Winbond Electronics Corporation W632GU8KB12I

Overview

W632GU8KB12I from Winbond is a 2Gb (256M × 8) DDR3L SDRAM organized in eight internal banks, operating at 1.35V nominal supply with support for DDR3L-1600 (11-11-11) timing and industrial temperature range (–40°C to +95°C). It delivers 1600 Mb/sec/pin data rates, features programmable CAS Latency (CL = 6, 7, 8, 9, 10, 11), on-die termination (ODT), ZQ calibration, and asynchronous RESET#-used in embedded controllers, networking processors, and industrial SoC memory subsystems.

For engineers reviewing the W632GU8KB12I datasheet, W632GU8KB12I pinout, W632GU8KB12I application, or W632GU8KB12I equivalent, this page provides verified DDR3L timing compliance, ball-level I/O mapping, industrial-grade thermal validation, ODT configuration options, and JEDEC-compliant power-down modes critical for memory interface design and BOM qualification.

Technical Context

The W632GU8KB12I implements a double-data-rate architecture with 8-bit prefetch, synchronized to differential CK/CK# inputs and source-synchronous DQS/DQS# strobes. Its DLL aligns DQ transitions to clock edges, enabling stable high-speed read/write operations up to 800 MHz clock frequency (1600 MT/s).

It supports programmable additive latency (AL = 0, CL−1, CL−2), posted CAS#, auto-precharge, burst lengths of 8 or 4 (on-the-fly selectable), and multi-purpose register (MPR) readout for system-level timing calibration-including write leveling and MPR-based signal integrity tuning.

Key Specifications

Pinout & Package

Packaged in lead-free, RoHS-compliant WBGA-78 (8 mm × 10.5 mm, 0.8 mm pitch) with 78 solder balls.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR3L SDRAM applications.

Compared with MT41K256M8DA-125:A and IS43TR16256B-125KBL, W632GU8KB12I uniquely combines industrial temperature support (–40°C to +95°C), WBGA-78 compact footprint, and ASR/PASR for low-power embedded use-making it optimal for space-constrained, thermally demanding applications where reliability trumps commodity compatibility.

Availability

W632GU8KB12I is available at Aetrix Electronics and suitable for industrial automation, network infrastructure, medical imaging, and automotive ADAS applications requiring stable component supply, long-term lifecycle assurance, and guaranteed industrial temperature performance.

Supply support for W632GU8KB12I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including NOR/NAND Flash, SRAM, and DRAM products for industrial, automotive, and communications markets.

The W632GU8KB series belongs to Winbond's DDR3L SDRAM product line, designed specifically for cost-sensitive, thermally demanding embedded systems requiring JEDEC-compliant low-voltage memory with robust power management and industrial-grade reliability.

FAQ

What is the maximum supported CAS Latency for W632GU8KB12I at DDR3L-1600 speed?

W632GU8KB12I supports CAS Latency settings of CL = 6, 7, 8, 9, 10, and 11 at DDR3L-1600 speed. The device is binned to meet 11-11-11 timing (tRCD/tRP/tRC = 13.75 ns), and optional down-binning to CL=7 or CL=9 is permitted provided tAA/tRCD/tRP minimums are tightened to ≤13.125 ns and SPD registers are updated accordingly. This flexibility allows system designers to balance timing margin and latency in memory controller firmware.

Does W632GU8KB12I support both DDR3L and legacy DDR3 1.5V operation?

Yes, W632GU8KB12I is backward compatible with 1.5 V ±0.075 V DDR3 systems. Its VDD/VDDQ supply range is specified from 1.283 V to 1.45 V for DDR3L mode and extends to 1.425 V–1.575 V for DDR3 mode. However, switching between 1.35 V and 1.5 V requires proper sequencing per Section 11.4 of the datasheet, and full AC timing compliance at 1.5 V is validated only for commercial temperature grades-not the industrial -I suffix of W632GU8KB12I.

How does the RESET# pin function in W632GU8KB12I, and is it required for initialization?

The RESET# pin in W632GU8KB12I is an asynchronous, active-low input that initiates power-up initialization when asserted after VDD/VDDQ stabilization. It is required for reliable initialization in systems lacking precise power-rail sequencing. When asserted, W632GU8KB12I enters a known state, clears internal registers, and prepares for mode register setup. Unlike synchronous reset commands, RESET# operates independently of CK/CK#, making it essential for fail-safe recovery in industrial and automotive applications.

What package type and ball count does W632GU8KB12I use, and is it RoHS compliant?

W632GU8KB12I uses a lead-free, RoHS-compliant WBGA-78 package measuring 8 mm × 10.5 mm with 0.8 mm ball pitch. The 78-ball layout includes dedicated DQS/DQS#, ZQ, VREFCA/VREFDQ, and ODT terminals per JEDEC DDR3L standards. This compact, surface-mount package supports high-density PCB designs typical in industrial controllers and edge AI modules, and its RoHS status is confirmed in Section 2 (Features) and Package Specification (Section 12) of the datasheet.

Can W632GU8KB12I operate reliably at +95°C case temperature, and what refresh adjustments are needed?

Yes, W632GU8KB12I is qualified for +95°C case temperature operation, but requires doubling the auto-refresh frequency (tREFI = 3.9 µS instead of 7.8 µS) to maintain data retention. This is achieved either by enabling Auto Self-Refresh (ASR) via MR2[7:6] = 10b or entering Manual Self-Refresh with Extended Temperature Range (MR2[7:6] = 10b). Standard self-refresh (IDD6 ≤19 mA) remains valid, but failure to adjust refresh rate above +85°C will result in data loss per JEDEC JESD79-3F specification.