Winbond Electronics Corporation W634GU8QB-09
- Part No.:
- W634GU8QB-09
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 78-VFBGA
- Datasheet:
-
W634GU8QB-09.pdf
- Description:
- IC DRAM 4GBIT PAR 78VFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
W634GU8QB-09 from Winbond is a 4Gb (64M × 8) DDR3L SDRAM organized across 8 internal banks, operating at 1.35V nominal supply with DDR3L-2133 speed grade (14-14-14 CL-tRCD-tRP), supporting up to 2133 MT/s data rates and designed for memory subsystems in industrial embedded controllers, network edge devices, and automotive infotainment head units.
For engineers reviewing the W634GU8QB-09 datasheet, W634GU8QB-09 pinout, W634GU8QB-09 application, or W634GU8QB-09 equivalent, key selection considerations include its -09 speed bin's 1066 MHz clock frequency, 1.35V VDD/VDDQ operation with 1.5V backward compatibility, CAS latency support up to CL=14, and industrial temperature range (0°C to 95°C).
Technical Context
This DDR3L SDRAM implements an 8-bit prefetch architecture synchronized to differential CK/CK# inputs, with DLL-aligned DQ/DQS timing and bi-directional differential strobes that are edge-aligned on reads and center-aligned on writes. It supports programmable additive latency (AL = 0, CL−1, CL−2), posted CAS, and auto-precharge for burst operations.
The device integrates ZQ calibration for output driver and ODT impedance tuning, dynamic ODT (Rtt_WR) with selectable termination values, and multi-purpose register (MPR) readout for system-level timing calibration. Its asynchronous RESET# pin enables deterministic power-up initialization and runtime reset independent of clock state.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4 Gb (64M words × 8 banks × 8 bits) |
| Data Rate | 2133 MT/s (DDR3L-2133, fCK = 1066 MHz) |
| Supply Voltage | VDD/VDDQ = 1.283 V to 1.45 V (1.35 V typical); backward compatible with 1.5 V ±0.075 V |
| CAS Latency | CL = 5 to 14; supports tAA = 13.09 ns minimum at CL=14 |
| Burst Length | BL8 (fixed) and BC4 (on-the-fly selectable) |
| Operating Temp | 0°C ≤ TCASE ≤ 95°C (industrial grade) |
| Package | VFBGA-78 (8 mm × 10.5 mm, 1.0 mm height, RoHS-compliant lead-free) |
Pinout & Package
VFBGA-78 package with 8×10.5 mm² footprint, 1.0 mm thickness, and ball pitch of 0.8 mm. Ball map conforms to JEDEC MO-270DA standard for DDR3L SDRAM.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A14 | Address Inputs | Row/column address inputs for bank and page access; multiplexed with BA0–BA2 for bank selection |
| BA0–BA2 | Bank Address Inputs | Select one of eight internal banks; latched with A0–A14 on ACT command |
| CK / CK# | Differential Clock Inputs | Edge-sensitive inputs defining command timing; all commands latched at CK rising / CK# falling crosspoint |
| DQ0–DQ7 | Data I/Os | Bi-directional 8-bit data bus; source-synchronous with DQS/DQS#; support DM masking |
| DQS / DQS# | Differential Data Strobe | Source-synchronous strobe pair; edge-aligned with read data, center-aligned with write data |
| DM0–DM7 | Data Mask Inputs | Per-byte write mask control; active-high during WRITE to suppress corresponding DQ bits |
| RESET# | Asynchronous Reset | Active-low signal initiating power-up initialization sequence or runtime reset independent of clock state |
| ODT | On-Die Termination Control | Dynamic enable/disable of programmable termination resistors on DQ/DQS/DM lines per MR1/MR2 settings |
Key Features
| Feature | Design Value |
|---|---|
| Programmable CWL | CAS Write Latency configurable per frequency (CWL = 5–10), enabling precise write timing alignment with clock phase |
| ZQ Calibration | One-time or periodic calibration using external 240 Ω ±1% resistor to ground, correcting output driver and ODT impedance drift over voltage/temperature |
| Dynamic ODT (Rtt_WR) | Termination impedance (Rtt = 120 Ω, 60 Ω, 40 Ω) activated only during WRITE bursts to minimize noise and improve signal integrity |
| Multi-Purpose Register (MPR) | Predefined 128-bit pattern accessible via MRS command for automated board-level timing margin validation and eye diagram analysis |
| Write Leveling Support | Hardware-assisted delay adjustment of DQS relative to CK during initialization, compensating for board skew between controller and W634GU8QB-09 |
Applications
| Industrial PLC Memory Buffer | Automotive Infotainment RAM |
|---|---|
Use Scenario: Real-time motion control logic executing cyclic tasks with deterministic memory access latency. IC Role / Device Role / Timing Role: Primary working memory for ARM Cortex-M7-based controller running FreeRTOS, interfacing via AXI or AHB bus with DDR3L PHY. Use Value: CL=14 and tRCD=14 ns at 1066 MHz enable predictable worst-case access timing under thermal stress up to 95°C case temperature. |
Use Scenario: In-vehicle navigation system rendering HD maps and voice prompts while buffering video streams. IC Role / Device Role / Timing Role: Main system RAM for quad-core application processor handling concurrent UI, media decode, and CAN gateway tasks. Use Value: Dynamic ODT and write leveling ensure robust signal integrity across long PCB traces in EMI-heavy automotive cabins. |
| Network Edge Router Cache | Medical Imaging Display Buffer |
Use Scenario: Packet classification engine requiring high-bandwidth temporary storage for flow table lookups and header modification. IC Role / Device Role / Timing Role: High-throughput buffer between packet processing ASIC and 10G Ethernet MAC, operating in burst-interleaved mode. Use Value: 8-bank concurrency and 1K-page size reduce row activation overhead, sustaining >1.8 GB/s sustained bandwidth under mixed read/write loads. |
Use Scenario: DICOM viewer rendering real-time ultrasound frames with minimal display latency and zero frame drop. IC Role / Device Role / Timing Role: Frame buffer for FPGA-based video pipeline driving 1920×1080@60Hz LVDS panel with gamma correction LUT storage. Use Value: MPR-read calibration pattern and tAA=13.09 ns guarantee sub-14 ns read-to-data validity for pixel clock synchronization. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR3L SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT41K256M16HA-125:E | 2Gb density (256M×8), 1250 MHz max clock, 1.35V only (no 1.5V compatibility), 96-ball FBGA | Limited to lower bandwidth systems; lacks 1.5V fallback for legacy designs | Choose when footprint and thermal profile prioritize smaller package over density and voltage flexibility |
| IS43TR16256B-125KBL | 2Gb density, 1250 MHz max clock, 1.35V/1.5V dual-voltage support, 96-ball FBGA | Lower density and speed; no MPR or write leveling support per datasheet | Choose for cost-sensitive industrial HMI where calibration features are not required |
Compared with W634GU8QB-09, both alternatives offer DDR3L compliance but lack its 4Gb density, 2133 MT/s capability, and full JEDEC calibration suite (MPR + write leveling + ZQ), making them suitable only for less demanding memory subsystems.
Availability
W634GU8QB-09 is available at Aetrix Electronics and suitable for industrial PLC memory buffers, automotive infotainment RAM, and network edge router cache applications requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for W634GU8QB-09 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including NOR/NAND Flash, SRAM, and DRAM products for industrial, automotive, and communications markets.
The W634GU8QB-09 belongs to Winbond's DDR3L SDRAM product line, engineered for high-reliability embedded systems requiring low-voltage operation, extended temperature tolerance, and JEDEC-compliant calibration features.
FAQ
What is the maximum clock frequency supported by the W634GU8QB-09?
The W634GU8QB-09 supports a maximum clock frequency of 1066 MHz, enabling a data transfer rate of 2133 MT/s (DDR3L-2133). This is validated under the -09 speed grade with CL-tRCD-tRP = 14-14-14 timing and VDD/VDDQ = 1.283 V to 1.45 V at 0°C to 95°C case temperature. The W634GU8QB-09 achieves this performance while maintaining full JEDEC DDR3L compliance.
Does the W634GU8QB-09 support 1.5V operation?
Yes, the W634GU8QB-09 is backward compatible with 1.5V DDR3 operation per JEDEC JESD79-3F specification. It accepts VDD/VDDQ = 1.5V ± 0.075 V and maintains functional timing and electrical behavior, allowing seamless integration into legacy 1.5V memory subsystems without redesign. The W634GU8QB-09 retains all DDR3L features-including low-power modes-even at 1.5V.
How does the W634GU8QB-09 handle power-up initialization?
The W634GU8QB-09 uses an asynchronous RESET# pin to initiate a deterministic power-up initialization sequence. When RESET# is asserted low after VDD/VDDQ stabilize, the device executes internal DLL reset, ZQ calibration, and mode register programming before entering idle state. This ensures repeatable timing alignment without requiring external clock conditioning. The W634GU8QB-09 guarantees initialization completion within 200 µs of RESET# deassertion.
What calibration features does the W634GU8QB-09 provide for system-level timing margining?
The W634GU8QB-09 provides three hardware-calibration features: ZQ calibration for output driver and ODT impedance tuning, write leveling for DQS-to-CK delay compensation, and Multi-Purpose Register (MPR) readout of a predefined 128-bit pattern for eye diagram analysis. These features are fully JEDEC-compliant and require no firmware intervention. The W634GU8QB-09 supports all three simultaneously during system bring-up.
Is the W634GU8QB-09 pin-compatible with other Winbond DDR3L SDRAMs?
The W634GU8QB-09 uses a standardized VFBGA-78 package conforming to JEDEC MO-270DA, and its ball assignment matches Winbond's W63xGU8xx family (e.g., W632GU8QB-12). Pin functions-including A0–A14, BA0–BA2, DQ0–DQ7, DQS/DQS#, and RESET#-are identical across speed grades. However, timing parameters and supported CL/CWL values differ; the W634GU8QB-09 must be configured per its -09 speed bin specifications.
W634GU8QB-09 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 78-VFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - DDR3L
- Memory Size:
- 4Gbit
- Memory Organization:
- 512M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- 1.06 GHz
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 20 ns
- Voltage - Supply:
- 1.283V ~ 1.45V
- Operating Temperature:
- 0°C ~ 95°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 78-VFBGA (8x10.5)
W634GU8QB-09 FAQ
1.How can I place an order for W634GU8QB-09 through Aetrix?
Please submit a Request for Quotation (RFQ) for W634GU8QB-09 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W634GU8QB-09 reliable?
The price and inventory of W634GU8QB-09 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W634GU8QB-09 is usually 5 days.
3.What payment methods are accepted for W634GU8QB-09?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W634GU8QB-09 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W634GU8QB-09?
W634GU8QB-09 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W634GU8QB-09 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W634GU8QB-09?
For technical support, including W634GU8QB-09 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W634GU8QB-09 requirements.
6.How does Aetrix verify that W634GU8QB-09 is sourced from the original manufacturer or authorized distributors?
All W634GU8QB-09 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W634GU8QB-09 meets industry standards.
7.What is the process for return or replacement of W634GU8QB-09?
All W634GU8QB-09 units undergo pre-shipment inspection (PSI). If there is an issue with W634GU8QB-09, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W634GU8QB-09 part is unused and in its original packaging.
Return procedure for W634GU8QB-09:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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