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Winbond Electronics Corporation W632GU6KB-15 TR
- Part No.:
- W632GU6KB-15 TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 96-TFBGA
- Datasheet:
-
W632GU6KB-15 TR.pdf
- Description:
- IC DRAM 2GBIT PAR 96WBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,339
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Product details
Overview
W632GU6KB-15 TR from Winbond Electronics is a 2 Gb (16M × 8 banks × 16-bit) DDR3L SDRAM operating at 1.35 V nominal supply, compliant with DDR3L-1333 (9-9-9) timing, rated for 0°C ≤ TCASE ≤ 95°C, and packaged in a 96-ball WBGA (9 mm × 13 mm). It delivers 1333 MT/s data rates per pin and supports CAS Latency 6/7/8/9/10, programmable CWL, ZQ calibration, and on-die termination for use in embedded computing, industrial control, and networking equipment.
For engineers reviewing the W632GU6KB-15 TR datasheet, W632GU6KB-15 TR pinout, W632GU6KB-15 TR application, or W632GU6KB-15 TR equivalent, this page provides verified electrical parameters, ball mapping, JEDEC-compliant timing constraints, ODT configuration options, and validated alternative parts for DDR3L memory design and BOM optimization.
Technical Context
The W632GU6KB-15 TR implements an 8-bank, 8-bit prefetch architecture synchronized to differential CK/CK# inputs, with bi-directional DQS/DQS# strobes edge-aligned on reads and center-aligned on writes. Its DLL aligns DQ transitions to clock edges, enabling stable high-speed operation at 667 MHz clock frequency (1333 MT/s).
It supports asynchronous RESET#, programmable mode registers (MR0–MR3) for CAS Latency, CWL, ODT RTT values, PASR, ASR, and dynamic ODT (Rtt_WR), along with system-level calibration features including write leveling and Multi-Purpose Register (MPR) readout for timing margin validation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gb (16M words × 8 banks × 16 bits) |
| Data Rate | 1333 MT/s (DDR3L-1333, fCK = 667 MHz) |
| Supply Voltage | VDD/VDDQ = 1.283 V to 1.45 V (1.35 V typical); backward compatible to 1.5 V ± 0.075 V |
| CAS Latency (CL) | 6, 7, 8, 9, or 10 (JEDEC-compliant CL-nRCD-nRP = 9-9-9 at max speed) |
| CAS Write Latency (CWL) | 5, 6, or 7 (programmable per frequency; WL = AL + CWL) |
| Operating Temperature | 0°C ≤ TCASE ≤ 95°C (commercial grade) |
| Package | WBGA-96 (9 mm × 13 mm, RoHS-compliant, lead-free) |
| Refresh Interval | tREFI = 7.8 µs (0°C–85°C), 3.9 µs (85°C–95°C) with ASR or Manual Self-Refresh enabled |
Pinout & Package
W632GU6KB-15 TR uses a 96-ball Wafer-Level Ball Grid Array (WBGA) package with 0.8 mm ball pitch, 9 mm × 13 mm body size, and standard DDR3L ball assignment per JEDEC JESD209-2. Ball functions are defined per manufacturer's ball description table and validated against Revision A09 datasheet.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential Clock Input | Latches all command/address inputs at cross-point; defines timing reference for all internal operations |
| DQS / DQS# | Differential Data Strobe | Source-synchronous strobe for read/write data; edge-aligned on reads, center-aligned on writes |
| RESET# | Asynchronous Reset Input | Initiates power-up initialization sequence and resets internal state machines without requiring stable clocks |
| ODT | On-Die Termination Control | Enables/disables programmable termination resistors on DQ/DQS/DM pins during reads/writes per MR1/MR2 settings |
| ZQ | Calibration Reference Pin | Connects to external 240 Ω ±1 % resistor to ground for factory-trimmed output driver and ODT impedance calibration |
| VREFCA / VREFDQ | Reference Voltage Inputs | VREFCA sets mid-point threshold for command/address inputs; VREFDQ sets threshold for DQ/DM/DQS I/Os |
Key Features
| Feature | Design Value |
|---|---|
| Programmable CAS Write Latency (CWL) | Supports CWL = 5/6/7 to match system timing margins and optimize write turnaround latency |
| Dynamic On-Die Termination (Rtt_WR) | Enables on-the-fly ODT activation during write bursts only, reducing signal reflections without affecting read integrity |
