Winbond Electronics Corporation W9412G6JH-5I
- Part No.:
- W9412G6JH-5I
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 66-TSSOP (0.400", 10.16mm Width)
- Datasheet:
-
W9412G6JH-5I.pdf
- Description:
- IC DRAM 128MBIT SSTL2 66TSOP II
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
W9412G6JH-5I from Winbond Electronics is a 2M × 4 banks × 16-bit DDR SDRAM operating at 200 MHz (tCK = 5 ns), compliant with DDR400/CL3 specification, featuring SSTL_2 interface, programmable CAS latency (2–4), and 66-pin TSOP II package. It serves as main memory in embedded controllers and industrial computing platforms requiring low-power, pin-efficient synchronous DRAM.
For engineers reviewing the W9412G6JH-5I datasheet, W9412G6JH-5I pinout, W9412G6JH-5I application, or W9412G6JH-5I equivalent, key selection considerations include CL3 timing compliance, 2.5V ±0.2V supply tolerance, 4-bank interleaving support, DQS edge/center alignment behavior, and TSOP II thermal/mechanical constraints for PCB layout and signal integrity validation.
Technical Context
This DDR SDRAM implements double-data-rate architecture synchronized to both edges of CLK/CLK differential clock inputs, with DQS aligned to read data edges and write data centers. Its DLL-enabled timing control supports stable operation across temperature and voltage variations, and mode register programming allows dynamic configuration of burst length (2/4/8), addressing mode (sequential/interleave), and CAS latency.
The device integrates four independent 2M-word banks with shared command/address bus and separate I/O power (VDDQ/VSSQ) for noise isolation. Refresh is managed via Auto Refresh (4K rows/64 ms) or Self Refresh (IDD6 ≤ 2 mA), and power-down modes (Precharged/Active) reduce IDD during idle cycles without losing data integrity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 2M words × 4 banks × 16 bits = 128 Mbit density; enables 16-bit data path with bank-level concurrency for burst efficiency. |
| Speed Grade | W9412G6JH-5I: DDR400/CL3 compliant; tCK = 5 ns min, CL = 3 at 200 MHz; validated for stable operation under 2.5V ±0.2V supply. |
| CAS Latency | Programmable CL2/2.5/3/4; CL3 setting yields 3-cycle access delay from READ command to first valid DQ output. |
| Burst Length | Configurable 2/4/8; BL=4 provides optimal balance between bandwidth utilization and command overhead in most embedded systems. |
| Refresh Interval | 15.6 µs max between refresh commands; ensures full 4K-row refresh within 64 ms per JEDEC DDR standard. |
| Power Supply | VDD = 2.5V ±0.2V, VDDQ = 2.5V ±0.2V; separate I/O rail minimizes switching noise coupling into core logic. |
| Package | 66-pin TSOP II (400 mil); RoHS-compliant lead-free construction; compatible with standard surface-mount reflow profiles. |
Pinout & Package
W9412G6JH-5I uses a 66-pin Thin Small Outline Package (TSOP II), 400 mil body width, with dual VDD/VSS and isolated VDDQ/VSSQ rails for signal integrity. Pin 1 is located at bottom-left corner when notch faces up.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A11 | Address Input | Multiplexed row/column address lines; A10 controls auto-precharge enable during column commands. |
| BA0, BA1 | Bank Address | Selects one of four internal banks for activation, read, or write operations; enables bank-level parallelism. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus synchronized to both edges of DQS; supports 32-byte burst transfers per cycle. |
| LDQS, UDQS | Data Strobe | Lower/upper byte DQS signals; edge-aligned on read, center-aligned on write; critical for DDR timing margin calibration. |
| LDM, UDM | Data Mask | Byte-level write masking: LDM controls DQ0–DQ7, UDM controls DQ8–DQ15; prevents partial-word corruption during burst writes. |
| CLK, CLK | Differential Clock | Reference clock pair sampled at crossing point; defines all command and data timing windows; requires matched trace routing. |
