Winbond Electronics Corporation W9412G6JH-4
- Part No.:
- W9412G6JH-4
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 66-TSSOP (0.400", 10.16mm Width)
- Datasheet:
-
W9412G6JH-4.pdf
- Description:
- IC DRAM 128MBIT SSTL2 66TSOP II
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
W9412G6JH-4 from Winbond Electronics is a 2M × 4 banks × 16-bit DDR SDRAM IC operating at up to 250 MHz with 2.4–2.7 V supply, CL2–CL4 latency support, and SSTL_2 interface - designed for high-bandwidth main memory in embedded computing and industrial control systems requiring DDR500/CL3–CL4 compliance.
For engineers reviewing the W9412G6JH-4 datasheet, W9412G6JH-4 pinout, W9412G6JH-4 application, or W9412G6JH-4 equivalent, key selection factors include tCK = 4 ns (CL=4), tRAS ≥ 40 ns, burst length programmability (2/4/8), differential clock (CLK/CLK̅) timing, and TSOP II 66-pin package compatibility with legacy DDR memory controllers.
Technical Context
This DDR SDRAM implements double-data-rate architecture synchronized to both edges of DQS for read/write data transfers, with DLL-enabled timing calibration and programmable mode register settings for CAS latency, burst length, and addressing mode. It supports bank-interleaved reads across all four internal banks to sustain peak bandwidth.
Command decoding relies on CS, RAS, CAS, and WE inputs sampled on CLK/CLK̅ crossing; write masking uses LDM/UDM per-byte control aligned with DQS edges; and refresh is managed via auto-refresh (tREFI = 15.6 µs) or self-refresh (IDD6 ≤ 2 mA) modes - all compliant with JEDEC DDR SDRAM standard JESD79.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 32 Mbit (2M words × 16 bits × 4 banks) |
| Max Clock Frequency | 250 MHz - enables 500 MT/s data rate with DDR architecture |
| CAS Latency | Programmable CL2, CL2.5, CL3, CL4 - determines minimum read access delay in clock cycles |
| Burst Length | 2, 4, or 8 - defines number of consecutive data transfers per read/write command |
| tCK (Clock Cycle) | 4 ns min (CL=4 grade) - sets maximum operational speed and timing margin baseline |
| tRAS | ≥40 ns - minimum active-to-precharge interval; constrains row activation window |
| Supply Voltage | 2.4 V to 2.7 V - required for DDR500 operation; incompatible with 2.5 V ±0.2 V DDR400-only supplies |
| Interface Standard | SSTL_2 - mandates 1.25 V reference level (VREF) and controlled-impedance PCB routing |
Pinout & Package
W9412G6JH-4 is housed in a RoHS-compliant, lead-free 66-pin TSOP II (400 mil) package with separate VDD/VDDQ and VSS/VSSQ rails for logic and I/O noise isolation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A11 | Address Input | Multiplexed row/column address lines; A10 controls auto-precharge enable |
| BA0, BA1 | Bank Address | Selects one of four internal banks during activate/read/write commands |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus synchronized to both edges of DQS |
| LDQS, UDQS | Data Strobe | Lower/upper byte DQS signals - edge-aligned on read, center-aligned on write |
| LDM, UDM | Data Mask | Byte-level write mask: LDM controls DQ0–DQ7, UDM controls DQ8–DQ15 |
| CLK, CLK̅ | Differential Clock | Timing reference for all command/address inputs; crossing point defines sampling edge |
| CKE | Clock Enable | Controls entry/exit from power-down and self-refresh modes |
| VREF | Input Reference | 1.25 V reference for SSTL_2 input threshold; must be stable during self-refresh |
Key Features
| Feature | Design Value |
|---|---|
| Double Data Rate Architecture | Two data transfers per clock cycle - doubles effective bandwidth without increasing clock frequency |
| Programmable Mode Register | Configures CAS latency, burst length, and addressing mode at power-up - enables system-level timing optimization |
| Differential Clock Interface | CLK/CLK̅ inputs reduce jitter sensitivity and improve timing margin in noisy environments |
| Per-Byte Write Masking | LDM/UDM allow selective byte disabling during burst writes - prevents partial-word corruption |
| Self-Refresh Mode | IDD6 ≤ 2 mA retention current - maintains data integrity during host processor sleep or power gating |
| Four-Bank Interleaving | Enables concurrent row activation across banks - sustains throughput during sequential access patterns |
Applications
| Industrial HMI Display Controller | Network Router Packet Buffer |
|---|---|
Use Scenario: Real-time rendering of GUI overlays and video frame buffers in factory-floor HMIs with ARM-based SoCs. IC Role / Device Role / Timing Role: Main system memory providing low-latency, burst-access storage for display controller DMA engines. Use Value: CL3/CL4 programmability and 250 MHz clock support enable consistent 500 MT/s throughput for dual-channel 16-bit pixel pipelines. | Use Scenario: Temporary storage of ingress/egress packet headers and metadata in Layer 3 enterprise routers. IC Role / Device Role / Timing Role: High-speed packet buffer interfacing directly with MIPS or PowerPC network processors via DDR controller. Use Value: Four-bank interleaving and auto-precharge reduce average access latency under mixed read/write traffic typical of QoS-aware forwarding. |
| Medical Imaging Front-End Module | Automotive ADAS Camera Preprocessor |
Use Scenario: Frame buffering for real-time ultrasound beamforming and DICOM image compression in portable diagnostic devices. IC Role / Device Role / Timing Role: Dedicated memory subsystem for FPGA-accelerated image processing pipelines with strict jitter tolerance. Use Value: Differential CLK/CLK̅ and DLL calibration ensure sub-nanosecond timing stability required for coherent RF sampling synchronization. | Use Scenario: On-camera preprocessing of raw sensor data before transmission over MIPI CSI-2 to domain controller. IC Role / Device Role / Timing Role: Local frame buffer enabling pixel-level filtering, HDR merging, and lens correction in automotive camera modules. Use Value: SSTL_2 interface and 2.4–2.7 V supply range match automotive-grade DDR PHY requirements while supporting -40°C to +85°C operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT46V32M16P-5B:J | Same density (32 Mbit), 66-pin TSOP, but rated for DDR400 (200 MHz) and 2.5 V ±0.2 V only - lacks DDR500 capability and wider voltage range | Targeted at cost-sensitive consumer electronics where 400 MT/s suffices; not suitable for DDR500 designs requiring tCK = 4 ns | Select only if system clock is ≤200 MHz and supply is strictly 2.5 V ±0.2 V; verify VDDQ/VSSQ separation matches |
| IS42S16320B-6TL | Identical 32 Mbit × 16-bit organization and 66-pin TSOP, but supports CL2.5/CL3 only and requires 2.5 V ±0.2 V - no CL4 or 2.4–2.7 V flexibility | Used in legacy PC motherboards and set-top boxes; lacks extended voltage margin needed for industrial thermal derating | Acceptable for CL3-only systems with stable 2.5 V supply; avoid in designs requiring CL4 or wide-voltage operation |
Compared with MT46V32M16P-5B:J and IS42S16320B-6TL, W9412G6JH-4 uniquely supports DDR500 operation (250 MHz), programmable CL4, and 2.4–2.7 V supply - making it the only option among the three for industrial applications demanding higher bandwidth and voltage robustness.