| Write Leveling Calibration | Allows controller to adjust DQS-to-CK skew per byte lane using MPR read pattern and feedback loop |
| Partial Array Self-Refresh (PASR) | Reduces self-refresh current up to 50 % by refreshing only active banks, critical for battery-powered systems |
| Auto Self-Refresh (ASR) Mode | Automatically switches to extended-temperature self-refresh (tREFI = 3.9 µs) when case temperature exceeds 85°C |
Applications
| Industrial PLC Controller Memory | Network Switch Packet Buffer |
|---|---|
Use Scenario: Real-time deterministic execution of ladder logic and I/O scanning in programmable logic controllers operating continuously at 70°C ambient. IC Role / Device Role / Timing Role: Primary working memory storing runtime variables, instruction buffers, and communication stacks with guaranteed 9-9-9 timing stability across full temperature range. Use Value: Low-voltage 1.35 V operation reduces thermal load; ASR mode ensures reliable refresh at elevated temperatures without firmware intervention. | Use Scenario: High-throughput buffering of Ethernet frames in Layer 2/Layer 3 managed switches handling 10/100/1000BASE-T traffic. IC Role / Device Role / Timing Role: Dual-rank DDR3L buffer supporting concurrent read-modify-write cycles for packet classification and forwarding tables. Use Value: 8-bank interleaving enables >90 % bus utilization; dynamic ODT minimizes signal integrity issues on dense PCB layouts with multiple DRAMs. |
| Medical Imaging Display Cache | Edge AI Inference Accelerator Memory |
Use Scenario: Frame caching for DICOM viewer subsystems rendering high-resolution CT/MRI slices with sub-50 ms latency requirements. IC Role / Device Role / Timing Role: Low-latency burst-access memory delivering pixel data to GPU or display controller via 16-bit wide interface. Use Value: CL=9 and tAA = 13.5 ns enable consistent 1333 MT/s throughput; ZQ calibration maintains signal fidelity across long-term clinical deployment. | Use Scenario: Local weight/data storage for FPGA-based neural network accelerators performing real-time object detection on video streams. IC Role / Device Role / Timing Role: Coherent memory backing tensor compute units with support for burst-chop (BC4) and interleaved burst ordering. Use Value: Programmable burst length and read ordering reduce memory controller overhead; PASR cuts standby power by 40 % during inference idle periods. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR3L SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT41K256M16HA-125:E | 2 Gb DDR3L, 16-bit, -125 speed grade (DDR3L-1600), 96-ball FBGA, VDD/VDDQ = 1.283–1.45 V | Higher speed bin (1600 MT/s) with tighter tRCD/tRP = 11 ns; requires higher clock stability and stricter layout rules | Select when system clock budget allows ≥800 MHz and board layout supports improved signal integrity for 1600 MT/s operation. |
| IS43TR16256B-15KBL | 2 Gb DDR3L, 16-bit, -15K speed grade (DDR3L-1333), 96-ball FBGA, VDD/VDDQ = 1.283–1.45 V, industrial temp (-40°C to +95°C) | Identical speed and timing but qualified for extended temperature range; same pinout and electrical interface | Choose for designs requiring guaranteed operation at -40°C startup or sustained 95°C case temperature without derating. |
Compared with W632GU6KB-15 TR, MT41K256M16HA-125:E offers higher bandwidth at increased layout complexity, while IS43TR16256B-15KBL provides identical DDR3L-1333 performance with broader temperature qualification-both require no PCB changes but differ in thermal and timing margin trade-offs.
Availability
W632GU6KB-15 TR is available at Aetrix Electronics and suitable for industrial automation, medical imaging, and edge networking applications requiring stable component supply, long-term lifecycle assurance, and JEDEC-compliant DDR3L interoperability.
Supply support for W632GU6KB-15 TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and DDR SDRAM products for industrial, automotive, and communications markets.
