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Winbond Electronics Corporation W632GU8NB-15
- Part No.:
- W632GU8NB-15
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 78-VFBGA
- Datasheet:
-
W632GU8NB-15.pdf
- Description:
- IC DRAM 2GBIT PAR 78VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,711
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Product details
Overview
W632GU8NB-15 from Winbond Electronics is a 2 Gb (256 MB) DDR3L SDRAM organized as 32M × 8 banks × 8 bits, operating at DDR3L-1333 speed (667 MHz clock, 9-9-9 CL-tRCD-tRP timing), with 1.35 V nominal supply (1.283–1.45 V range), -40°C to +95°C industrial temperature rating, and VFBGA-78 (8 mm × 10.5 mm, 1.0 mm height) package. It serves as main memory in embedded controllers, network edge devices, and industrial HMIs requiring low-voltage, JEDEC-compliant DDR3L operation.
For engineers reviewing the W632GU8NB-15 datasheet, W632GU8NB-15 pinout, W632GU8NB-15 application, or W632GU8NB-15 equivalent, this page delivers verified DDR3L timing parameters, ball assignment mapping, ODT configuration options, ZQ calibration support, and validated drop-in alternatives for memory subsystem design and BOM continuity planning.
Technical Context
This device implements an 8-bank, 8-bit prefetch DDR3L architecture with synchronous differential clocking (CK/CK#), source-synchronous DQS/DQS# strobes, and DLL-based data-to-clock alignment. It supports programmable CAS Latency (CL = 5–10), CAS Write Latency (CWL = 5–7), additive latency (AL = 0, CL−1, CL−2), and on-die termination (ODT) with dynamic Rtt_WR selection.
Key operational modes include auto-precharge, burst refresh, partial array self-refresh (PASR), and power-down states (precharged/active). Initialization requires asynchronous RESET# assertion and ZQ calibration via external 240 Ω ±1 % resistor; write leveling and MPR-based system timing calibration are supported for signal integrity tuning.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gb (256 MB), organized as 32M words × 8 banks × 8 bits |
| Data Rate / Speed Grade | DDR3L-1333: 1333 MT/s (667 MHz fCK), CL-tRCD-tRP = 9-9-9 |
| Supply Voltage | VDD/VDDQ = 1.283 V to 1.45 V (1.35 V typical); backward compatible to 1.5 V ± 0.075 V |
| Operating Temperature | -40°C ≤ TCASE ≤ 95°C (industrial grade) |
| Package | VFBGA-78, 8 mm × 10.5 mm, 1.0 mm height, RoHS-compliant, lead-free |
| CAS Latency Range | Programmable CL = 5, 6, 7, 8, 9, 10 (JEDEC-compliant settings) |
| CAS Write Latency | Programmable CWL = 5, 6, 7 - matched to frequency bin for write timing compliance |
| Refresh Interval | tREFI = 7.8 µs (0°C–85°C), 3.9 µs (85°C–95°C) with doubled refresh commands |
Pinout & Package
VFBGA-78 package (8 mm × 10.5 mm, 1.0 mm height) with 78 solder balls arranged in 8 rows × 10 columns (2 missing balls at corners), RoHS-compliant, lead-free construction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A14 | Address Inputs | Row/column address inputs for bank and memory location selection; A10 controls auto-precharge |
| BA0–BA2 | Bank Address Inputs | Select one of eight internal banks for concurrent access |
| CK, CK# | Differential Clock Inputs | Edge-triggered command latching; all inputs sampled at CK rising / CK# falling crosspoint |
| CS#, RAS#, CAS#, WE# | Command Inputs | Active-low signals defining command type (ACT, READ, WRITE, PRE, REF, etc.) |
| RESET# | Asynchronous Reset Input | For power-up initialization sequence and functional reset; must be held low ≥ 200 µs after stable VDD |
| DQ0–DQ7 | Data I/Os | Bidirectional 8-bit data bus; referenced to DQS/DQS# for read/write strobing |
| DQS, DQS# | Differential Data Strobe | Source-synchronous strobe: center-aligned with write data, edge-aligned with read data |
| DM | Data Mask Input | Per-byte write mask; high = mask corresponding DQ byte during WRITE |
| ODT | On-Die Termination Control | Dynamic enable/disable of termination resistors on DQ/DQS/DM lines per MR1/MR2 settings |
| ZQ | ZQ Calibration Reference | Connects to external 240 Ω ±1 % resistor to ground for output driver and ODT impedance calibration |
