Winbond Electronics Corporation W9412G6JB-5I TR
- Part No.:
- W9412G6JB-5I TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 54-TFBGA
- Datasheet:
-
W9412G6JB-5I TR.pdf
- Description:
- IC DRAM 128MBIT SSTL2 54TFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
W9412G6JB-5I TR from Winbond is a 2M × 4 banks × 16-bit DDR SDRAM operating at 200 MHz (tCK = 5 ns, CL = 3), compliant with DDR400/CL3 specification and rated for -40°C to +85°C industrial temperature range. It features SSTL_2 interface, differential clock inputs (CLK/CLK̅), bi-directional DQS strobes with edge-aligned read and center-aligned write timing, and supports burst lengths of 2/4/8. Used as main memory in embedded controllers and industrial SoC platforms requiring reliable high-bandwidth data buffering.
For engineers reviewing the W9412G6JB-5I TR datasheet, W9412G6JB-5I TR pinout, W9412G6JB-5I TR application, or W9412G6JB-5I TR equivalent, key selection criteria include its industrial-grade thermal rating, 60-ball TFBGA (8×13 mm) package, 2 mA self-refresh current, programmable CAS latency (2–4), and compatibility with standard DDR400 system timing budgets.
Technical Context
This DDR SDRAM implements a 4-bank architecture with multiplexed row/column addressing (A0–A11), bank-select inputs (BA0/BA1), and command decoding via RAS̅/CAS̅/WE̅ with chip select (CS̅). It uses a DLL for input clock synchronization and supports both auto-refresh (tREFI = 64 ms) and self-refresh modes with tRFC = 50 ns minimum.
Read and write operations are synchronized to both edges of DQS; read data is edge-aligned while write data is center-aligned. Write masking is implemented via separate LDM/UDM signals controlling DQ[7:0] and DQ[15:8], respectively, with write latency fixed at 1 cycle.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 2M words × 4 banks × 16 bits = 128 Mbit density; enables 2 MB addressable space per device. |
| Speed Grade | DDR400/CL3 (-5I): supports 200 MHz clock (5 ns tCK), CAS latency of 3 cycles for predictable access timing. |
| Operating Temperature | -40°C to +85°C: qualified for industrial environments without derating or thermal management overhead. |
| Supply Voltage | 2.5 V ± 0.2 V: compatible with standard DDR I/O voltage rails and SSTL_2 logic interface. |
| Self-Refresh Current | Max 2 mA: low-power retention mode suitable for battery-backed or power-gated systems. |
| Package | 60-ball TFBGA, 8 mm × 13 mm, 0.8 mm pitch: compact footprint for space-constrained PCB layouts. |
| Burst Length | Programmable 2/4/8: balances bandwidth efficiency and command overhead in burst-oriented traffic. |
| Refresh Interval | 64 ms (4K rows): meets JEDEC DDR SDRAM refresh requirements with minimal controller intervention. |
Pinout & Package
60-ball Thin Fine-Pitch Ball Grid Array (TFBGA) package, 8 mm × 13 mm body size, 0.8 mm ball pitch, RoHS-compliant lead-free construction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A11 | Address Input | Multiplexed row/column address lines; A10 controls single-bank vs. all-bank precharge. |
| BA0, BA1 | Bank Select | Selects one of four internal banks during activate, read, write, or precharge commands. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus synchronized to both edges of DQS; supports full DDR bandwidth. |
| LDQS, UDQS | Data Strobe | Lower/upper byte DQS pairs; edge-aligned on read, center-aligned on write for timing margin. |
| LDM, UDM | Write Mask | Independent masking of DQ[7:0] (LDM) and DQ[15:8] (UDM) during burst writes. |
| CLK, CLK̅ | Differential Clock | Timing reference for all commands and data; sampling occurs at crossing point of CLK/CLK̅. |
| CKE | Clock Enable | Controls entry/exit from power-down, self-refresh, and active power-down modes. |
| CS̅, RAS̅, CAS̅, WE̅ | Command Control | Active-low command bus decoded with CS̅ enabling/disabling the command decoder. |
| VDD, VSS | Core Power/Ground | 2.5 V supply and return for internal logic; decoupling required per JEDEC DDR layout guidelines. |
| VDDQ, VSSQ | I/O Power/Ground | Separate 2.5 V rail and ground for DQ/DQS/DM buffers to minimize switching noise coupling. |