| CKE | Clock Enable | Controls entry/exit from Power Down, Self Refresh, and Suspend modes; low = clock gated, high = active operation. |
| VREF | Input Reference | 2.5V reference for SSTL_2 input receivers; must be stable during Self Refresh to maintain input threshold integrity. |
Key Features
| Feature | Design Value |
|---|---|
| Double Data Rate Architecture | Two data transfers per clock cycle (rising/falling CLK edges) doubles effective bandwidth without increasing clock frequency. |
| Programmable Mode Register | Enables runtime configuration of CAS latency, burst length, and addressing mode-critical for system-level timing optimization. |
| Separate I/O Power Rails | VDDQ/VSSQ isolation reduces crosstalk between data output drivers and core logic, improving signal integrity in dense layouts. |
| Auto & Self Refresh Support | Auto Refresh maintains data with external controller coordination; Self Refresh (IDD6 ≤ 2 mA) sustains memory state during host sleep with no clock required. |
| Write Data Masking | LDM/UDM pins allow per-byte suppression of write data, enabling safe partial-word updates without read-modify-write overhead. |
Applications
| Industrial HMI Controller | Medical Imaging Subsystem |
|---|---|
Use Scenario: Real-time display buffering and GUI rendering in panel-mounted HMIs with ARM-based SoCs. IC Role / Device Role / Timing Role: Primary working memory interfaced directly to processor AXI/AHB bus; operates in CL3, BL4 mode for predictable latency. Use Value: 128 Mbit density and 4-bank interleaving sustain >600 MB/s sustained read throughput while maintaining <15 ns tRCD for deterministic response. | Use Scenario: Frame buffer storage in portable ultrasound devices requiring low standby power and compact footprint. IC Role / Device Role / Timing Role: Offloads image processing pipeline by storing acquired scan-line buffers; enters Self Refresh during inter-scan idle periods. Use Value: IDD6 ≤ 2 mA Self Refresh current extends battery life; TSOP II package fits tight board space constraints without thermal derating. |
| Network Edge Router | Automotive ADAS Camera Module |
Use Scenario: Packet buffering and lookup table storage in fanless enterprise edge routers with thermal limits. IC Role / Device Role / Timing Role: Shared memory resource for packet classification engines and forwarding tables; configured for BL8 sequential bursts. Use Value: SSTL_2 interface ensures compatibility with FPGA-based MAC controllers; tRC = 50 ns enables rapid bank cycling for concurrent packet handling. | Use Scenario: Raw sensor frame buffering in rear-view camera modules with ASIL-B functional safety requirements. IC Role / Device Role / Timing Role: High-reliability memory for ISO 26262-compliant vision preprocessing; operates at CL3 with ECC-disabled but CRC-checked interface. Use Value: 2.5V ±0.2V supply tolerance accommodates automotive battery fluctuations; 66-pin TSOP II supports automated optical inspection (AOI) for zero-defect manufacturing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT46V32M16P-5B:J | Same 512 Mbit density (32M×16), but -5B speed grade specifies tCK = 5 ns at 2.5V; identical CL3, BL4, TSOP II pinout. | Designed for server DIMMs; higher IDD0/IDD1 ratings imply less aggressive power gating than W9412G6JH-5I. | Preferred where legacy Micron design-in exists; verify thermal profile matches due to higher IDD4W (135 mA vs. 115 mA). |
| K4H511638D-UCB3 | 256 Mbit (16M×16), -UCB3 grade: tCK = 5 ns, CL3, but uses 60-pin TSOP-different pin count and VREF placement. | Targeted at notebook memory modules; lacks dedicated LDM/UDM pins-uses single DM for full 16-bit mask. | Only viable if redesign accommodates 60-pin footprint and revised DQS/DM routing; not drop-in compatible. |
Compared with MT46V32M16P-5B:J and K4H511638D-UCB3, W9412G6JH-5I offers lower active current (IDD4W = 115 mA), explicit LDM/UDM byte masking, and tighter thermal specs for industrial ambient ranges-making it optimal for thermally constrained, power-sensitive embedded designs.
