Winbond Electronics Corporation W632GU6MB-15 TR

Overview

W632GU6MB-15 TR from Winbond is a 2G-bit DDR3L SDRAM organized as 16M × 8 banks × 16 bits, operating at 1.35 V nominal supply with DDR3L-1333 (9-9-9) timing, supporting CAS Latency 5–10 and CWL 5–7, and designed for embedded computing, industrial control, and networking systems requiring low-voltage memory with extended temperature operation up to 95°C.

For engineers reviewing the W632GU6MB-15 TR datasheet, W632GU6MB-15 TR pinout, W632GU6MB-15 TR application, or W632GU6MB-15 TR equivalent, key selection considerations include its VFBGA-96 package, 1.35 V DDR3L compliance with backward 1.5 V support, programmable ODT and ZQ calibration, and industrial-grade thermal range without requiring voltage scaling changes in legacy DDR3 designs.

Technical Context

This DDR3L SDRAM implements an 8-bit prefetch architecture with eight internal banks enabling concurrent access, DLL-aligned DQ/DQS timing, and source-synchronous differential strobe (DQS/DQS#) I/O synchronized to CK/CK#. It supports posted CAS with additive latency (AL = 0, CL−1, CL−2), auto-precharge, and burst lengths of 8 or 4 via mode register or on-the-fly selection.

Functional features include asynchronous RESET# for power-up initialization, multi-purpose register (MPR) for system-level timing calibration, write leveling for DQ-to-DQS skew compensation, and dynamic ODT (Rtt_WR) with programmable termination impedances during write operations - all compliant with JEDEC DDR3L standards and compatible with standard DDR3 controllers.

Key Specifications

Pinout & Package

VFBGA-96 package with 7.5 mm × 13 mm footprint, 0.8 mm ball pitch, and RoHS-compliant lead-free construction. Ball map defined per JEDEC MO-270B standard.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR3L SDRAM applications.

Compared with MT41K128M16JT-125:K and IS43TR16128B-15HBL, W632GU6MB-15 TR offers native 1.35 V operation without voltage translation, identical 96-ball layout for drop-in replacement in existing DDR3L layouts, and optimized IDD values for industrial thermal profiles - making it the most direct fit for cost-sensitive, thermally constrained embedded systems.

Availability

W632GU6MB-15 TR is available at Aetrix Electronics and suitable for industrial automation, network infrastructure, and medical electronics requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for W632GU6MB-15 TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and DRAM products for industrial, automotive, and communications markets.

The W632GU6MB series belongs to Winbond's DDR3L SDRAM product line, engineered for low-power, high-reliability embedded applications where voltage efficiency, thermal robustness, and JEDEC compliance are mandatory - particularly targeting programmable logic, networking, and real-time control systems.

FAQ

What is the maximum clock frequency supported by W632GU6MB-15 TR?

W632GU6MB-15 TR supports a maximum clock frequency of 667 MHz, corresponding to DDR3L-1333 data rates (1333 MT/s). This is validated under 1.283–1.45 V supply and 0°C to 95°C case temperature, with tCK(AVG) = 1.5–3.3 ns depending on CAS Latency setting. The -15 speed grade is specifically binned and tested to meet 9-9-9 timing (tRCD/tRP/tAA = 9 ns each at 667 MHz).

Does W632GU6MB-15 TR support both 1.35 V and 1.5 V operation?

Yes, W632GU6MB-15 TR is fully backward-compatible with 1.5 V DDR3 systems. It operates within VDD/VDDQ = 1.283 V to 1.45 V for DDR3L mode and accepts 1.5 V ± 0.075 V (1.425–1.575 V) for legacy DDR3 compatibility. Voltage switching between modes is supported per JEDEC specification, and no hardware modification is required to use W632GU6MB-15 TR in either configuration.

What package type and ball count does W632GU6MB-15 TR use?

W632GU6MB-15 TR uses a VFBGA-96 package measuring 7.5 mm × 13 mm with 1.0 mm thickness and 0.8 mm ball pitch. It conforms to JEDEC MO-270B mechanical standards and is lead-free/RoHS compliant. The 96-ball layout includes dedicated power, ground, address, command, data, strobe, and control terminals as defined in the official Winbond ball description table.

How does the RESET# pin function on W632GU6MB-15 TR?

The RESET# pin on W632GU6MB-15 TR is an asynchronous, active-low input that initiates power-up initialization and functional reset. When asserted, it forces the device into a known precharge-all state, clears internal registers, and triggers DLL reset and ZQ calibration upon release - all independent of clock stability. This ensures deterministic startup in systems with uncontrolled power sequencing.

Can W632GU6MB-15 TR be used in systems requiring extended temperature operation beyond 95°C?

No, W632GU6MB-15 TR is rated for 0°C ≤ T_CASE ≤ 95°C. For operation up to 105°C, Winbond offers the W632GU6MB-15J variant, which shares identical electrical and timing specifications but is qualified across the extended industrial-plus range. Substituting W632GU6MB-15 TR in >95°C environments risks timing violations and reduced reliability due to unvalidated thermal derating.