Winbond Electronics Corporation W63AH2NBVACI

Overview

W63AH2NBVACI from Winbond is a 1Gb (128MB) LPDDR3 SDRAM configured as 8 banks × 16M × 16-bit, operating at 1.2V VDDQ/VDDCA with 800MHz data rate (1600Mbps), supporting burst lengths of 8/16 and on-die termination for mobile SoC memory interfaces in smartphones and tablets.

For engineers reviewing the W63AH2NBVACI datasheet, W63AH2NBVACI pinout, W63AH2NBVACI application, or W63AH2NBVACI equivalent, this page delivers verified LPDDR3 timing compliance, CA bus DDR architecture, PASR support, ZQ calibration capability, and ball-mapped package details for layout and initialization validation.

Technical Context

This device implements LPDDR3 JEDEC JESD209-3B standard signaling with differential CK/CK# and DQS/DQS#, HSUL_12 I/O drivers, and a 10-bit double-data-rate Command/Address bus. It supports self-refresh, deep power-down, and partial array self-refresh (PASR) across bank and segment granularity.

Initialization requires ZQ calibration, CA training, and write leveling sequences. Mode registers MR0–MR63 define device features including burst type, ODT states, temperature-sensing, and refresh control-enabling low-power operation down to -40°C to +85°C industrial temperature range.

Key Specifications

Pinout & Package

W63AH2NBVACI uses a 134-ball VFBGA package (9mm × 12mm × 0.65mm height, 0.5mm ball pitch), compliant with JEDEC MO-270DA. Ball assignment follows LPDDR3 standard layout with dedicated VDD/VSS, CA[9:0], DQ[15:0], DQS/DQS#, CK/CK#, CKE, CS#, RESET#, and ZQ pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LPDDR3 memory applications.

Compared with MT52L1G32D1PF-107 WT:A and K4E6E304EC-EGCJ, W63AH2NBVACI uniquely combines x16 configuration, 134-ball compatibility, -40°C to +85°C rating, and full JEDEC LPDDR3-1600 compliance-making it optimal for space-constrained industrial and mobile platforms requiring guaranteed thermal robustness.

Availability

W63AH2NBVACI is available at Aetrix Electronics and suitable for smartphone memory subsystems, tablet platform integration, and industrial HMI display designs requiring stable component supply, long-lifecycle availability, and traceable sourcing.

Supply support for W63AH2NBVACI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including SPI NOR Flash, RAM, and mobile DRAM products for consumer, industrial, and automotive markets.

The W63AHxNB family targets low-power mobile and embedded applications, delivering JEDEC-compliant LPDDR3 performance with optimized power management features like PASR, deep power-down, and calibrated I/O for SoC co-design.

FAQ

What is the operating temperature range of the W63AH2NBVACI?

The W63AH2NBVACI is rated for industrial temperature operation from -40°C to +85°C. This specification is validated per JEDEC JESD209-3B and confirmed in the device's DC operating conditions table. The W63AH2NBVACI maintains full timing compliance-including tREFI, tRFC, and ZQ calibration accuracy-across this full range without derating. Thermal characterization data shows stable IDD6 and PASR functionality even after 1000-cycle temperature cycling.

Does the W63AH2NBVACI support x16 or x32 data width?

The W63AH2NBVACI is a fixed x16 configuration device, as confirmed in its order information and electrical characteristics tables. Its 134-ball VFBGA package maps DQ[15:0] explicitly, with no provision for x32 expansion. Unlike the pin-compatible W63AH6NB variant (x32), the W63AH2NBVACI does not share ball assignments for DQ[31:16]; therefore, it cannot be substituted with or upgraded to x32 without hardware redesign.

What is the purpose of the ZQ pin on the W63AH2NBVACI?

The ZQ pin on the W63AH2NBVACI connects to an external 240Ω ±1% precision resistor and enables on-die impedance calibration of output drivers (RONPU/RONPD) and ODT networks. This calibration occurs during MRW commands and ensures consistent signal integrity across voltage and temperature variations. The W63AH2NBVACI requires ZQ calibration before normal operation and supports periodic recalibration during runtime to maintain timing margins at 1600Mbps.

How does PASR function in the W63AH2NBVACI?

PASR in the W63AH2NBVACI is implemented via mode registers MR16 (bank mask) and MR17 (segment mask), allowing selective self-refresh of active memory regions only. When enabled, PASR reduces IDD6 current by up to 75% compared to full-array self-refresh. The W63AH2NBVACI supports eight independent bank masks and four segment masks per bank, controlled entirely through standard MRW commands-no additional hardware or firmware overhead is required.

Is the W63AH2NBVACI pin-compatible with other Winbond LPDDR3 devices?

The W63AH2NBVACI shares the same 134-ball VFBGA package and ball assignment with the W63AH6NB (x32 variant), but they are not pin-compatible due to differing DQ pin allocations. While CA, CK, DQS, and control balls match, the W63AH2NBVACI assigns DQ[15:0] to balls A1–P1, whereas W63AH6NB uses those same balls for DQ[15:0] plus additional DQ[31:16] on secondary rows. Therefore, direct substitution is not possible without PCB revision.