Winbond Electronics Corporation W9425G6JB-5 TR
- Part No.:
- W9425G6JB-5 TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 60-TFBGA
- Datasheet:
-
W9425G6JB-5 TR.pdf
- Description:
- IC DRAM 256MBIT PAR 60TFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
W9425G6JB-5 TR from Winbond is a 64 Mbit (4 M × 4 banks × 16 bits) DDR SDRAM operating at 200 MHz with 2.5 V ±0.2 V supply, CAS latency options of 2/2.5/3, and SSTL_2 interface compliance. It delivers up to 400 M words/s bandwidth and supports auto-refresh (7.8 µs interval), self-refresh (2 mA max), and power-down modes for embedded memory subsystems in industrial controllers and legacy PC platforms.
For engineers reviewing the W9425G6JB-5 TR datasheet, W9425G6JB-5 TR pinout, W9425G6JB-5 TR application, or W9425G6JB-5 TR equivalent, this page provides verified DDR400/CL3 timing parameters, 60-ball TFBGA package mapping, bank-activate/read/write command behavior, burst-length programmability (2/4/8), and differential clock (CLK/CLK̄) synchronization requirements critical for memory controller interface design and signal integrity validation.
Technical Context
This DDR SDRAM implements double-data-rate architecture with edge-aligned DQS on read and center-aligned DQS on write, supporting interleaved 2-bank and 4-bank read operations. Its mode register controls burst length, addressing mode (sequential/interleave), and DLL reset, while extended mode register enables DLL activation and output driver strength selection.
It requires strict power-up initialization: stable 200 µs delay post-power, 200+ clock cycles for DLL lock after EMRS, precharge-all before MRS, and two auto-refresh commands before operational use. Command decoding depends on CS, RAS̄, CAS̄, and WĒ levels, with A10 determining single-bank vs. all-bank precharge and BA0/BA1 selecting active bank.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 Mbit (4,194,304 words × 4 banks × 16 bits) |
| Data Rate | DDR400 (200 MHz clock, 400 MT/s effective) |
| CAS Latency | Programmable CL = 2, 2.5, or 3 - determines minimum tRCD and read access timing |
| Burst Length | Configurable 2, 4, or 8 - defines number of data transfers per read/write command |
| Refresh Interval | 7.8 µs (8K rows / 64 ms) - dictates maximum time between auto-refresh commands |
| Supply Voltage | 2.5 V ±0.2 V - requires tight regulation; separate VDDQ/VSSQ for I/O noise isolation |
| Package | 60-ball TFBGA (8 mm × 13 mm, 0.8 mm pitch) - RoHS-compliant, lead-free |
| Operating Temp | 0°C to +70°C - validated for commercial-grade industrial applications |
Pinout & Package
W9425G6JB-5 TR uses a 60-ball thin fine-pitch BGA (TFBGA) package with 0.8 mm ball pitch, 8 mm × 13 mm footprint, and RoHS-compliant lead-free construction. Power and ground are segregated: VDD/VSS for core logic, VDDQ/VSSQ for I/O buffers, and VREF for input threshold reference.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A12 | Address Input | Multiplexed row/column address; A10 selects single-bank (low) or all-bank (high) precharge |
| BA0, BA1 | Bank Select | Selects one of four banks during activate, read, or write; used in MRS/EMRS op-code encoding |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus synchronized to both edges of DQS; supports write masking via DM |
| LDQS, UDQS | Data Strobe | Lower/upper byte DQS; edge-aligned on read, center-aligned on write; bi-directional timing reference |
| CLK, CLK̄ | Differential Clock | Timing reference for all control/address inputs; sampling occurs at crossing point of CLK rising and CLK̄ falling |
| CKE | Clock Enable | Active-high; gates internal clock; low entry triggers power-down or self-refresh mode |
| CS̄, RAS̄, CAS̄, WĒ | Command Inputs | Active-low control signals decoded with BA0/BA1/A10 to execute bank activate, precharge, read, write, refresh, etc. |
| LDM, UDM | Write Mask | Byte-level write enable: LDM masks DQ0–DQ7, UDM masks DQ8–DQ15 during burst write |
