Winbond Electronics Corporation W632GU6KB-15

Overview

W632GU6KB-15 from Winbond is a 2G-bit DDR3L SDRAM organized as 16M × 8 banks × 16 bits, operating at 1.35 V nominal supply with DDR3L-1333 speed grade (9-9-9 CL-tRCD-tRP), supporting CAS Latency 6/7/8/9/10 and programmable CWL 5–7 for use in low-power embedded computing and industrial control memory subsystems.

For engineers reviewing the W632GU6KB-15 datasheet, W632GU6KB-15 pinout, W632GU6KB-15 application, or W632GU6KB-15 equivalent, key selection considerations include its -15 speed bin's 667 MHz max clock frequency, 1.35 V operation with 1.5 V backward compatibility, 96-ball WBGA package, and support for ZQ calibration, dynamic ODT, and write leveling in space-constrained, thermally demanding environments.

Technical Context

This DDR3L SDRAM implements an 8-bit prefetch architecture with eight internal banks enabling concurrent access, DLL-aligned DQ/DQS timing, and source-synchronous differential strobe I/O. It supports posted CAS with additive latency (AL = 0, CL−1, CL−2) and programmable read burst ordering (interleaved or nibble sequential).

Functional features include asynchronous RESET# for power-up initialization, on-die termination (ODT) with synchronous and dynamic modes, multi-purpose register (MPR) for system-level timing calibration, and partial array self-refresh (PASR) to reduce active current during idle bank states.

Key Specifications

Pinout & Package

W632GU6KB-15 uses a 96-ball Wafer-Level Ball Grid Array (WBGA) package measuring 9 mm × 13 mm with 0.8 mm ball pitch. The ball map follows JEDEC-standard DDR3L pinout for 16-bit x8-bank configuration, including dedicated DQ/DQS pairs, address/command banks, and dual VREF inputs (VREFCA for commands, VREFDQ for data).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR3L SDRAM applications.

Compared with MT41K256M16HA-125:A and IS43TR16256B-15KBL, W632GU6KB-15 offers optimized thermal margin at 95°C with JEDEC-validated refresh doubling, simpler AL/CWL configuration for mid-range controllers, and Winbond-specific ZQ tolerance handling - making it preferred for cost-sensitive, thermally constrained industrial deployments.

Availability

W632GU6KB-15 is available at Aetrix Electronics and suitable for industrial PLC memory buffers, medical imaging frame stores, automotive ADAS camera hubs, and network edge router packet buffers requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for W632GU6KB-15 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including SPI NOR/NAND Flash, PSRAM, and low-power DRAM products for industrial, automotive, and consumer markets.

The W632GU6KB series belongs to Winbond's DDR3L SDRAM product line, designed specifically for energy-efficient, thermally robust memory subsystems in space-constrained embedded applications where 1.35 V operation and extended temperature support are mandatory.

FAQ

What is the maximum clock frequency supported by W632GU6KB-15?

W632GU6KB-15 supports a maximum clock frequency of 667 MHz (tCK = 1.5 ns), corresponding to the DDR3L-1333 speed grade with 9-9-9 timing (CL-tRCD-tRP). This is confirmed in Section 4 (KEY PARAMETERS) of the datasheet, where fCKMAX is specified as 667 MHz for the -15 speed grade. Operation beyond this frequency violates AC timing specifications and may cause data corruption.

Does W632GU6KB-15 support both 1.35 V and 1.5 V supply voltages?

Yes, W632GU6KB-15 operates at 1.35 V nominal (VDD/VDDQ = 1.283–1.45 V) and is fully backward compatible with 1.5 V ±0.075 V DDR3 systems. Section 11 of the datasheet explicitly confirms functional and timing compliance at 1.5 V, allowing drop-in replacement in legacy DDR3 designs without hardware modification - provided VREFCA and VREFDQ are adjusted accordingly.

How does the RESET# pin function on W632GU6KB-15?

The RESET# pin on W632GU6KB-15 is an asynchronous, active-low input that initiates power-up initialization and resets internal state machines regardless of clock status. As described in Section 8.2, it must be held low for ≥200 ns after VDD/VDDQ stabilization, then released to allow automatic entry into NOP mode and subsequent mode register programming - a requirement for reliable boot sequencing in embedded systems.

What is the purpose of the ZQ pin on W632GU6KB-15?

The ZQ pin on W632GU6KB-15 connects to a 240 Ω ±1 % external resistor to ground and enables on-die impedance calibration of output drivers and ODT networks. Per Section 8.18, ZQ calibration corrects for process/voltage/temperature drift, ensuring consistent 34 Ω driver strength and 40/60/120 Ω ODT values - critical for maintaining signal integrity across varying operating conditions.

Can W632GU6KB-15 operate at 95°C case temperature?

Yes, W632GU6KB-15 is rated for 0°C ≤ TCASE ≤ 95°C and fully complies with JEDEC AC/DC specifications across this range. Section 4 confirms that -15 speed grade devices support 95°C operation with doubled auto-refresh frequency (tREFI = 3.9 µS), either via Manual Self-Refresh (MR2 A6=0, A7=1) or Auto Self-Refresh (MR2 A6=1). This makes W632GU6KB-15 suitable for fanless industrial enclosures.