Availability
W9412G6JH-5I is available at Aetrix Electronics and suitable for industrial HMI controllers, medical imaging subsystems, and automotive ADAS camera modules requiring stable component supply across extended temperature ranges and multi-year production cycles.
Supply support for W9412G6JH-5I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including NOR/NAND Flash, SRAM, and DDR SDRAM for industrial, automotive, and communications markets.
The W9412G6JH series belongs to Winbond's industrial-grade DDR SDRAM product line, designed specifically for embedded systems demanding robust operation at -40°C to +85°C with strict power and timing predictability.
FAQ
What is the maximum clock frequency supported by W9412G6JH-5I?
W9412G6JH-5I supports a maximum clock frequency of 200 MHz, corresponding to a minimum clock cycle time (tCK) of 5 ns. This is validated under DDR400/CL3 specification with 2.5V ±0.2V supply and meets JEDEC JESD79-2F timing requirements for stable operation across industrial temperature range (-40°C to +85°C). The W9412G6JH-5I datasheet specifies tCK = 5 ns as the guaranteed minimum in the -5 speed grade.
Does W9412G6JH-5I support CAS Latency 2.5?
Yes, W9412G6JH-5I supports programmable CAS Latency values of 2, 2.5, 3, and 4 via Mode Register configuration. CL2.5 is implemented using fractional clock cycle timing and requires precise DQS-to-CLK phase alignment; it is validated in the W9412G6JH-5I datasheet Table 3 under AC characteristics for -5 grade operation at 200 MHz.
What is the function of the VREF pin on W9412G6JH-5I?
The VREF pin on W9412G6JH-5I provides a stable 2.5V reference voltage for SSTL_2 input receivers, ensuring consistent switching thresholds for address, command, and control signals. It must remain powered and stable during all operational modes-including Self Refresh-where CKE is low but VREF is still required to maintain input validity. The W9412G6JH-5I datasheet specifies VREF = 2.5V ±2% for reliable operation.
Can W9412G6JH-5I operate in Self Refresh mode with CKE held low?
Yes, W9412G6JH-5I enters Self Refresh mode when CKE is driven low while all banks are idle, consuming ≤2 mA (IDD6) to retain data without external clocking. The W9412G6JH-5I datasheet confirms this behavior in Section 7.2.14 and specifies that VREF must remain active during Self Refresh to preserve input receiver functionality for wake-up detection.
How many banks does W9412G6JH-5I have, and how are they accessed?
W9412G6JH-5I has four independent memory banks (Bank #0 to #3), selected using BA0 and BA1 address pins during activate, precharge, and read/write commands. Bank-level interleaving enables concurrent row activation across banks, improving effective bandwidth-e.g., 4-bank interleave read operation is explicitly timed in W9412G6JH-5I datasheet Figures 11.21–11.22.
W9412G6JH-5I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 66-TSSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - DDR
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 16
- Memory Interface:
- SSTL_2
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 50 ns
- Voltage - Supply:
- 2.3V ~ 2.7V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 66-TSOP II
W9412G6JH-5I FAQ
1.How can I place an order for W9412G6JH-5I through Aetrix?
Please submit a Request for Quotation (RFQ) for W9412G6JH-5I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W9412G6JH-5I reliable?
The price and inventory of W9412G6JH-5I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9412G6JH-5I is usually 5 days.
3.What payment methods are accepted for W9412G6JH-5I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9412G6JH-5I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W9412G6JH-5I?
W9412G6JH-5I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W9412G6JH-5I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W9412G6JH-5I?
For technical support, including W9412G6JH-5I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9412G6JH-5I requirements.
6.How does Aetrix verify that W9412G6JH-5I is sourced from the original manufacturer or authorized distributors?
All W9412G6JH-5I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9412G6JH-5I meets industry standards.
7.What is the process for return or replacement of W9412G6JH-5I?
All W9412G6JH-5I units undergo pre-shipment inspection (PSI). If there is an issue with W9412G6JH-5I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W9412G6JH-5I part is unused and in its original packaging.
Return procedure for W9412G6JH-5I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W9412G6JH-5I Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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Microchip Technology

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Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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