Key Features
| Feature | Design Value |
|---|---|
| DDR3L Low-Voltage Operation | 1.35 V nominal supply enables ~20 % lower active power vs. standard DDR3 at same data rate |
| Programmable CAS Write Latency (CWL) | Supports CWL = 5–7 to maintain write timing margin across DDR3L-1333 frequency and voltage variations |
| Dynamic On-Die Termination (Rtt_WR) | Enables ODT activation only during WRITE bursts, reducing standby current and improving signal integrity |
| ZQ Calibration | One-time or periodic calibration using external 240 Ω resistor ensures consistent output drive strength and ODT accuracy over PVT |
| Write Leveling Support | Allows controller to calibrate DQS-to-CK skew per rank, critical for reliable high-speed WRITE capture at DDR3L-1333 |
| Multi-Purpose Register (MPR) | Provides predefined read pattern for system-level timing calibration without disturbing memory contents |
Applications
| Industrial HMI Memory | Network Edge Router Buffer |
|---|---|
Use Scenario: Touch-enabled human-machine interface in factory automation panels requiring persistent, low-power memory operation across wide ambient temperatures. IC Role / Device Role / Timing Role: Primary working memory for ARM Cortex-A series SoCs, interfacing via 8-bit DDR3L bus with 667 MHz clock and 9-9-9 timing. Use Value: The W632GU8NB-15's -40°C to +95°C rating and 1.35 V operation ensure reliable boot and runtime performance without thermal throttling or voltage translation circuitry. |
Use Scenario: Packet buffering in compact 5G small cell gateways where board space and thermal envelope constrain memory selection. IC Role / Device Role / Timing Role: Shared buffer for traffic management ASICs, supporting burst reads/writes synchronized to CK/CK# with DQS-strobed data capture. Use Value: VFBGA-78 footprint and DDR3L-1333 bandwidth meet throughput requirements while minimizing PCB layer count and power delivery complexity. |
| Medical Imaging Subsystem | Smart Energy Meter Controller |
Use Scenario: Real-time image frame buffering in portable ultrasound devices needing deterministic latency and EMI-controlled signaling. IC Role / Device Role / Timing Role: High-integrity data store for FPGA-accelerated image processing pipelines, using ODT and write leveling for clean signal edges. Use Value: Dynamic ODT (Rtt_WR) and calibrated DQS timing reduce inter-symbol interference, enabling error-free 1333 MT/s transfers in noise-sensitive analog environments. |
Use Scenario: Firmware execution and metering data logging in DIN-rail mounted smart electricity meters certified for long-term field deployment. IC Role / Device Role / Timing Role: Non-volatile program/data storage extension for microcontrollers, leveraging PASR and self-refresh for ultra-low standby current. Use Value: Normal temperature self-refresh current (IDD6 ≤ 15 mA) and extended temperature support allow >10-year operation without refresh-related wear or data loss. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR3L SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT41K128M8RH-125:E (Micron) | Same density (2 Gb), VFBGA-78, DDR3L-1600 (800 MHz), CL = 11; higher speed grade, tighter tRC/tRAS | Requires controller support for DDR3L-1600 timing and CWL = 6–8; not drop-in for 1333-only designs | Select when upgrading system bandwidth is feasible and layout accommodates faster timing margins. |
| IS43TR16128B-125KBL (ISSI) | 16-bit bus width (vs. 8-bit), same 2 Gb density, VFBGA-96, DDR3L-1600; incompatible pinout and data width | Requires PCB redesign and controller reconfiguration for x16 interface; no direct replacement without hardware change | Consider only for new designs targeting higher throughput and willing to adopt wider bus architecture. |
Compared with MT41K128M8RH-125:E and IS43TR16128B-125KBL, the W632GU8NB-15 provides optimal fit for cost-sensitive, thermally constrained 8-bit DDR3L-1333 systems where pin compatibility, industrial temperature range, and proven JEDEC compliance are prioritized over raw bandwidth.
Availability
W632GU8NB-15 is available at Aetrix Electronics and suitable for industrial HMIs, network edge routers, medical imaging subsystems, and smart energy meter controllers requiring stable component supply, long-lifecycle support, and guaranteed industrial temperature performance.
Supply support for W632GU8NB-15 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions, including NOR/NAND Flash, PSRAM, and DDR SDRAM products for industrial, automotive, and communications markets.
The W632GU8NB-15 belongs to Winbond's DDR3L SDRAM product line, designed specifically for embedded systems demanding low-voltage operation, extended temperature reliability, and JEDEC-compliant interoperability without proprietary enhancements.
FAQ
What is the maximum clock frequency supported by the W632GU8NB-15?
The W632GU8NB-15 is rated for DDR3L-1333 operation, supporting a maximum input clock frequency (fCK) of 667 MHz. Its AC timing specifications - including tAA = 13.5 ns, tRCD = 13.5 ns, and tRP = 13.5 ns - are guaranteed under JEDEC conditions at this speed grade with CL = 9. The device does not support higher-frequency bins such as DDR3L-1600 or DDR3L-1866.
Does the W632GU8NB-15 support both 1.35 V and 1.5 V operation?
Yes, the W632GU8NB-15 supports dual-voltage operation: it is fully compliant with DDR3L specifications at 1.35 V (1.283–1.45 V range) and backward compatible with standard DDR3 at 1.5 V ± 0.075 V. Voltage switching between modes is allowed, but must follow the sequencing and timing requirements defined in Section 12.4 of the datasheet to avoid initialization failure.
How is the W632GU8NB-15 initialized after power-up?
The W632GU8NB-15 requires an asynchronous RESET# signal asserted low for ≥200 µs after VDD and VDDQ stabilize. Following RESET# deassertion, the host controller must issue a ZQ calibration command and program mode registers (MR0–MR3) before issuing any ACTIVE or READ/WRITE commands. This sequence ensures DLL lock, ODT configuration, and burst parameters are correctly established.
What termination options does the W632GU8NB-15 provide for signal integrity?
The W632GU8NB-15 supports programmable on-die termination (ODT) on DQ, DQS/DQS#, and DM lines via MR1 and MR2. It offers static ODT (Rtt_Nom) and dynamic ODT (Rtt_WR) modes, with selectable impedances of 120 Ω, 60 Ω, 40 Ω, and 30 Ω. ZQ calibration against an external 240 Ω resistor ensures ±10 % impedance accuracy across voltage and temperature.
Can the W632GU8NB-15 operate in partial array self-refresh (PASR) mode?
Yes, the W632GU8NB-15 supports Partial Array Self-Refresh (PASR) as defined in MR2. PASR allows selective refresh of only active memory subarrays, reducing self-refresh current (IDD6) by up to 50 % compared to full-array refresh. This feature is especially valuable in battery-backed or thermally limited applications where minimizing standby power is critical.
W632GU8NB-15 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 78-VFBGA
- Packaging:
- Tray
- Product Status:
- Last Time Buy
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - DDR3L
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- 667 MHz
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 20 ns
- Voltage - Supply:
- 1.283V ~ 1.45V
- Operating Temperature:
- 0°C ~ 95°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 78-VFBGA (8x10.5)
W632GU8NB-15 FAQ
1.How can I place an order for W632GU8NB-15 through Aetrix?
Please submit a Request for Quotation (RFQ) for W632GU8NB-15 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W632GU8NB-15 reliable?
The price and inventory of W632GU8NB-15 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W632GU8NB-15 is usually 5 days.
3.What payment methods are accepted for W632GU8NB-15?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W632GU8NB-15 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W632GU8NB-15?
W632GU8NB-15 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W632GU8NB-15 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W632GU8NB-15?
For technical support, including W632GU8NB-15 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W632GU8NB-15 requirements.
6.How does Aetrix verify that W632GU8NB-15 is sourced from the original manufacturer or authorized distributors?
All W632GU8NB-15 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W632GU8NB-15 meets industry standards.
7.What is the process for return or replacement of W632GU8NB-15?
All W632GU8NB-15 units undergo pre-shipment inspection (PSI). If there is an issue with W632GU8NB-15, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W632GU8NB-15 part is unused and in its original packaging.
Return procedure for W632GU8NB-15:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W632GU8NB-15 Tags
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