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Winbond Electronics Corporation W9412G6KH-5

Part No.:
W9412G6KH-5
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
66-TSSOP (0.400", 10.16mm Width)
Datasheet:
AetrixW9412G6KH-5.pdf
Description:
IC DRAM 128MBIT SSTL2 66TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,079

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Product details

Overview

W9412G6KH-5 from Winbond Electronics is a 2M × 4 banks × 16-bit DDR SDRAM operating at 200 MHz with 2.5V ±0.2V supply, CAS latency 3, and tCK = 5 ns (DDR400/CL3). It delivers up to 400M words/s bandwidth and supports auto-refresh, self-refresh, and programmable burst lengths (2/4/8) for embedded memory subsystems in industrial controllers and legacy PC platforms.

For engineers reviewing the W9412G6KH-5 datasheet, W9412G6KH-5 pinout, W9412G6KH-5 application, or W9412G6KH-5 equivalent, key selection considerations include its TSOP II-66 package, SSTL_2 interface compliance, differential clock (CLK/CLK̅) timing, DQS edge-/center-aligned I/O synchronization, and -5 speed grade's 0°C to 70°C operating range.

Technical Context

This DDR SDRAM implements a double-data-rate architecture synchronized to both edges of DQS, with separate VDDQ/VSSQ I/O power domains for noise isolation. Its command decoder interprets RAS/CAS/WE/CS combinations to execute bank activate, precharge, read/write, MRS/EMRS, and refresh operations under CKE control.

The device integrates a DLL for DQS-to-clock alignment, supports programmable CAS latency (2/2.5/3), burst addressing modes (sequential/interleaved), and dual data mask signals (LDM/UDM) for per-byte write masking. Power-down modes include precharged and active variants, with self-refresh current capped at 2 mA.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 2M × 4 banks × 16 bits = 128 Mbit total capacity; enables 16-bit wide data bus interfacing.
Speed Grade DDR400/CL3: 200 MHz clock, 5 ns tCK min, 12 ns tCK max; meets JEDEC DDR-400 timing requirements.
CAS Latency Programmable CL = 2, 2.5, or 3; determines minimum clock cycles between READ command and first valid data output.
Burst Length Configurable 2/4/8; defines number of consecutive data transfers per READ/WRITE command.
Refresh Interval 15.6 µs (4K/64 ms); requires periodic auto-refresh to retain data; supports up to 8 back-to-back refresh commands.
Supply Voltage 2.5V ±0.2V (VDD/VDDQ); strict tolerance ensures stable operation across temperature and process variation.
I/O Interface SSTL_2 compliant; matches standard DDR memory bus signaling for impedance-controlled trace routing.
Self-Refresh Current Max 2 mA; enables low-power data retention during system sleep without external clock or controller activity.

Pinout & Package

W9412G6KH-5 is packaged in a RoHS-compliant, lead-free TSOP II-66 package with 66 pins arranged in two rows. The package supports surface-mount assembly and thermal performance suitable for industrial ambient conditions.

Pin/Terminal Circuit Role Design Meaning
A0–A11 Address Input Multiplexed row/column address lines; A10 controls single-bank vs. all-bank precharge; sampled on CLK/CLK̅ crossing.
BA0, BA1 Bank Address Selects one of four internal banks during activate, read, write, or precharge commands.
DQ0–DQ15 Data I/O 16-bit bidirectional data bus; synchronized to both edges of DQS for DDR operation.
LDQS, UDQS Data Strobe Bidirectional strobe: edge-aligned with read data, center-aligned with write data; supports source-synchronous timing.
LDM, UDM Data Mask Write mask for lower/upper 8 bits (DQ0–7 / DQ8–15); asserted high to inhibit corresponding data writes.
CLK, CLK̅ Differential Clock Timing reference for all command/address inputs; sampling occurs at CLK/CLK̅ crossover point.
CKE Clock Enable Controls entry/exit from power-down and self-refresh modes; low disables internal clocking.
CS, RAS, CAS, WE Command Inputs Decode instruction set (activate, precharge, read, write, MRS, refresh); sampled synchronously with CLK.
VREF Input Reference Reference voltage for SSTL_2 input receivers; must be maintained during self-refresh.
VDD, VDDQ, VSS, VSSQ Power/Ground VDD/VSS for core logic; VDDQ/VSSQ isolated for I/O buffers to minimize switching noise coupling.