Availability
W9412G6JH-4 is available at Aetrix Electronics and suitable for industrial HMI display controllers, network router packet buffers, medical imaging front-end modules, and automotive ADAS camera preprocessors requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for W9412G6JH-4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions including NOR/NAND Flash, SRAM, and DRAM products for industrial, automotive, and communications markets.
W9412G6JH-4 belongs to Winbond's DDR SDRAM product line engineered for cost-effective, pin-compatible migration from legacy SDR and early DDR platforms in resource-constrained embedded systems.
FAQ
What is the maximum operating frequency supported by W9412G6JH-4?
W9412G6JH-4 supports a maximum clock frequency of 250 MHz, corresponding to a DDR500 data rate (500 MT/s). This is validated by its -4 speed grade specification, which guarantees tCK = 4 ns minimum clock cycle time under CL4 conditions and 2.4–2.7 V supply. Operation above 250 MHz violates timing specifications and may cause data corruption or command decode failure.
Does W9412G6JH-4 require external VREF, and what is its nominal value?
Yes, W9412G6JH-4 requires an externally supplied VREF reference voltage at Pin 49, with a nominal value of 1.25 V ±1% - mandated by the SSTL_2 interface standard. This reference must remain stable during all operational modes, including self-refresh, and must be decoupled with 0.1 µF ceramic capacitance near the VREF pin to maintain input threshold accuracy.
Can W9412G6JH-4 operate with a 2.5 V ±0.2 V supply like DDR400 SDRAMs?
No - W9412G6JH-4 is specified for DDR500 operation and requires a 2.4 V to 2.7 V supply range. While 2.5 V falls within this window, the ±0.2 V tolerance (2.3–2.7 V) exceeds the lower limit of 2.4 V. Supplying 2.3 V risks violating tCK and setup/hold timing margins; use only regulated 2.4–2.7 V sources with ≤±2% tolerance for reliable W9412G6JH-4 operation.
How many banks does W9412G6JH-4 contain, and how are they accessed?
W9412G6JH-4 contains four independent memory banks (Bank #0 through Bank #3), selected using BA0 and BA1 address pins during activate, read, write, and precharge commands. Bank interleaving allows concurrent row activation across banks, enabling continuous burst transfers without waiting for tRAS to expire - critical for sustaining peak bandwidth in streaming applications.
What is the purpose of the LDM and UDM pins on W9412G6JH-4?
LDM (Pin 20) and UDM (Pin 43) are byte-level write mask signals on W9412G6JH-4: LDM controls masking of DQ0–DQ7 (lower byte), and UDM controls DQ8–DQ15 (upper byte). When asserted high during a write burst, they prevent corresponding data bytes from being written to the memory array - essential for partial-word updates without read-modify-write overhead.
W9412G6JH-4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 66-TSSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - DDR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- SSTL_2
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- 12ns
- Access Time:
- 48 ns
- Voltage - Supply:
- 2.4V ~ 2.7V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 66-TSOP II
W9412G6JH-4 FAQ
1.How can I place an order for W9412G6JH-4 through Aetrix?
Please submit a Request for Quotation (RFQ) for W9412G6JH-4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W9412G6JH-4 reliable?
The price and inventory of W9412G6JH-4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9412G6JH-4 is usually 5 days.
3.What payment methods are accepted for W9412G6JH-4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9412G6JH-4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W9412G6JH-4?
W9412G6JH-4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W9412G6JH-4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W9412G6JH-4?
For technical support, including W9412G6JH-4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9412G6JH-4 requirements.
6.How does Aetrix verify that W9412G6JH-4 is sourced from the original manufacturer or authorized distributors?
All W9412G6JH-4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9412G6JH-4 meets industry standards.
7.What is the process for return or replacement of W9412G6JH-4?
All W9412G6JH-4 units undergo pre-shipment inspection (PSI). If there is an issue with W9412G6JH-4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W9412G6JH-4 part is unused and in its original packaging.
Return procedure for W9412G6JH-4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W9412G6JH-4 Tags

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M24C02-WMN6TP
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AT24C02C-XHM-T
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M24C02-FMC6TG
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