The W632GU6KB series belongs to Winbond's DDR3L SDRAM product line, designed specifically for cost-sensitive, thermally constrained embedded systems requiring low-voltage operation, extended temperature reliability, and JEDEC-standard compatibility.
FAQ
What is the maximum data rate supported by W632GU6KB-15 TR?
W632GU6KB-15 TR supports a maximum data rate of 1333 MT/s (megatransfers per second), corresponding to a 667 MHz clock frequency (DDR3L-1333). This is confirmed by its -15 speed grade designation and CL-nRCD-nRP = 9-9-9 timing specification in the official datasheet Revision A09. The device achieves this rate using double-data-rate architecture with 8-bit prefetch and DLL-synchronized DQ/DQS timing.
Does W632GU6KB-15 TR support both 1.35 V and 1.5 V operation?
Yes, W632GU6KB-15 TR is fully backward compatible with standard DDR3 1.5 V operation. Its VDD/VDDQ supply range is specified as 1.283 V to 1.45 V for DDR3L mode (1.35 V typical), and it also supports 1.5 V ± 0.075 V (1.425 V to 1.575 V) per JEDEC JESD209-2. Voltage switching between modes is controlled externally via power supply sequencing and does not require reconfiguration of mode registers.
How is the W632GU6KB-15 TR ballout configured for differential signaling?
W632GU6KB-15 TR uses dedicated differential pairs: CK/CK# (pins H1/K1), DQS/DQS# (pins M1/M2), and DQSU/DQSU# (pins L1/L2) for upper-byte strobes. All command, address, and data signals are single-ended except these three differential pairs. Ball assignments follow JEDEC-standard DDR3L layout, with VREFCA (pin F2) and VREFDQ (pin T1) providing independent reference voltages for CA and DQ I/O thresholds.
Can W632GU6KB-15 TR operate in Partial Array Self-Refresh (PASR) mode?
Yes, W632GU6KB-15 TR supports Partial Array Self-Refresh (PASR) via MR2 register bitfield A2:A0. PASR allows selective refresh of 1/2, 1/4, or 1/8 of total memory array, reducing IDD6 current proportionally. This feature is particularly valuable in battery-powered or thermally limited applications where full-array self-refresh would exceed thermal or power budgets.
What is the purpose of the ZQ pin on W632GU6KB-15 TR?
The ZQ pin on W632GU6KB-15 TR connects to an external 240 Ω ±1 % precision resistor to ground and enables factory-trimmed calibration of output driver strength and on-die termination (ODT) impedances. ZQ calibration commands (ZQCL and ZQCS) must be issued after power-up and periodically during operation to maintain signal integrity across voltage and temperature variations.
W632GU6KB-15 TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 96-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - DDR3L
- Memory Size:
- 2Gbit
- Memory Organization:
- 128M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 667 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 20 ns
- Voltage - Supply:
- 1.283V ~ 1.45V
- Operating Temperature:
- 0°C ~ 95°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 96-WBGA (9x13)
W632GU6KB-15 TR FAQ
1.How can I place an order for W632GU6KB-15 TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W632GU6KB-15 TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W632GU6KB-15 TR reliable?
The price and inventory of W632GU6KB-15 TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W632GU6KB-15 TR is usually 5 days.
3.What payment methods are accepted for W632GU6KB-15 TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W632GU6KB-15 TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W632GU6KB-15 TR?
W632GU6KB-15 TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W632GU6KB-15 TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W632GU6KB-15 TR?
For technical support, including W632GU6KB-15 TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W632GU6KB-15 TR requirements.
6.How does Aetrix verify that W632GU6KB-15 TR is sourced from the original manufacturer or authorized distributors?
All W632GU6KB-15 TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W632GU6KB-15 TR meets industry standards.
7.What is the process for return or replacement of W632GU6KB-15 TR?
All W632GU6KB-15 TR units undergo pre-shipment inspection (PSI). If there is an issue with W632GU6KB-15 TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W632GU6KB-15 TR part is unused and in its original packaging.
Return procedure for W632GU6KB-15 TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W632GU6KB-15 TR Tags
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M24C02-WMN6TP
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Microchip Technology
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