Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Winbond Electronics Corporation W9412G6JH-5I

Part No.:
W9412G6JH-5I
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
66-TSSOP (0.400", 10.16mm Width)
Datasheet:
AetrixW9412G6JH-5I.pdf
Description:
IC DRAM 128MBIT SSTL2 66TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,141

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

W9412G6JH-5I from Winbond Electronics is a 2M × 4 banks × 16-bit DDR SDRAM operating at 200 MHz (tCK = 5 ns), compliant with DDR400/CL3 specification, featuring SSTL_2 interface, programmable CAS latency (2–4), and 66-pin TSOP II package. It serves as main memory in embedded controllers and industrial computing platforms requiring low-power, pin-efficient synchronous DRAM.

For engineers reviewing the W9412G6JH-5I datasheet, W9412G6JH-5I pinout, W9412G6JH-5I application, or W9412G6JH-5I equivalent, key selection considerations include CL3 timing compliance, 2.5V ±0.2V supply tolerance, 4-bank interleaving support, DQS edge/center alignment behavior, and TSOP II thermal/mechanical constraints for PCB layout and signal integrity validation.

Technical Context

This DDR SDRAM implements double-data-rate architecture synchronized to both edges of CLK/CLK differential clock inputs, with DQS aligned to read data edges and write data centers. Its DLL-enabled timing control supports stable operation across temperature and voltage variations, and mode register programming allows dynamic configuration of burst length (2/4/8), addressing mode (sequential/interleave), and CAS latency.

The device integrates four independent 2M-word banks with shared command/address bus and separate I/O power (VDDQ/VSSQ) for noise isolation. Refresh is managed via Auto Refresh (4K rows/64 ms) or Self Refresh (IDD6 ≤ 2 mA), and power-down modes (Precharged/Active) reduce IDD during idle cycles without losing data integrity.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization2M words × 4 banks × 16 bits = 128 Mbit density; enables 16-bit data path with bank-level concurrency for burst efficiency.
Speed GradeW9412G6JH-5I: DDR400/CL3 compliant; tCK = 5 ns min, CL = 3 at 200 MHz; validated for stable operation under 2.5V ±0.2V supply.
CAS LatencyProgrammable CL2/2.5/3/4; CL3 setting yields 3-cycle access delay from READ command to first valid DQ output.
Burst LengthConfigurable 2/4/8; BL=4 provides optimal balance between bandwidth utilization and command overhead in most embedded systems.
Refresh Interval15.6 µs max between refresh commands; ensures full 4K-row refresh within 64 ms per JEDEC DDR standard.
Power SupplyVDD = 2.5V ±0.2V, VDDQ = 2.5V ±0.2V; separate I/O rail minimizes switching noise coupling into core logic.
Package66-pin TSOP II (400 mil); RoHS-compliant lead-free construction; compatible with standard surface-mount reflow profiles.

Pinout & Package

W9412G6JH-5I uses a 66-pin Thin Small Outline Package (TSOP II), 400 mil body width, with dual VDD/VSS and isolated VDDQ/VSSQ rails for signal integrity. Pin 1 is located at bottom-left corner when notch faces up.

Pin/TerminalCircuit RoleDesign Meaning
A0–A11Address InputMultiplexed row/column address lines; A10 controls auto-precharge enable during column commands.
BA0, BA1Bank AddressSelects one of four internal banks for activation, read, or write operations; enables bank-level parallelism.
DQ0–DQ15Data I/O16-bit bidirectional data bus synchronized to both edges of DQS; supports 32-byte burst transfers per cycle.
LDQS, UDQSData StrobeLower/upper byte DQS signals; edge-aligned on read, center-aligned on write; critical for DDR timing margin calibration.
LDM, UDMData MaskByte-level write masking: LDM controls DQ0–DQ7, UDM controls DQ8–DQ15; prevents partial-word corruption during burst writes.
CLK, CLKDifferential ClockReference clock pair sampled at crossing point; defines all command and data timing windows; requires matched trace routing.
CKEClock EnableControls entry/exit from Power Down, Self Refresh, and Suspend modes; low = clock gated, high = active operation.
VREFInput Reference2.5V reference for SSTL_2 input receivers; must be stable during Self Refresh to maintain input threshold integrity.

