Winbond Electronics Corporation W632GU8NB11I TR

Overview

W632GU8NB11I TR from Winbond is a 2Gb (256M × 8) DDR3L SDRAM in VFBGA-78 package, operating at 1.35V nominal supply with industrial temperature range (–40°C to +95°C), supporting DDR3L-1866 speed grade (13-13-13 CL-tRCD-tRP), 8 internal banks, and 8-bit prefetch architecture. It serves as main memory in embedded controllers, network processors, and industrial HMIs requiring low-voltage, high-bandwidth data buffering.

For engineers reviewing the W632GU8NB11I TR datasheet, W632GU8NB11I TR pinout, W632GU8NB11I TR application, or W632GU8NB11I TR equivalent, key selection factors include its DDR3L-1866 timing compliance, programmable CAS Write Latency (CWL = 5–9), on-die termination (ODT) support for both static and dynamic modes, ZQ calibration capability, and industrial-grade thermal reliability up to +95°C case temperature.

Technical Context

This DDR3L SDRAM implements a double-data-rate interface synchronized to differential CK/CK# clocks, with bi-directional DQS/DQS# strobes edge-aligned on reads and center-aligned on writes. Its DLL aligns DQ and DQS transitions to CK, enabling stable 1866 MT/s operation under JEDEC-compliant timing constraints.

The device supports asynchronous RESET#, programmable mode registers (MR0–MR3) for CAS latency, CWL, ODT, PASR, ASR, and write leveling, plus Multi-Purpose Register (MPR) for system-level timing calibration. It features 1K-byte page size, auto-precharge, and dual power-down modes (precharged and active) for dynamic power management.

Key Specifications

Pinout & Package

VFBGA-78 package (8 × 10.5 mm², 1.0 mm thickness, Window BGA Type) with 78 solder balls arranged in 8 rows × 10 columns (2 missing balls at A1/A2), RoHS-compliant and lead-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR3L SDRAM applications.

Compared with IS43TR16256BL-125KBL and MT41K128M8RH-125:E, the W632GU8NB11I TR delivers higher 1866 MT/s throughput and full DDR3L-1866 timing compliance in an 8-bit configuration, making it optimal for bandwidth-constrained industrial controllers needing precise timing control and thermal robustness without bus-width expansion.

Availability

W632GU8NB11I TR is available at Aetrix Electronics and suitable for industrial HMIs, network edge routers, medical imaging controllers, and automated test equipment requiring stable component supply, long-lifecycle support, and guaranteed industrial temperature performance.

Supply support for W632GU8NB11I TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and DRAM products for industrial, automotive, and communications markets.

The W632GU8NB series belongs to Winbond's DDR3L SDRAM product line, designed specifically for industrial and embedded applications demanding low-voltage operation, extended temperature reliability, and JEDEC-compliant timing robustness.

FAQ

What is the maximum data rate supported by the W632GU8NB11I TR?

The W632GU8NB11I TR supports DDR3L-1866 operation at 1866 MT/s, corresponding to a minimum clock period (tCK) of 1.07 ns. This speed grade is validated for CL13/tRCD13/tRP13 timing and requires CWL9. The device achieves this rate using its 8-bit prefetch architecture and DLL-synchronized DQS-to-DQ alignment, ensuring reliable operation within industrial temperature limits.

Does the W632GU8NB11I TR support backward compatibility with standard 1.5V DDR3 systems?

Yes, the W632GU8NB11I TR supports backward compatibility with 1.5V DDR3 systems. Its VDD/VDDQ supply range extends to 1.5V ±0.075V, and all DC and AC timing parameters meet JEDEC DDR3 specifications at that voltage. However, DDR3L-specific features like lower IDD currents and extended temperature operation are only guaranteed at 1.35V nominal.

How does the ZQ calibration function work on the W632GU8NB11I TR?

The W632GU8NB11I TR uses its ZQ pin to connect to a 240 Ω ±1 % external resistor to ground. Upon receiving a ZQCL (ZQ Calibration Long) command, the device performs internal trimming of output driver strength and ODT impedance values across process, voltage, and temperature variations. Calibration must be performed after power-up and periodically during operation to maintain signal integrity.

What is the purpose of the Multi-Purpose Register (MPR) in the W632GU8NB11I TR?

The MPR in the W632GU8NB11I TR stores a fixed 128-bit pattern (0x0000_0000_0000_0000) accessible via standard READ commands. It is used for system-level timing margin validation-controllers read the MPR pattern while sweeping DQS delays to determine optimal write timing windows, enabling robust high-speed link training without external test equipment.

Can the W632GU8NB11I TR operate reliably at +95°C case temperature?

Yes, the W632GU8NB11I TR is rated for –40°C ≤ TCASE ≤ +95°C and fully complies with JEDEC AC/DC specifications across this range. At temperatures above +85°C, it automatically doubles refresh frequency (tREFI = 3.9 µs) and supports Manual Self-Refresh mode (MR2 A6=0, A7=1) to maintain data retention integrity under extended thermal stress conditions.