| VREF | Input Reference | 2.5 V reference for SSTL_2 input thresholds; must remain stable during self-refresh |
Key Features
| Feature | Design Value |
|---|---|
| Double Data Rate Architecture | Two data transfers per clock cycle (rising/falling CLK edges) doubles throughput without increasing clock frequency |
| Programmable Mode Register | Enables runtime configuration of burst length, CAS latency, and addressing mode to match controller requirements |
| Differential Clock Interface | CLK/CLK̄ inputs improve jitter tolerance and timing margin versus single-ended clocks in high-speed memory buses |
| Auto & Self Refresh | Auto-refresh (tREFI = 7.8 µs) maintains data during active operation; self-refresh (2 mA max) preserves data with CKE low and no clock |
| Power-Down Modes | Precharged and active power-down reduce IDD1/IDD4 current by >50% during idle periods without losing bank state |
| Write Data Masking | LDM/UDM pins allow selective byte disabling during burst writes - essential for partial-word updates without read-modify-write |
Applications
| Industrial HMI Panels | Legacy PC Memory Modules |
|---|---|
|
Use Scenario: Touch-enabled operator interface with real-time graphics rendering and local data logging. IC Role / Device Role / Timing Role: Main system memory interfaced to ARM9 or MIPS-based SoC with DDR controller supporting CL2/3 and burst lengths 4–8. Use Value: 64 Mbit density and 400 MT/s bandwidth support dual-framebuffer display buffering and firmware update caching within thermal limits of fanless enclosures. |
Use Scenario: Cost-sensitive desktop motherboard using DDR400-compatible memory subsystem. IC Role / Device Role / Timing Role: Component-level DDR SDRAM in unbuffered DIMM or SO-DIMM modules meeting JEDEC PC3200 specification. Use Value: CL3 timing compliance and SSTL_2 interface ensure plug-and-play compatibility with Intel 865/875P and AMD 760MP chipsets without signal integrity redesign. |
| Network Edge Routers | Medical Diagnostic Terminals |
|
Use Scenario: Packet buffering and forwarding table storage in Layer 2/L3 switching ASICs. IC Role / Device Role / Timing Role: External packet buffer memory accessed via dedicated DDR interface with burst-8 reads/writes and auto-precharge. Use Value: 4-bank architecture enables concurrent bank activation for overlapping packet ingress/egress operations, improving throughput under bursty traffic loads. |
Use Scenario: Ultrasound imaging console requiring deterministic memory access for real-time beamforming data. IC Role / Device Role / Timing Role: Frame buffer and processing scratchpad memory for FPGA-based digital signal processors with precise tRCD/tRP timing control. Use Value: Guaranteed 0°C to +70°C operation and stable 7.8 µs refresh interval ensure data retention and timing predictability across clinical environmental variations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT46V32M16-5B:J | Same density (64 Mbit), 2.5 V, DDR400, but rated for -40°C to +85°C and uses 66-ball TSOP-II package | Higher temperature grade and different package require PCB layout change; identical timing and command set | Select when extended temperature range or TSOP-II mounting is required; not drop-in compatible due to package mismatch |
| IS42S16400F-5BL | 64 Mbit DDR SDRAM with same 60-ball TFBGA footprint, but supports CL2.5/3 only (no CL2) and higher IDD6 (3 mA vs. 2 mA) | Matches W9425G6JB-5 TR's package and pinout; differs in self-refresh current and minimum latency option | Valid pin-compatible alternative if CL2 operation is not required and 1 mA higher self-refresh current is acceptable |
Compared with MT46V32M16-5B:J and IS42S16400F-5BL, W9425G6JB-5 TR offers the lowest self-refresh current (2 mA) and CL2 support in its commercial temperature grade, making it optimal for thermally constrained, latency-sensitive designs where full industrial temp range is unnecessary.
Availability
W9425G6JB-5 TR is available at Aetrix Electronics and suitable for industrial HMI panels, legacy PC memory modules, network edge routers, and medical diagnostic terminals requiring stable component supply, long-lifecycle support, and guaranteed DDR400/CL3 timing compliance.
Supply support for W9425G6JB-5 TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including NOR/NAND Flash, SRAM, and DRAM products for industrial, automotive, and computing markets.
W9425G6JB-5 TR belongs to Winbond's DDR SDRAM product line designed for cost-effective, high-reliability main memory in legacy and embedded systems requiring JEDEC-compliant DDR400 operation with minimal power overhead.
FAQ
What is the maximum clock frequency supported by W9425G6JB-5 TR?
W9425G6JB-5 TR supports a maximum clock frequency of 200 MHz, corresponding to DDR400 data rate (400 MT/s). This is confirmed by its -5 speed grade designation and tCK minimum of 5 ns at CL=3. The device meets JEDEC DDR400/CL3 specifications and requires stable differential clock inputs (CLK/CLK̄) referenced to their crossing point.
Does W9425G6JB-5 TR support CAS latency of 2?
Yes, W9425G6JB-5 TR supports programmable CAS latency of 2, 2.5, and 3 via its mode register. CL2 operation is explicitly listed in the features section and validated in timing tables (e.g., tCK min = 7.5 ns at CL=2). This enables lower read access latency in systems where controller timing margins allow.
What package type and dimensions does W9425G6JB-5 TR use?
W9425G6JB-5 TR uses a 60-ball thin fine-pitch BGA (TFBGA) package measuring 8 mm × 13 mm with 0.8 mm ball pitch. It is lead-free and RoHS compliant. Ball configuration and pin functions are fully documented in sections 5 and 6 of the datasheet, including dedicated VDDQ/VSSQ planes for I/O noise isolation.
How does W9425G6JB-5 TR handle refresh operations?
W9425G6JB-5 TR supports both auto-refresh and self-refresh. Auto-refresh requires periodic commands every 7.8 µs average interval (8K rows / 64 ms), with up to eight pending commands allowed. Self-refresh enters upon CKE low and maintains data with only 2 mA typical current, requiring VREF stability but no external clock.
Is W9425G6JB-5 TR pin-compatible with other 60-ball DDR SDRAMs?
W9425G6JB-5 TR follows standard DDR SDRAM ballout conventions (e.g., A0–A12, BA0/BA1, DQ0–DQ15, LDQS/UDQS, CLK/CLK̄), but pin compatibility must be verified per manufacturer. IS42S16400F-5BL shares identical 60-ball TFBGA mapping and function assignment, enabling direct PCB reuse; MT46V32M16-5B:J uses a different 66-ball TSOP-II package and is not pin-compatible.
W9425G6JB-5 TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 60-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - DDR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 55 ns
- Voltage - Supply:
- 2.3V ~ 2.7V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 60-TFBGA (8x13)
W9425G6JB-5 TR FAQ
1.How can I place an order for W9425G6JB-5 TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W9425G6JB-5 TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W9425G6JB-5 TR reliable?
The price and inventory of W9425G6JB-5 TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9425G6JB-5 TR is usually 5 days.
3.What payment methods are accepted for W9425G6JB-5 TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9425G6JB-5 TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W9425G6JB-5 TR?
W9425G6JB-5 TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W9425G6JB-5 TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W9425G6JB-5 TR?
For technical support, including W9425G6JB-5 TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9425G6JB-5 TR requirements.
6.How does Aetrix verify that W9425G6JB-5 TR is sourced from the original manufacturer or authorized distributors?
All W9425G6JB-5 TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9425G6JB-5 TR meets industry standards.
7.What is the process for return or replacement of W9425G6JB-5 TR?
All W9425G6JB-5 TR units undergo pre-shipment inspection (PSI). If there is an issue with W9425G6JB-5 TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W9425G6JB-5 TR part is unused and in its original packaging.
Return procedure for W9425G6JB-5 TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W9425G6JB-5 TR Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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