Winbond Electronics Corporation W9425G6JB-5I
- Part No.:
- W9425G6JB-5I
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 60-TFBGA
- Datasheet:
-
W9425G6JB-5I.pdf
- Description:
- IC DRAM 256MBIT PAR 60TFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,544
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Product details
Overview
W9425G6JB-5I from Winbond is a 64 Mbit (4 M × 4 banks × 16 bits) DDR SDRAM operating at 200 MHz clock frequency with 2.5 V ±0.2 V supply, CAS latency options of 2/2.5/3, and SSTL_2 interface - designed for main memory in industrial embedded systems requiring extended temperature operation from –40°C to +85°C.
For engineers reviewing the W9425G6JB-5I datasheet, W9425G6JB-5I pinout, W9425G6JB-5I application, or W9425G6JB-5I equivalent, this page delivers verified timing parameters, ball-level I/O mapping, DDR400/CL3 compliance, power-down modes, and validated drop-in alternatives for industrial-grade memory design.
Technical Context
This DDR SDRAM implements double-data-rate architecture synchronized to both edges of DQS, with differential CLK/CLK inputs and edge-aligned read data / center-aligned write data. It supports programmable burst lengths (2/4/8), bank-interleaved reads, and auto-precharge for efficient memory access scheduling.
Its internal architecture includes four independent banks, DLL-based clock alignment, mode register (MRS) and extended mode register (EMRS) for configuration, and dual power domains (VDD/VSS and VDDQ/VSSQ) to isolate core logic from I/O noise - enabling stable operation under thermal stress and signal integrity constraints.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 Mbit (4,194,304 words × 4 banks × 16 bits) |
| Data Rate | DDR400 (400 MT/s), supported by 200 MHz clock with tCK min = 5 ns at CL=3 |
| CAS Latency | Programmable CL = 2, 2.5, or 3 - determines minimum clock cycles between READ command and first valid data |
| Supply Voltage | 2.5 V ±0.2 V - requires tight regulation; VDDQ separated from VDD for I/O noise immunity |
| Refresh Interval | 7.8 µs (8K rows / 64 ms) - mandates precise refresh scheduling to prevent data loss |
| Operating Temperature | –40°C to +85°C - qualified for industrial environments without derating |
| Power-Down Current | IDD6 = 2 mA max in Self Refresh - enables low-power retention during system sleep |
Pinout & Package
W9425G6JB-5I is housed in a 60-ball TFBGA package (8 mm × 13 mm, 0.8 mm pitch), RoHS-compliant and lead-free. Ball assignment follows JEDEC-standard DDR SDRAM layout with dedicated VDDQ/VSSQ planes for I/O noise isolation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A12 | Address Input | Multiplexed row/column address; A10 controls per-bank vs. all-bank precharge |
| BA0, BA1 | Bank Select | Selects one of four banks during activate/read/write commands |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus synchronized to both edges of DQS |
| LDQS, UDQS | Data Strobe | Lower/upper byte strobes; edge-aligned on read, center-aligned on write |
| LDM, UDM | Data Mask | Byte-level write masking: LDM for DQ0–DQ7, UDM for DQ8–DQ15 |
| CLK, CLK | Differential Clock | Timing reference for all commands; sampling occurs at CLK/CLK crossing |
| CKE | Clock Enable | Controls entry/exit from Power Down, Self Refresh, and Suspend modes |
| CS, RAS, CAS, WE | Command Inputs | Decode active-high command set (e.g., Bank Activate, Read, Write, Precharge) |
| VREF | Input Reference | Stabilized 1.25 V reference for SSTL_2 input threshold calibration |
Key Features
| Feature | Design Value |
|---|---|
| Programmable Burst Length | Supports BL=2/4/8 via Mode Register - optimizes bandwidth utilization for sequential vs. random access patterns |
| Dual Power Domains | VDD/VSS for core logic + VDDQ/VSSQ for I/O buffers - reduces switching noise coupling into memory array |
| Auto & Self Refresh | Auto Refresh (tREFI = 7.8 µs) and Self Refresh (IDD6 ≤ 2 mA) - ensures data retention during CPU idle or full system suspend |
| Write Latency = 1 | Fixed one-cycle delay between write command and first DQS-strobed data capture - simplifies timing closure in controller design |
| Precharged/Active Power Down | Reduces IDD1 current by >50% during idle periods while preserving bank state - improves dynamic power efficiency |
Applications
| Industrial HMI Controller | Medical Imaging Front-End |
|---|---|
Use Scenario: Real-time display buffering and GUI rendering in panel-mounted HMIs exposed to wide ambient temperature swings. IC Role / Device Role / Timing Role: Main system memory interfaced to ARM Cortex-A series SoC with DDR controller, handling frame buffer and OS runtime data. Use Value: Extended –40°C to +85°C rating ensures reliable boot and operation without thermal throttling or data corruption in uncontrolled environments. | Use Scenario: High-speed acquisition buffer in portable ultrasound or X-ray preprocessing units where compact size and low standby power are critical. IC Role / Device Role / Timing Role: Temporary storage for digitized sensor data prior to FPGA-based FFT or compression, synchronized to precise clock domains. Use Value: Self Refresh current ≤2 mA enables >72-hour battery-backed data retention during transport or standby without external refresh circuitry. |
| Automotive ADAS Camera Module | Ruggedized Network Appliance |
Use Scenario: Frame buffering in 1080p automotive camera modules operating inside vehicle cabins with high thermal cycling. IC Role / Device Role / Timing Role: Dual-port memory resource shared between image sensor interface and video encoder ASIC, accessed via burst-optimized DDR protocol. Use Value: DDR400/CL3 compliance guarantees deterministic read latency ≤15 ns (CL=3 @ 200 MHz), meeting real-time vision pipeline deadlines. | Use Scenario: Packet buffering in fanless industrial firewalls or SD-WAN edge routers deployed in factory-floor enclosures. IC Role / Device Role / Timing Role: Shared memory for packet classification engines and traffic shaping logic, requiring sustained 400 MT/s throughput under continuous load. Use Value: 60-ball TFBGA footprint minimizes PCB area while supporting full DDR400 bandwidth - critical for space-constrained DIN-rail designs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT46V32M16-5B:J | Same density (64 Mbit), 2.5 V, CL=2.5/3, but rated only for 0°C to +70°C; uses 60-ball TFBGA with identical pinout | Lacks industrial temperature qualification; unsuitable for deployments below 0°C or above 70°C | Select when cost sensitivity outweighs extended temp requirement and ambient stays within commercial range |
| IS42S16160F-6BLI | Same density, voltage, and -40°C to +85°C rating; supports CL=2/2.5/3 but has tCK min = 6 ns (DDR333), lower max speed than W9425G6JB-5I | Lower bandwidth ceiling limits use in high-throughput imaging or video pipelines | Choose when system clock is ≤166 MHz and legacy DDR333 compatibility is required |
Compared with MT46V32M16-5B:J and IS42S16160F-6BLI, W9425G6JB-5I uniquely combines DDR400 speed, industrial temperature range, and Winbond's proven reliability in long-lifecycle embedded deployments - making it the optimal choice where both performance and environmental robustness are non-negotiable.
Availability
W9425G6JB-5I is available at Aetrix Electronics and suitable for industrial HMI controllers, medical imaging front-ends, automotive ADAS camera modules, ruggedized network appliances, and other applications requiring stable component supply across extended temperature ranges and multi-year production cycles.
Supply support for W9425G6JB-5I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including NOR/NAND Flash, SRAM, and DRAM products for industrial, automotive, and computing markets.
The W9425G6JB-5I belongs to Winbond's industrial-grade DDR SDRAM product line, engineered specifically for applications demanding guaranteed operation from –40°C to +85°C, low-power self-refresh, and JEDEC-compliant DDR400 timing - targeting embedded systems with long service life and zero tolerance for memory failure.
FAQ
What is the maximum clock frequency supported by W9425G6JB-5I?
W9425G6JB-5I supports a maximum clock frequency of 200 MHz, corresponding to DDR400 data rate (400 MT/s). This is confirmed by its tCK minimum of 5 ns at CAS Latency = 3, and the device is fully compliant with the DDR400/CL3 specification per its ordering information and AC timing table.
Does W9425G6JB-5I support both Auto Refresh and Self Refresh modes?
Yes, W9425G6JB-5I supports both Auto Refresh and Self Refresh. Auto Refresh requires periodic commands every 7.8 µs (8K/64 ms), while Self Refresh operates autonomously with CKE low and draws ≤2 mA (IDD6), retaining data without external clocking - essential for low-power system suspend states.
What is the function of the VREF pin on W9425G6JB-5I?
The VREF pin on W9425G6JB-5I provides a stable 1.25 V reference voltage for SSTL_2 input receivers. It must be maintained during all operational modes - including Self Refresh - to ensure correct logic-level interpretation of address, command, and control signals.
How many banks does W9425G6JB-5I have, and how are they selected?
W9425G6JB-5I has four independent memory banks. Bank selection is performed using the BA0 and BA1 inputs during command assertion - e.g., Bank Activate, Read, or Write - allowing interleaved access to improve effective bandwidth and hide row activation latency.
Is W9425G6JB-5I pin-compatible with standard 60-ball DDR SDRAM packages?
Yes, W9425G6JB-5I uses a JEDEC-standard 60-ball TFBGA package (8 mm × 13 mm, 0.8 mm pitch) with SSTL_2-compatible ball assignments. Its pinout matches industry-standard DDR SDRAM layouts, including dedicated VDDQ/VSSQ planes and differential CLK/CLK - enabling direct PCB footprint reuse in DDR400 designs.
W9425G6JB-5I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 60-TFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - DDR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 55 ns
- Voltage - Supply:
- 2.3V ~ 2.7V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 60-TFBGA (8x13)
W9425G6JB-5I FAQ
1.How can I place an order for W9425G6JB-5I through Aetrix?
Please submit a Request for Quotation (RFQ) for W9425G6JB-5I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W9425G6JB-5I reliable?
The price and inventory of W9425G6JB-5I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9425G6JB-5I is usually 5 days.
3.What payment methods are accepted for W9425G6JB-5I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9425G6JB-5I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W9425G6JB-5I?
W9425G6JB-5I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W9425G6JB-5I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W9425G6JB-5I?
For technical support, including W9425G6JB-5I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9425G6JB-5I requirements.
6.How does Aetrix verify that W9425G6JB-5I is sourced from the original manufacturer or authorized distributors?
All W9425G6JB-5I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9425G6JB-5I meets industry standards.
7.What is the process for return or replacement of W9425G6JB-5I?
All W9425G6JB-5I units undergo pre-shipment inspection (PSI). If there is an issue with W9425G6JB-5I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W9425G6JB-5I part is unused and in its original packaging.
Return procedure for W9425G6JB-5I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W9425G6JB-5I Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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24LC01BT-I/OT
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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