| VREF | Input Reference | 0.5 × VDD reference for SSTL_2 input threshold; must be stable during self-refresh. |
Key Features
| Feature | Design Value |
|---|---|
| Industrial Temperature Range | Rated -40°C to +85°C: eliminates thermal qualification risk in extended-environment deployments. |
| Programmable CAS Latency | CL = 2, 2.5, 3, or 4: allows system-level tuning of read latency vs. timing margin trade-offs. |
| Dual Data Masking | Independent LDM/UDM pins: enables precise 8-bit granularity write masking without software overhead. |
| DLL-Based Timing Calibration | On-die delay-locked loop: compensates for process/voltage/temperature variation to maintain DQS–DQ alignment. |
| Power Management Modes | Precharged/active power-down and self-refresh: reduces IDD to ≤2 mA during idle periods. |
| JEDEC DDR Compliance | Fully compliant with DDR SDRAM standard (JESD79): ensures interoperability with industry-standard controllers. |
Applications
| Industrial HMI Controller | Network Edge Router Buffer |
|---|---|
Use Scenario: Real-time display rendering and touch response handling in factory-floor HMIs exposed to wide ambient temperature swings. IC Role / Device Role / Timing Role: Primary working memory for ARM Cortex-A series SoC, buffering frame buffers and UI assets with deterministic CL3 access. Use Value: -40°C to +85°C rating avoids external thermal management; 2.5 V SSTL_2 interface simplifies level-shifting with host processor. |
Use Scenario: Packet buffering in fanless, DIN-rail mounted edge routers deployed in unconditioned telecom cabinets. IC Role / Device Role / Timing Role: High-throughput packet queue memory interfacing directly to MIPS-based network processor DDR controller. Use Value: 128 Mbit density provides sufficient buffer depth for 10/100 Mbps line-rate traffic; low 2 mA self-refresh extends uptime during brownouts. |
| Medical Imaging Subsystem | Automated Test Equipment (ATE) |
Use Scenario: Frame storage in portable ultrasound devices requiring radiation-tolerant, long-lifecycle components. IC Role / Device Role / Timing Role: Dual-port-capable memory for simultaneous acquisition and display pipelines using bank interleaving. Use Value: 4-bank architecture enables concurrent read/write across banks; tRC = 50 ns supports tight refresh scheduling in safety-critical firmware. |
Use Scenario: Pattern memory in semiconductor test handlers where thermal cycling and long-term reliability are critical. IC Role / Device Role / Timing Role: Storage for test vectors and expected results accessed by FPGA-based pattern generator at 200 MHz. Use Value: TFBGA package resists mechanical stress from repeated board insertion; industrial temp grade prevents calibration drift over 10,000+ thermal cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT46V32M16-5B:J | Same density (128 Mbit), 60-ball TFBGA, but rated 0°C to +70°C only; tRC = 48 ns, slightly faster refresh timing. | Lacks industrial temperature support; unsuitable for cold-start or high-ambient deployments. | Select only for commercial-temperature applications where cost is prioritized over thermal robustness. |
| IS42S16160F-5BLI | Identical -5I speed grade and -40°C to +85°C rating; same 60-ball TFBGA; tRC = 50 ns matches W9412G6JB-5I TR exactly. | Pin-compatible with identical ball map and command set; validated drop-in replacement per ISSI documentation. | Preferred for second-source assurance where identical thermal and timing behavior is required. |
Compared with MT46V32M16-5B:J, W9412G6JB-5I TR delivers guaranteed operation down to -40°C and matches tRC timing, making it superior for industrial use; versus IS42S16160F-5BLI, it offers equivalent specs but distinct manufacturer qualification-both are viable for drop-in substitution where sourcing diversity is needed.
Availability
W9412G6JB-5I TR is available at Aetrix Electronics and suitable for industrial HMI controllers, network edge routers, medical imaging subsystems, and automated test equipment requiring stable component supply across extended temperature ranges and multi-year production cycles.
Supply support for W9412G6JB-5I TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory and microcontrollers, with over 30 years of DRAM design heritage and ISO/TS 16949-certified manufacturing.
The W9412G6JB series belongs to Winbond's industrial-grade DDR SDRAM product line, engineered specifically for embedded systems demanding extended temperature operation, low-power self-refresh, and JEDEC-compliant timing stability in resource-constrained environments.
FAQ
What is the maximum clock frequency supported by the W9412G6JB-5I TR?
The W9412G6JB-5I TR supports a maximum clock frequency of 200 MHz, corresponding to a clock cycle time (tCK) of 5 ns under DDR400/CL3 conditions. This is verified in the datasheet's KEY PARAMETERS table for the -5I speed grade at CL = 3, where tCK min = 5 ns. The device is not rated for DDR500 operation; that requires the -4 variant.
Does the W9412G6JB-5I TR support self-refresh mode, and what is its typical current draw?
Yes, the W9412G6JB-5I TR supports self-refresh mode with a maximum current draw of 2 mA, as specified in the Electrical Characteristics section (IDD6 parameter). This low current enables extended data retention during system sleep or power-loss events without external clocking, and the rating applies across the full -40°C to +85°C operating range.
What package type and ball count does the W9412G6JB-5I TR use?
The W9412G6JB-5I TR uses a 60-ball Thin Fine-Pitch Ball Grid Array (TFBGA) package measuring 8 mm × 13 mm with 0.8 mm ball pitch. This is confirmed in Section 2 (Features) and Section 13 (Package Specification) of the datasheet, and the ball configuration diagram (Section 5) explicitly labels all 60 positions including depopulated locations.
How is write masking implemented on the W9412G6JB-5I TR?
Write masking on the W9412G6JB-5I TR is implemented via two dedicated signals: LDM (Lower Data Mask) controls DQ[7:0], and UDM (Upper Data Mask) controls DQ[15:8]. As stated in Section 6 (Ball Description) and Section 8.2.16, asserting either signal high during a burst write masks the corresponding 8-bit byte, enabling precise partial-word updates without read-modify-write overhead.
Is the W9412G6JB-5I TR compatible with standard DDR memory controllers?
Yes, the W9412G6JB-5I TR is fully JEDEC-compliant DDR SDRAM and interoperable with standard DDR controllers supporting DDR400/CL3 timing. Its command set (activate, precharge, read, write, MRS, EMRS, auto-refresh), SSTL_2 interface, and timing parameters (tRCD = 15 ns, tRP = 15 ns, tRAS = 40 ns) align with JESD79 specifications, and no controller-specific initialization sequences beyond standard DDR power-up flow are required.
W9412G6JB-5I TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 54-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - DDR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- SSTL_2
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 50 ns
- Voltage - Supply:
- 2.7V ~ 2.3V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-TFBGA (8x8)
W9412G6JB-5I TR FAQ
1.How can I place an order for W9412G6JB-5I TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W9412G6JB-5I TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W9412G6JB-5I TR reliable?
The price and inventory of W9412G6JB-5I TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9412G6JB-5I TR is usually 5 days.
3.What payment methods are accepted for W9412G6JB-5I TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9412G6JB-5I TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W9412G6JB-5I TR?
W9412G6JB-5I TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W9412G6JB-5I TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W9412G6JB-5I TR?
For technical support, including W9412G6JB-5I TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9412G6JB-5I TR requirements.
6.How does Aetrix verify that W9412G6JB-5I TR is sourced from the original manufacturer or authorized distributors?
All W9412G6JB-5I TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9412G6JB-5I TR meets industry standards.
7.What is the process for return or replacement of W9412G6JB-5I TR?
All W9412G6JB-5I TR units undergo pre-shipment inspection (PSI). If there is an issue with W9412G6JB-5I TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W9412G6JB-5I TR part is unused and in its original packaging.
Return procedure for W9412G6JB-5I TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W9412G6JB-5I TR Tags

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M24C02-WMN6TP
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AT21CS01-STUM10-T
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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