Key Features

Feature Design Value
Double Data Rate Architecture Two data transfers per clock cycle via DQS-synchronized edges-doubles effective bandwidth without increasing clock frequency.
Programmable Mode Register Enables runtime configuration of CAS latency, burst length, and addressing mode to match host controller requirements.
Differential Clock Interface CLK/CLK̅ inputs improve jitter immunity and enable precise timing margining in high-speed PCB layouts.
Separate I/O Power Domain VDDQ/VSSQ isolation reduces crosstalk between core logic and data bus, improving signal integrity for DQ/DQS/DM signals.
Auto & Self Refresh Support Internal refresh counter handles 4K-row refresh; self-refresh mode sustains data with only VDD/VDDQ/VREF applied and CKE low.
Write Data Masking LDM/UDM pins allow selective disabling of lower/upper byte writes-critical for partial-word updates without read-modify-write overhead.

Applications

Industrial HMI Controllers Legacy PC Memory Modules

Use Scenario: Real-time display buffering and GUI rendering in factory-floor HMIs with ARM9 or MIPS-based SoCs.

IC Role / Device Role / Timing Role: Primary working memory providing 16-bit parallel access to frame buffers and application code.

Use Value: DDR400 bandwidth supports 1024×768 @ 60 Hz video overlay; CL3 latency ensures deterministic response for touch-interrupt handling.

Use Scenario: Cost-optimized memory expansion in embedded x86 platforms (e.g., Intel Atom E3800 series) requiring DDR-400 compatibility.

IC Role / Device Role / Timing Role: Drop-in replacement for legacy DDR SDRAM modules in industrial motherboards with fixed 2.5V VDDQ rails.

Use Value: TSOP II-66 footprint matches existing PCB layouts; SSTL_2 interface eliminates level-shifter components.

Network Edge Routers Medical Diagnostic Terminals

Use Scenario: Packet buffer memory in Layer 2/3 switches supporting 10/100/1000BASE-T interfaces.

IC Role / Device Role / Timing Role: Shared packet memory accessed concurrently by multiple MAC engines and CPU cores.

Use Value: Four independent banks enable interleaved access-reducing tRC contention and sustaining >300 MB/s aggregate throughput.

Use Scenario: Image acquisition and DICOM processing in portable ultrasound or X-ray workstations.

IC Role / Device Role / Timing Role: High-reliability frame store for real-time image reconstruction pipelines.

Use Value: Self-refresh current ≤2 mA extends battery life during standby; -5I/-6I variants support extended temperature operation if needed.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR SDRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
MT46V32M16-5B:J Same 512 Mbit density (32M×16), but 2.6V–2.7V VDD range; tCK = 5 ns, CL3; FBGA-60 package. Requires higher VDD; incompatible pinout and package-needs PCB redesign. Choose only if migrating to Micron's newer DDR generation with tighter voltage tolerance and smaller footprint.
IS42S16100E-5BLI Same 128 Mbit (8M×16), 2.5V±0.2V, tCK = 5 ns, CL3; TSOP II-54 package (54-pin, not 66-pin). Fewer address/control pins; lacks EMRS support and DLL enable/disable capability. Acceptable for basic DDR-400 use where DLL calibration and extended mode features are unused.

Compared with W9412G6KH-5, MT46V32M16-5B:J offers higher density but mandates board-level voltage and layout changes, while IS42S16100E-5BLI provides functional equivalence at lower pin count but omits DLL control-making W9412G6KH-5 optimal for designs requiring precise DQS alignment and full JEDEC DDR-400 feature compliance.

Availability

W9412G6KH-5 is available at Aetrix Electronics and suitable for industrial HMI controllers, legacy PC memory modules, and network edge routers requiring stable component supply, long-lifecycle support, and RoHS-compliant manufacturing.

Supply support for W9412G6KH-5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and DDR SDRAM for industrial, automotive, and computing markets.

W9412G6KH-5 belongs to Winbond's legacy DDR SDRAM product line, designed specifically for cost-sensitive, reliability-critical applications where DDR-400 performance and TSOP II packaging are required without migration to DDR2 or later generations.

FAQ

What is the maximum clock frequency supported by W9412G6KH-5?

W9412G6KH-5 supports a maximum clock frequency of 200 MHz, corresponding to a minimum clock cycle time (tCK) of 5 ns. This meets the DDR-400 specification (400 MT/s data rate) with CAS latency 3. Operation beyond this frequency violates the device's AC timing specifications and may result in data corruption or command decode failure.

Does W9412G6KH-5 require an external DLL calibration sequence during initialization?

Yes, W9412G6KH-5 requires explicit DLL enablement via Extended Mode Register Set (EMRS) and subsequent DLL reset via Mode Register Set (MRS) with A8 = high, followed by ≥200 stable clock cycles before issuing executable commands. This sequence ensures DQS-to-clock alignment for reliable read capture at DDR-400 speeds.

Can W9412G6KH-5 operate in self-refresh mode without external clock input?

Yes, W9412G6KH-5 enters self-refresh mode when CKE is held low after issuing the Self Refresh Entry command. In this state, the internal refresh counter operates autonomously using an on-die oscillator, and no external CLK/CLK̅ signal is required-only VDD, VDDQ, and VREF must remain powered.

What is the function of the A10 pin during precharge commands on W9412G6KH-5?

On W9412G6KH-5, A10 acts as the Auto-Precharge bit during precharge commands: when A10 = low, only the bank selected by BA0/BA1 is precharged; when A10 = high, Precharge All is executed across all four banks. This enables flexible bank management without requiring separate command encoding.

Is W9412G6KH-5 compatible with standard DDR-400 memory controllers?

Yes, W9412G6KH-5 complies fully with JEDEC Standard No. 21-C for DDR SDRAM, including command encoding, timing parameters (tRCD, tRP, tRAS), SSTL_2 interface levels, and DLL behavior. It interoperates with industry-standard DDR-400 controllers such as those in Intel 915/945 chipsets and Freescale MPC85xx processors.

W9412G6KH-5 Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
66-TSSOP (0.400", 10.16mm Width)
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM - DDR
Memory Size:
128Mbit
Memory Organization:
8M x 16
Memory Interface:
SSTL_2
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
15ns
Access Time:
50 ns
Voltage - Supply:
2.3V ~ 2.7V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
66-TSOP II

W9412G6KH-5 FAQ

1.How can I place an order for W9412G6KH-5 through Aetrix?

Please submit a Request for Quotation (RFQ) for W9412G6KH-5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9412G6KH-5 reliable?

The price and inventory of W9412G6KH-5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9412G6KH-5 is usually 5 days.

3.What payment methods are accepted for W9412G6KH-5?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9412G6KH-5 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9412G6KH-5?

W9412G6KH-5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9412G6KH-5 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9412G6KH-5?

For technical support, including W9412G6KH-5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9412G6KH-5 requirements.

6.How does Aetrix verify that W9412G6KH-5 is sourced from the original manufacturer or authorized distributors?

All W9412G6KH-5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9412G6KH-5 meets industry standards.

7.What is the process for return or replacement of W9412G6KH-5?

All W9412G6KH-5 units undergo pre-shipment inspection (PSI). If there is an issue with W9412G6KH-5, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9412G6KH-5 part is unused and in its original packaging.

Return procedure for W9412G6KH-5:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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