Key Features

FeatureDesign Value
Double Data Rate ArchitectureTwo data transfers per clock cycle (rising/falling CLK edges) doubles effective bandwidth without increasing clock frequency.
Programmable Mode RegisterEnables runtime configuration of CAS latency, burst length, and addressing mode-critical for system-level timing optimization.
Separate I/O Power RailsVDDQ/VSSQ isolation reduces crosstalk between data output drivers and core logic, improving signal integrity in dense layouts.
Auto & Self Refresh SupportAuto Refresh maintains data with external controller coordination; Self Refresh (IDD6 ≤ 2 mA) sustains memory state during host sleep with no clock required.
Write Data MaskingLDM/UDM pins allow per-byte suppression of write data, enabling safe partial-word updates without read-modify-write overhead.

Applications

Industrial HMI ControllerMedical Imaging Subsystem

Use Scenario: Real-time display buffering and GUI rendering in panel-mounted HMIs with ARM-based SoCs.

IC Role / Device Role / Timing Role: Primary working memory interfaced directly to processor AXI/AHB bus; operates in CL3, BL4 mode for predictable latency.

Use Value: 128 Mbit density and 4-bank interleaving sustain >600 MB/s sustained read throughput while maintaining <15 ns tRCD for deterministic response.

Use Scenario: Frame buffer storage in portable ultrasound devices requiring low standby power and compact footprint.

IC Role / Device Role / Timing Role: Offloads image processing pipeline by storing acquired scan-line buffers; enters Self Refresh during inter-scan idle periods.

Use Value: IDD6 ≤ 2 mA Self Refresh current extends battery life; TSOP II package fits tight board space constraints without thermal derating.

Network Edge RouterAutomotive ADAS Camera Module

Use Scenario: Packet buffering and lookup table storage in fanless enterprise edge routers with thermal limits.

IC Role / Device Role / Timing Role: Shared memory resource for packet classification engines and forwarding tables; configured for BL8 sequential bursts.

Use Value: SSTL_2 interface ensures compatibility with FPGA-based MAC controllers; tRC = 50 ns enables rapid bank cycling for concurrent packet handling.

Use Scenario: Raw sensor frame buffering in rear-view camera modules with ASIL-B functional safety requirements.

IC Role / Device Role / Timing Role: High-reliability memory for ISO 26262-compliant vision preprocessing; operates at CL3 with ECC-disabled but CRC-checked interface.

Use Value: 2.5V ±0.2V supply tolerance accommodates automotive battery fluctuations; 66-pin TSOP II supports automated optical inspection (AOI) for zero-defect manufacturing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR SDRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MT46V32M16P-5B:JSame 512 Mbit density (32M×16), but -5B speed grade specifies tCK = 5 ns at 2.5V; identical CL3, BL4, TSOP II pinout.Designed for server DIMMs; higher IDD0/IDD1 ratings imply less aggressive power gating than W9412G6JH-5I.Preferred where legacy Micron design-in exists; verify thermal profile matches due to higher IDD4W (135 mA vs. 115 mA).
K4H511638D-UCB3256 Mbit (16M×16), -UCB3 grade: tCK = 5 ns, CL3, but uses 60-pin TSOP-different pin count and VREF placement.Targeted at notebook memory modules; lacks dedicated LDM/UDM pins-uses single DM for full 16-bit mask.Only viable if redesign accommodates 60-pin footprint and revised DQS/DM routing; not drop-in compatible.

Compared with MT46V32M16P-5B:J and K4H511638D-UCB3, W9412G6JH-5I offers lower active current (IDD4W = 115 mA), explicit LDM/UDM byte masking, and tighter thermal specs for industrial ambient ranges-making it optimal for thermally constrained, power-sensitive embedded designs.

Availability

W9412G6JH-5I is available at Aetrix Electronics and suitable for industrial HMI controllers, medical imaging subsystems, and automotive ADAS camera modules requiring stable component supply across extended temperature ranges and multi-year production cycles.

Supply support for W9412G6JH-5I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including NOR/NAND Flash, SRAM, and DDR SDRAM for industrial, automotive, and communications markets.

The W9412G6JH series belongs to Winbond's industrial-grade DDR SDRAM product line, designed specifically for embedded systems demanding robust operation at -40°C to +85°C with strict power and timing predictability.

FAQ

What is the maximum clock frequency supported by W9412G6JH-5I?

W9412G6JH-5I supports a maximum clock frequency of 200 MHz, corresponding to a minimum clock cycle time (tCK) of 5 ns. This is validated under DDR400/CL3 specification with 2.5V ±0.2V supply and meets JEDEC JESD79-2F timing requirements for stable operation across industrial temperature range (-40°C to +85°C). The W9412G6JH-5I datasheet specifies tCK = 5 ns as the guaranteed minimum in the -5 speed grade.

Does W9412G6JH-5I support CAS Latency 2.5?

Yes, W9412G6JH-5I supports programmable CAS Latency values of 2, 2.5, 3, and 4 via Mode Register configuration. CL2.5 is implemented using fractional clock cycle timing and requires precise DQS-to-CLK phase alignment; it is validated in the W9412G6JH-5I datasheet Table 3 under AC characteristics for -5 grade operation at 200 MHz.

What is the function of the VREF pin on W9412G6JH-5I?

The VREF pin on W9412G6JH-5I provides a stable 2.5V reference voltage for SSTL_2 input receivers, ensuring consistent switching thresholds for address, command, and control signals. It must remain powered and stable during all operational modes-including Self Refresh-where CKE is low but VREF is still required to maintain input validity. The W9412G6JH-5I datasheet specifies VREF = 2.5V ±2% for reliable operation.

Can W9412G6JH-5I operate in Self Refresh mode with CKE held low?

Yes, W9412G6JH-5I enters Self Refresh mode when CKE is driven low while all banks are idle, consuming ≤2 mA (IDD6) to retain data without external clocking. The W9412G6JH-5I datasheet confirms this behavior in Section 7.2.14 and specifies that VREF must remain active during Self Refresh to preserve input receiver functionality for wake-up detection.

How many banks does W9412G6JH-5I have, and how are they accessed?

W9412G6JH-5I has four independent memory banks (Bank #0 to #3), selected using BA0 and BA1 address pins during activate, precharge, and read/write commands. Bank-level interleaving enables concurrent row activation across banks, improving effective bandwidth-e.g., 4-bank interleave read operation is explicitly timed in W9412G6JH-5I datasheet Figures 11.21–11.22.

W9412G6JH-5I Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
66-TSSOP (0.400", 10.16mm Width)
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM - DDR
Memory Size:
128Mbit
Memory Organization:
8M x 16
Memory Interface:
SSTL_2
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
15ns
Access Time:
50 ns
Voltage - Supply:
2.3V ~ 2.7V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
66-TSOP II

W9412G6JH-5I FAQ

1.How can I place an order for W9412G6JH-5I through Aetrix?

Please submit a Request for Quotation (RFQ) for W9412G6JH-5I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9412G6JH-5I reliable?

The price and inventory of W9412G6JH-5I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9412G6JH-5I is usually 5 days.

3.What payment methods are accepted for W9412G6JH-5I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9412G6JH-5I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9412G6JH-5I?

W9412G6JH-5I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9412G6JH-5I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9412G6JH-5I?

For technical support, including W9412G6JH-5I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9412G6JH-5I requirements.

6.How does Aetrix verify that W9412G6JH-5I is sourced from the original manufacturer or authorized distributors?

All W9412G6JH-5I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9412G6JH-5I meets industry standards.

7.What is the process for return or replacement of W9412G6JH-5I?

All W9412G6JH-5I units undergo pre-shipment inspection (PSI). If there is an issue with W9412G6JH-5I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9412G6JH-5I part is unused and in its original packaging.

Return procedure for W9412G6JH-5I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

W9412G6JH-5I Tags

  • W9412G6JH-5I
  • W9412G6JH-5I PDF
  • W9412G6JH-5I Datasheet
  • W9412G6JH-5I Specifications
  • W9412G6JH-5I Images
  • Winbond Electronics Corporation
  • Winbond Electronics Corporation W9412G6JH-5I
  • Buy W9412G6JH-5I
  • W9412G6JH-5I Price
  • W9412G6JH-5I Distributor
  • W9412G6JH-5I Supplier
  • W9412G6JH-5I Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER