Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Winbond Electronics Corporation W9425G6JB-5I

Part No.:
W9425G6JB-5I
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
60-TFBGA
Datasheet:
AetrixW9425G6JB-5I.pdf
Description:
IC DRAM 256MBIT PAR 60TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,544

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

W9425G6JB-5I from Winbond is a 64 Mbit (4 M × 4 banks × 16 bits) DDR SDRAM operating at 200 MHz clock frequency with 2.5 V ±0.2 V supply, CAS latency options of 2/2.5/3, and SSTL_2 interface - designed for main memory in industrial embedded systems requiring extended temperature operation from –40°C to +85°C.

For engineers reviewing the W9425G6JB-5I datasheet, W9425G6JB-5I pinout, W9425G6JB-5I application, or W9425G6JB-5I equivalent, this page delivers verified timing parameters, ball-level I/O mapping, DDR400/CL3 compliance, power-down modes, and validated drop-in alternatives for industrial-grade memory design.

Technical Context

This DDR SDRAM implements double-data-rate architecture synchronized to both edges of DQS, with differential CLK/CLK inputs and edge-aligned read data / center-aligned write data. It supports programmable burst lengths (2/4/8), bank-interleaved reads, and auto-precharge for efficient memory access scheduling.

Its internal architecture includes four independent banks, DLL-based clock alignment, mode register (MRS) and extended mode register (EMRS) for configuration, and dual power domains (VDD/VSS and VDDQ/VSSQ) to isolate core logic from I/O noise - enabling stable operation under thermal stress and signal integrity constraints.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density64 Mbit (4,194,304 words × 4 banks × 16 bits)
Data RateDDR400 (400 MT/s), supported by 200 MHz clock with tCK min = 5 ns at CL=3
CAS LatencyProgrammable CL = 2, 2.5, or 3 - determines minimum clock cycles between READ command and first valid data
Supply Voltage2.5 V ±0.2 V - requires tight regulation; VDDQ separated from VDD for I/O noise immunity
Refresh Interval7.8 µs (8K rows / 64 ms) - mandates precise refresh scheduling to prevent data loss
Operating Temperature–40°C to +85°C - qualified for industrial environments without derating
Power-Down CurrentIDD6 = 2 mA max in Self Refresh - enables low-power retention during system sleep

Pinout & Package

W9425G6JB-5I is housed in a 60-ball TFBGA package (8 mm × 13 mm, 0.8 mm pitch), RoHS-compliant and lead-free. Ball assignment follows JEDEC-standard DDR SDRAM layout with dedicated VDDQ/VSSQ planes for I/O noise isolation.

Pin/TerminalCircuit RoleDesign Meaning
A0–A12Address InputMultiplexed row/column address; A10 controls per-bank vs. all-bank precharge
BA0, BA1Bank SelectSelects one of four banks during activate/read/write commands
DQ0–DQ15Data I/O16-bit bidirectional data bus synchronized to both edges of DQS
LDQS, UDQSData StrobeLower/upper byte strobes; edge-aligned on read, center-aligned on write
LDM, UDMData MaskByte-level write masking: LDM for DQ0–DQ7, UDM for DQ8–DQ15
CLK, CLKDifferential ClockTiming reference for all commands; sampling occurs at CLK/CLK crossing
CKEClock EnableControls entry/exit from Power Down, Self Refresh, and Suspend modes
CS, RAS, CAS, WECommand InputsDecode active-high command set (e.g., Bank Activate, Read, Write, Precharge)
VREFInput ReferenceStabilized 1.25 V reference for SSTL_2 input threshold calibration

Key Features

FeatureDesign Value
Programmable Burst LengthSupports BL=2/4/8 via Mode Register - optimizes bandwidth utilization for sequential vs. random access patterns
Dual Power DomainsVDD/VSS for core logic + VDDQ/VSSQ for I/O buffers - reduces switching noise coupling into memory array
Auto & Self RefreshAuto Refresh (tREFI = 7.8 µs) and Self Refresh (IDD6 ≤ 2 mA) - ensures data retention during CPU idle or full system suspend
Write Latency = 1Fixed one-cycle delay between write command and first DQS-strobed data capture - simplifies timing closure in controller design
Precharged/Active Power DownReduces IDD1 current by >50% during idle periods while preserving bank state - improves dynamic power efficiency

Applications

Industrial HMI ControllerMedical Imaging Front-End

Use Scenario: Real-time display buffering and GUI rendering in panel-mounted HMIs exposed to wide ambient temperature swings.

IC Role / Device Role / Timing Role: Main system memory interfaced to ARM Cortex-A series SoC with DDR controller, handling frame buffer and OS runtime data.

Use Value: Extended –40°C to +85°C rating ensures reliable boot and operation without thermal throttling or data corruption in uncontrolled environments.

Use Scenario: High-speed acquisition buffer in portable ultrasound or X-ray preprocessing units where compact size and low standby power are critical.

IC Role / Device Role / Timing Role: Temporary storage for digitized sensor data prior to FPGA-based FFT or compression, synchronized to precise clock domains.

Use Value: Self Refresh current ≤2 mA enables >72-hour battery-backed data retention during transport or standby without external refresh circuitry.

Automotive ADAS Camera ModuleRuggedized Network Appliance

Use Scenario: Frame buffering in 1080p automotive camera modules operating inside vehicle cabins with high thermal cycling.

IC Role / Device Role / Timing Role: Dual-port memory resource shared between image sensor interface and video encoder ASIC, accessed via burst-optimized DDR protocol.

Use Value: DDR400/CL3 compliance guarantees deterministic read latency ≤15 ns (CL=3 @ 200 MHz), meeting real-time vision pipeline deadlines.

Use Scenario: Packet buffering in fanless industrial firewalls or SD-WAN edge routers deployed in factory-floor enclosures.

IC Role / Device Role / Timing Role: Shared memory for packet classification engines and traffic shaping logic, requiring sustained 400 MT/s throughput under continuous load.

Use Value: 60-ball TFBGA footprint minimizes PCB area while supporting full DDR400 bandwidth - critical for space-constrained DIN-rail designs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR SDRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MT46V32M16-5B:JSame density (64 Mbit), 2.5 V, CL=2.5/3, but rated only for 0°C to +70°C; uses 60-ball TFBGA with identical pinoutLacks industrial temperature qualification; unsuitable for deployments below 0°C or above 70°CSelect when cost sensitivity outweighs extended temp requirement and ambient stays within commercial range
IS42S16160F-6BLISame density, voltage, and -40°C to +85°C rating; supports CL=2/2.5/3 but has tCK min = 6 ns (DDR333), lower max speed than W9425G6JB-5ILower bandwidth ceiling limits use in high-throughput imaging or video pipelinesChoose when system clock is ≤166 MHz and legacy DDR333 compatibility is required

Compared with MT46V32M16-5B:J and IS42S16160F-6BLI, W9425G6JB-5I uniquely combines DDR400 speed, industrial temperature range, and Winbond's proven reliability in long-lifecycle embedded deployments - making it the optimal choice where both performance and environmental robustness are non-negotiable.

Availability

W9425G6JB-5I is available at Aetrix Electronics and suitable for industrial HMI controllers, medical imaging front-ends, automotive ADAS camera modules, ruggedized network appliances, and other applications requiring stable component supply across extended temperature ranges and multi-year production cycles.

Supply support for W9425G6JB-5I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including NOR/NAND Flash, SRAM, and DRAM products for industrial, automotive, and computing markets.

The W9425G6JB-5I belongs to Winbond's industrial-grade DDR SDRAM product line, engineered specifically for applications demanding guaranteed operation from –40°C to +85°C, low-power self-refresh, and JEDEC-compliant DDR400 timing - targeting embedded systems with long service life and zero tolerance for memory failure.

FAQ

What is the maximum clock frequency supported by W9425G6JB-5I?

W9425G6JB-5I supports a maximum clock frequency of 200 MHz, corresponding to DDR400 data rate (400 MT/s). This is confirmed by its tCK minimum of 5 ns at CAS Latency = 3, and the device is fully compliant with the DDR400/CL3 specification per its ordering information and AC timing table.

Does W9425G6JB-5I support both Auto Refresh and Self Refresh modes?

Yes, W9425G6JB-5I supports both Auto Refresh and Self Refresh. Auto Refresh requires periodic commands every 7.8 µs (8K/64 ms), while Self Refresh operates autonomously with CKE low and draws ≤2 mA (IDD6), retaining data without external clocking - essential for low-power system suspend states.

What is the function of the VREF pin on W9425G6JB-5I?

The VREF pin on W9425G6JB-5I provides a stable 1.25 V reference voltage for SSTL_2 input receivers. It must be maintained during all operational modes - including Self Refresh - to ensure correct logic-level interpretation of address, command, and control signals.

How many banks does W9425G6JB-5I have, and how are they selected?

W9425G6JB-5I has four independent memory banks. Bank selection is performed using the BA0 and BA1 inputs during command assertion - e.g., Bank Activate, Read, or Write - allowing interleaved access to improve effective bandwidth and hide row activation latency.

Is W9425G6JB-5I pin-compatible with standard 60-ball DDR SDRAM packages?

Yes, W9425G6JB-5I uses a JEDEC-standard 60-ball TFBGA package (8 mm × 13 mm, 0.8 mm pitch) with SSTL_2-compatible ball assignments. Its pinout matches industry-standard DDR SDRAM layouts, including dedicated VDDQ/VSSQ planes and differential CLK/CLK - enabling direct PCB footprint reuse in DDR400 designs.

W9425G6JB-5I Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
60-TFBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM - DDR
Memory Size:
256Mbit
Memory Organization:
16M x 16
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
15ns
Access Time:
55 ns
Voltage - Supply:
2.3V ~ 2.7V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
60-TFBGA (8x13)

W9425G6JB-5I FAQ

1.How can I place an order for W9425G6JB-5I through Aetrix?

Please submit a Request for Quotation (RFQ) for W9425G6JB-5I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9425G6JB-5I reliable?

The price and inventory of W9425G6JB-5I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9425G6JB-5I is usually 5 days.

3.What payment methods are accepted for W9425G6JB-5I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9425G6JB-5I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9425G6JB-5I?

W9425G6JB-5I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9425G6JB-5I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9425G6JB-5I?

For technical support, including W9425G6JB-5I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9425G6JB-5I requirements.

6.How does Aetrix verify that W9425G6JB-5I is sourced from the original manufacturer or authorized distributors?

All W9425G6JB-5I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9425G6JB-5I meets industry standards.

7.What is the process for return or replacement of W9425G6JB-5I?

All W9425G6JB-5I units undergo pre-shipment inspection (PSI). If there is an issue with W9425G6JB-5I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9425G6JB-5I part is unused and in its original packaging.

Return procedure for W9425G6JB-5I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

W9425G6JB-5I Tags

  • W9425G6JB-5I
  • W9425G6JB-5I PDF
  • W9425G6JB-5I Datasheet
  • W9425G6JB-5I Specifications
  • W9425G6JB-5I Images
  • Winbond Electronics Corporation
  • Winbond Electronics Corporation W9425G6JB-5I
  • Buy W9425G6JB-5I
  • W9425G6JB-5I Price
  • W9425G6JB-5I Distributor
  • W9425G6JB-5I Supplier
  • W9425G6JB-5I Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER