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Winbond Electronics Corporation W632GU6NB15I
- Part No.:
- W632GU6NB15I
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 96-VFBGA
- Datasheet:
-
W632GU6NB15I.pdf
- Description:
- IC DRAM 2GBIT PAR 96VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,305
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Product details
Overview
W632GU6NB15I from Winbond is a 2G-bit DDR3L SDRAM organized as 16M × 8 banks × 16 bits, operating at DDR3L-1333 speed (9-9-9 CL-tRCD-tRP), with 1.35V nominal supply (1.283–1.45V range), industrial temperature support (−40°C to +95°C), and VFBGA-96 (7.5 × 13 mm) packaging. It delivers reliable memory buffering for embedded controllers, network edge devices, and industrial HMIs requiring low-voltage, JEDEC-compliant DDR3L operation.
For engineers reviewing the W632GU6NB15I datasheet, W632GU6NB15I pinout, W632GU6NB15I application, or W632GU6NB15I equivalent, key selection considerations include its DDR3L-1333 timing (tCK = 1.5 ns min), CAS Write Latency (CWL = 5–7), on-die termination (ODT), ZQ calibration support, and industrial-grade thermal reliability without voltage derating.
Technical Context
This device implements an 8-bank, 8-bit prefetch DDR3L architecture with synchronous command decoding via differential CK/CK# inputs and source-synchronous I/O using DQS/DQS# strobes. It supports programmable CAS Latency (CL = 5–10), additive latency (AL = 0, CL−1, CL−2), and posted CAS for optimized bus efficiency.
Functional features include asynchronous RESET#, dynamic ODT (Rtt_WR), multi-purpose register (MPR) for system-level timing calibration, write leveling, partial array self-refresh (PASR), and auto self-refresh (ASR) - all compliant with JEDEC DDR3L standard JESD79-3F and backward-compatible with 1.5V DDR3 systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gb (16M × 8 banks × 16 bits) |
| Data Rate | DDR3L-1333: 1333 MT/s (667 MHz clock, tCK = 1.5 ns min) |
| Supply Voltage | VDD/VDDQ = 1.283 V to 1.45 V (1.35 V typical); supports 1.5 V DDR3 backward compatibility |
| Operating Temp | −40°C ≤ TCASE ≤ +95°C (industrial grade) |
| CAS Latency | CL = 5, 6, 7, 8, 9, 10 (JEDEC-compliant timing) |
| CAS Write Latency | CWL = 5, 6, 7 (programmable per frequency) |
| Package | VFBGA-96 (7.5 mm × 13 mm, 1.0 mm height, RoHS/lead-free) |
| Refresh Interval | tREFI = 7.8 µs (0–85°C), 3.9 µs (85–95°C) with ASR/PASR support |
Pinout & Package
VFBGA-96 package (7.5 mm × 13 mm, 1.0 mm thickness) with ball pitch of 0.8 mm; RoHS-compliant, lead-free construction per JEDEC MO-276AB.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A13 | Address Inputs | Row/column address for bank and page access; multiplexed with BA0–BA2 for bank select |
| BA0–BA2 | Bank Address | Selects one of eight internal banks; latched with A0–A13 during ACTIVATE |
| CK, CK# | Differential Clock | Edge-triggered command latch reference; inputs sampled at cross-point (CK↑ / CK#↓) |
| CS#, RAS#, CAS#, WE# | Command Control | Active-low command decode signals; define ACT, READ, WRITE, PRE, REF, MRS operations |
| RESET# | Asynchronous Reset | Initiates power-up initialization sequence and resets internal state machines |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; source-synchronized with DQS/DQS# |
| DQS, DQS# | Differential Strobe | Source-synchronous strobe pair; center-aligned on WRITE, edge-aligned on READ |
| DM0–DM1 | Data Mask | Per-byte write mask for DQ0–7 (DM0) and DQ8–15 (DM1); suppresses masked write data |
| ODT | On-Die Termination Enable | Controls dynamic ODT activation during WRITE bursts per MR1 configuration |
| ZQ | ZQ Calibration Reference | Connects to external 240 Ω ±1% resistor to ground for output driver and ODT impedance tuning |
Key Features
| Feature | Design Value |
|---|---|
| Programmable CWL | Enables precise write timing alignment across DDR3L-1333 frequencies (CWL = 5–7), reducing setup/hold violations in high-noise layouts |
| Dynamic ODT (Rtt_WR) | Activates on-die termination only during WRITE bursts (per MR2), improving signal integrity without affecting read paths or static power |
| Write Leveling Support | Allows controller-driven DQS-to-CK skew calibration during initialization, essential for stable 1333 MT/s operation across PCB trace mismatches |
| Multi-Purpose Register (MPR) | Provides predefined calibration bit pattern (0x00000000) for system-level timing margin validation without disturbing memory contents |
| Auto Self-Refresh (ASR) | Automatically doubles refresh rate at elevated temperatures (85–95°C), eliminating need for host-initiated refresh adjustments in thermally variable environments |
Applications
| Industrial HMI Controller | Network Edge Router |
|---|---|
Use Scenario: Touch-enabled factory-floor operator interface with real-time graphics rendering and local data logging. IC Role / Device Role / Timing Role: Primary working memory for ARM Cortex-A9/A15-based SoC, buffering UI frame buffers and application code under continuous thermal cycling. Use Value: −40°C to +95°C rating ensures uninterrupted operation in unconditioned enclosures; DDR3L-1333 bandwidth meets 60 fps GUI update requirements without 1.5V rail overhead. | Use Scenario: Compact Layer 3 switch handling VLAN routing, QoS packet classification, and SNMP agent tasks. IC Role / Device Role / Timing Role: Shared system memory for packet buffering and forwarding table storage in dual-core MIPS-based control plane. Use Value: VFBGA-96 footprint enables dense PCB layout; dynamic ODT and write leveling ensure signal integrity across 4-layer backplane traces at 1333 MT/s. |
| Medical Diagnostic Display | Smart Energy Gateway |
Use Scenario: Portable ultrasound display unit requiring deterministic frame capture, image processing, and DICOM export. IC Role / Device Role / Timing Role: Low-power SDRAM for FPGA-accelerated image pipeline and ARM application processor coherency domain. Use Value: 1.35V operation reduces thermal load in sealed chassis; PASR allows selective bank refresh during idle periods, cutting IDD6 by >30% vs full-array self-refresh. | Use Scenario: DIN-rail mounted grid communication gateway aggregating smart meter data over PRIME/IEEE 1901.2 and cellular backhaul. IC Role / Device Role / Timing Role: Runtime memory for Linux RTOS, protocol stacks, and encrypted firmware updates in extended-temperature field deployments. Use Value: Industrial temp grade eliminates derating concerns at 70°C ambient; ZQ calibration maintains impedance stability across 10-year field life with minimal drift. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR3L SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS43TR16128B-15KBL | Same density (2Gb), VFBGA-96, DDR3L-1333, but rated −40°C to +85°C (not +95°C); CWL max = 6 | Lacks extended 95°C support and PASR/ASR features; no MPR mode | Acceptable where ambient stays ≤85°C and advanced calibration features are unused |
| MT41K128M16HA-125:E | Higher speed grade (DDR3L-1600), same package, −40°C to +95°C, but requires tighter tRC/tRAS timing margins | Delivers 20% higher bandwidth but increases layout sensitivity and power draw (~15% higher IDD4W) | Preferred when system demands >1333 MT/s and board layout supports stricter timing closure |
Compared with W632GU6NB15I, IS43TR16128B-15KBL offers identical pinout and basic DDR3L-1333 functionality but omits industrial+ thermal headroom and advanced power management; MT41K128M16HA-125:E provides higher performance at the cost of increased design complexity and thermal budget.
Availability
W632GU6NB15I is available at Aetrix Electronics and suitable for industrial HMIs, network edge routers, medical diagnostic displays, and smart energy gateways requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for W632GU6NB15I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including NOR/NAND Flash, SRAM, and DRAM products for industrial, automotive, and communications markets.
The W632GU6NB series belongs to Winbond's industrial-grade DDR3L SDRAM product line, designed specifically for embedded systems demanding robust thermal performance, JEDEC compliance, and long-term supply assurance in harsh environments.
FAQ
What is the maximum operating frequency supported by W632GU6NB15I?
W632GU6NB15I supports DDR3L-1333 operation with a maximum clock frequency of 667 MHz (tCK = 1.5 ns minimum). Its AC timing parameters are validated for CL = 9, tRCD = 9, tRP = 9 cycles at this speed, and it remains fully JEDEC-compliant across its specified industrial temperature range (−40°C to +95°C).
Does W632GU6NB15I support backward compatibility with standard 1.5V DDR3 systems?
Yes, W632GU6NB15I supports dual-voltage operation: it functions at 1.35V nominal (DDR3L mode) and is backward compatible with 1.5V ± 0.075V DDR3 systems. This allows seamless integration into legacy designs without hardware modification, provided VDD/VDDQ are set to 1.5V and appropriate timing parameters are applied per JEDEC JESD79-3F Annex C.
How does the ZQ calibration function work on W632GU6NB15I?
W632GU6NB15I uses its dedicated ZQ pin to connect to a 240 Ω ±1% external resistor to ground. During ZQCAL commands, the device measures this reference to calibrate internal output driver strength and on-die termination (ODT) impedances. Calibration occurs at power-up, after reset, and can be retriggered dynamically to compensate for voltage/temperature drift, ensuring consistent signal integrity over time.
What is the purpose of the Multi-Purpose Register (MPR) in W632GU6NB15I?
The MPR in W632GU6NB15I outputs a fixed 0x00000000 pattern on DQ lines when activated via MRS. This known bit sequence enables system-level timing margin testing - such as eye diagram analysis or write leveling verification - without reading actual memory contents or disrupting active operations, making it critical for production test and field calibration.
Can W632GU6NB15I operate reliably at 95°C case temperature?
Yes, W632GU6NB15I is explicitly qualified for −40°C to +95°C case temperature operation (industrial grade). At temperatures above 85°C, it automatically doubles refresh rate (tREFI = 3.9 µs) via Auto Self-Refresh (ASR) or Manual Self-Refresh with MR2 configuration, ensuring data retention without host intervention - a key differentiator from commercial-grade DDR3L parts.
W632GU6NB15I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 96-VFBGA
- Packaging:
- Tray
- Product Status:
- Last Time Buy
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - DDR3L
- Memory Size:
- 2Gbit
- Memory Organization:
- 128M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 667 MHz
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 20 ns
- Voltage - Supply:
- 1.283V ~ 1.45V
- Operating Temperature:
- -40°C ~ 95°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 96-VFBGA (7.5x13)
W632GU6NB15I FAQ
1.How can I place an order for W632GU6NB15I through Aetrix?
Please submit a Request for Quotation (RFQ) for W632GU6NB15I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W632GU6NB15I reliable?
The price and inventory of W632GU6NB15I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W632GU6NB15I is usually 5 days.
3.What payment methods are accepted for W632GU6NB15I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W632GU6NB15I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W632GU6NB15I?
W632GU6NB15I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W632GU6NB15I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W632GU6NB15I?
For technical support, including W632GU6NB15I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W632GU6NB15I requirements.
6.How does Aetrix verify that W632GU6NB15I is sourced from the original manufacturer or authorized distributors?
All W632GU6NB15I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W632GU6NB15I meets industry standards.
7.What is the process for return or replacement of W632GU6NB15I?
All W632GU6NB15I units undergo pre-shipment inspection (PSI). If there is an issue with W632GU6NB15I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W632GU6NB15I part is unused and in its original packaging.
Return procedure for W632GU6NB15I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W632GU6NB15I Tags
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