Winbond Electronics Corporation W632GU8KB-15 TR

Overview

W632GU8KB-15 TR from Winbond is a 2Gb (256M × 8) DDR3L SDRAM organized in 8 banks, operating at 667 MHz (DDR3L-1333, CL=9), with 1.35V nominal VDD/VDDQ supply, 9-9-9 timing (tRCD/tRP/tRC), and WBGA-78 package. It serves as main system memory in low-power embedded controllers, industrial HMIs, and network edge devices requiring JEDEC-compliant DDR3L interface and extended temperature support.

For engineers reviewing the W632GU8KB-15 TR datasheet, W632GU8KB-15 TR pinout, W632GU8KB-15 TR application, or W632GU8KB-15 TR equivalent, this page delivers verified DDR3L-1333 timing parameters, ball-mapped I/O roles, ODT configuration options, ZQ calibration behavior, and industrial-grade (-40°C to +95°C) operation details critical for memory subsystem validation and layout sign-off.

Technical Context

This DDR3L SDRAM implements a double-data-rate architecture with 8-bit prefetch, differential CK/CK# and DQS/DQS# signaling, and DLL-based clock-to-data alignment. It supports programmable CAS Latency (CL=6,7,8,9,10), CAS Write Latency (CWL=5–7), additive latency (AL=0, CL−1, CL−2), and on-die termination (ODT) with synchronous and dynamic modes.

Key operational features include asynchronous RESET#, ZQ calibration using external 240Ω resistor, multi-purpose register (MPR) for timing calibration pattern readout, write leveling for DQ-DQS skew compensation, and partial array self-refresh (PASR) for power optimization. All commands are sampled on CK rising / CK# falling crossing points.

Key Specifications

Pinout & Package

WBGA-78 package (8 mm × 10.5 mm, 0.8 mm ball pitch), RoHS-compliant, lead-free construction. Ball grid follows JEDEC-standard DDR3L layout with dedicated VDDQ, VSSQ, VREFCA, VREFDQ, ZQ, and ODT balls.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR3L memory applications.

Compared with MT41K128M8RH-125:E and IS43TR16128B-15HBL, W632GU8KB-15 TR uniquely combines 2Gb density, industrial temperature range, write leveling, PASR, and MPR in a compact WBGA-78 package-making it optimal for space-constrained, thermally demanding, and low-power DDR3L implementations.

Availability

W632GU8KB-15 TR is available at Aetrix Electronics and suitable for industrial HMIs, network edge routers, medical diagnostic terminals, and smart energy gateways requiring stable component supply, long-term lifecycle assurance, and guaranteed industrial temperature performance.

Supply support for W632GU8KB-15 TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and DDR SDRAM for industrial, automotive, and communications markets.

The W632GU8KB-15 TR belongs to Winbond's DDR3L SDRAM product line, designed specifically for low-voltage, high-reliability embedded systems where power efficiency, extended temperature operation, and JEDEC compliance are mandatory.

FAQ

What is the maximum operating frequency of the W632GU8KB-15 TR?

The W632GU8KB-15 TR is rated for DDR3L-1333 operation, with a maximum clock frequency of 667 MHz (tCK = 1.5 ns). Its speed grade "-15" confirms compliance with JEDEC's 9-9-9 timing specification (tRCD/tRP/tRC = 9 cycles), and it supports optional down-binning to DDR3L-1066 if system timing margins permit. The W632GU8KB-15 TR does not support DDR3L-1600 or DDR3L-1866 speeds.

Does the W632GU8KB-15 TR support both 1.35V and 1.5V operation?

Yes, the W632GU8KB-15 TR is backward-compatible with standard DDR3 1.5V supplies: it operates at VDD/VDDQ = 1.283 V to 1.45 V (1.35 V typical) for DDR3L mode, and supports VDD/VDDQ = 1.425 V to 1.575 V (1.5 V ± 0.075 V) for legacy DDR3 compatibility. Voltage switching between modes requires proper sequencing and MR register reprogramming. The W632GU8KB-15 TR must not be operated outside these specified ranges.

How is ZQ calibration performed on the W632GU8KB-15 TR?

ZQ calibration on the W632GU8KB-15 TR uses an external 240Ω ±1% resistor connected between the ZQ ball and ground. Calibration is initiated via ZQINIT (at power-up) or ZQCAL (during operation) commands, adjusting output driver strength and ODT values to maintain 34Ω nominal impedance. The W632GU8KB-15 TR requires stable VDD/VDDQ and ambient temperature < 85°C during calibration; repeated ZQCAL is recommended after large temperature shifts.

What is the purpose of the MPR (Multi-Purpose Register) in the W632GU8KB-15 TR?

The MPR in the W632GU8KB-15 TR outputs a fixed 01010101 pattern on DQ[7:0] during MPR read mode (enabled via MR3). This deterministic pattern allows system designers to verify DQ-to-DQS timing margins, validate write leveling results, and perform board-level signal integrity testing without requiring functional memory access. The W632GU8KB-15 TR supports only Pattern 0 (01010101); other MPR patterns are not implemented.

Can the W632GU8KB-15 TR operate reliably at 95°C case temperature?

Yes, the W632GU8KB-15 TR is qualified for -40°C to +95°C case temperature operation. At temperatures above 85°C, Auto Self-Refresh (ASR) must be enabled (MR2 A6 = 1b) to double refresh rate (tREFI = 3.9 µs), or Manual Self-Refresh with extended temperature mode (MR2 A6 = 0b, A7 = 1b) must be used. The W632GU8KB-15 TR's IDD6 remains 19 mA across the full range, ensuring predictable power behavior.