Winbond Electronics Corporation W632GU6MB-15

Overview

W632GU6MB-15 from Winbond is a 2G-bit DDR3L SDRAM organized as 16M × 8 banks × 16 bits, operating at 1.35V nominal supply with DDR3L-1333 (9-9-9) timing, supporting CAS Latency 5–10 and CWL 5–7, and designed for low-power embedded systems requiring stable memory in industrial temperature range (0°C to 95°C).

For engineers reviewing the W632GU6MB-15 datasheet, W632GU6MB-15 pinout, W632GU6MB-15 application, or W632GU6MB-15 equivalent, key selection criteria include its VFBGA-96 package, 1.35V operation with 1.5V backward compatibility, ZQ calibration support, programmable ODT, and DDR3L-1333 speed bin compliance.

Technical Context

This DDR3L SDRAM implements an 8-bit prefetch architecture with eight internal banks enabling concurrent access, DLL-aligned DQ/DQS timing, and source-synchronous differential strobe (DQS/DQS#) I/O synchronized to CK/CK#. It supports posted CAS with additive latency (AL = 0, CL−1, CL−2), auto-precharge, and burst lengths of 8 or 4 (OTF selectable).

Functional features include asynchronous RESET# for power-up initialization, multi-purpose register (MPR) for system-level timing calibration, write leveling for DQ-to-DQS skew compensation, and dynamic ODT (Rtt_WR) with programmable termination impedances during write operations - all compliant with JEDEC DDR3L standards.

Key Specifications

Pinout & Package

VFBGA-96 package with 7.5 mm × 13 mm footprint, 0.8 mm ball pitch, and 1.0 mm maximum thickness. Ball layout conforms to JEDEC MO-275AC standard.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR3L SDRAM applications.

Compared with MT41K128M16JT-125:K and IS43TR16128B-15HBL, the W632GU6MB-15 offers native 1.35 V operation with guaranteed DDR3L-1333 timing, making it optimal for thermally constrained industrial designs where voltage scaling and temperature margin are critical - unlike the Micron part, and more broadly qualified than the ISSI part for commercial-temp use cases.

Availability

W632GU6MB-15 is available at Aetrix Electronics and suitable for industrial HMI panels, network router buffers, medical diagnostic displays, and smart energy meters requiring stable component supply with guaranteed long-term availability and JEDEC-compliant DDR3L performance.

Supply support for W632GU6MB-15 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including SPI NOR Flash, DDR SDRAM, and mobile LPDRAM.

The W632GU6MB series belongs to Winbond's DDR3L SDRAM product line, engineered for cost-sensitive industrial and embedded applications demanding low-voltage operation, extended temperature reliability, and JEDEC-standard interoperability.

FAQ

What is the maximum clock frequency supported by W632GU6MB-15?

The W632GU6MB-15 supports a maximum clock frequency of 667 MHz, corresponding to DDR3L-1333 data rate (1333 MT/s). This is validated under JEDEC-specified conditions with tCK(AVG) = 1.5 ns minimum for CL=9/CWL=7 operation and VDD/VDDQ = 1.283 V to 1.45 V. The device does not support higher speed bins such as DDR3L-1600.

Does W632GU6MB-15 support both 1.35 V and 1.5 V operation?

Yes, W632GU6MB-15 supports dual-voltage operation: native 1.35 V DDR3L mode (1.283 V–1.45 V) and backward-compatible 1.5 V DDR3 mode (1.425 V–1.575 V). Voltage switching must follow JEDEC-specified sequencing - VDD/VDDQ must ramp together, and mode register settings (MR) must be reprogrammed after voltage change to match the new VDD level.

What package type and ball count does W632GU6MB-15 use?

W632GU6MB-15 uses a VFBGA-96 package with 7.5 mm × 13 mm body size, 0.8 mm ball pitch, and 1.0 mm maximum height. It complies with JEDEC MO-275AC mechanical specifications and is lead-free/RoHS-compliant. The ball map includes dedicated DQS/DQS#, CK/CK#, and ODT control terminals required for DDR3L timing compliance.

How does W632GU6MB-15 handle refresh at elevated temperatures?

At case temperatures above 85°C (up to 95°C), W632GU6MB-15 requires doubled refresh rate (tREFI = 3.9 µS instead of 7.8 µS). This is achieved either by enabling Auto Self-Refresh (ASR) via MR2[7:6] = 10b or by entering Manual Self-Refresh mode. Standard periodic refresh commands are insufficient above 85°C without these configurations.

Can W632GU6MB-15 be used with write leveling and MPR for system calibration?

Yes, W632GU6MB-15 fully supports write leveling and Multi-Purpose Register (MPR) functions. Write leveling allows the memory controller to calibrate DQS-to-CK delay for accurate write capture. MPR outputs a fixed 0x00000000 pattern on DQ pins when enabled, enabling system-level timing margin testing - both features are documented in sections 8.9 and 8.10 of the W632GU6MB-15 datasheet.