a known state and triggers the internal initialization sequence, including DLL locking and mode register loading - essential for robust boot in industrial power-supply environments.

Can W632GU6KB12I TR operate in Partial Array Self-Refresh (PASR) mode?

Yes, W632GU6KB12I TR supports Partial Array Self-Refresh (PASR) via MR2 configuration (A1–A3 bits). PASR allows selective refresh of only active memory banks, reducing self-refresh current from 19 mA to as low as 9.5 mA depending on bank count. This feature is particularly valuable in battery-powered or thermally constrained applications where minimizing standby power is critical.