Winbond Electronics Corporation W9425G6KH-5I
- Part No.:
- W9425G6KH-5I
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 66-TSSOP (0.400", 10.16mm Width)
- Datasheet:
-
W9425G6KH-5I.pdf
- Description:
- IC DRAM 256MBIT PAR 66TSOP II
- Quantity:
- Payment:

- Shipping:

Inventory:2,655
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Product details
Overview
W9425G6KH-5I from Winbond is a 64 Mbit (4 M × 4 banks × 16 bits) DDR SDRAM operating at 200 MHz with 2.5 V ±0.2 V supply, CAS latency options of 2/2.5/3, and industrial temperature range (–40°C to +85°C). It delivers up to 400 million words per second bandwidth and supports auto-refresh, self-refresh, and power-down modes for embedded main memory applications.
For engineers reviewing the W9425G6KH-5I datasheet, W9425G6KH-5I pinout, W9425G6KH-5I application, or W9425G6KH-5I equivalent, key selection considerations include its TSOP II-66 package, SSTL_2 interface compliance, differential clock (CLK/CLK#) timing, DQS edge/center alignment behavior, and industrial-grade thermal reliability across DDR400/CL3 operation.
Technical Context
This DDR SDRAM implements a double-data-rate architecture synchronized to both edges of DQS, with programmable burst lengths (2/4/8) and addressing modes (sequential/interleave) via mode registers. Its DLL-based timing control enables precise data capture during read operations and center-aligned write strobing.
The device features bank-select architecture with four independent 16-bit-wide banks, supporting concurrent activation and interleaved access. Command decoding relies on CS, RAS, CAS, and WE inputs referenced to the crossing point of CLK and CLK#, while CKE governs entry/exit from power-down and self-refresh states.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 Mbit (4,194,304 words × 4 banks × 16 bits) |
| Data Rate | DDR400 - 400 MT/s effective bandwidth |
| Clock Frequency | 200 MHz maximum; tCK min = 5 ns (CL=3) |
| CAS Latency | Programmable CL2 / CL2.5 / CL3 - determines read access delay in clock cycles |
| Supply Voltage | 2.5 V ±0.2 V - requires stable low-noise rail with separate VDDQ/VSSQ for I/O noise isolation |
| Operating Temperature | –40°C to +85°C - qualified for industrial environments without derating |
| Refresh Interval | 7.8 µs average (8K refresh cycles per 64 ms) - ensures data retention during active use |
| Package | TSOP II-66 - surface-mount, lead-free, RoHS-compliant footprint compatible with standard DDR layout rules |
Pinout & Package
W9425G6KH-5I is housed in a 66-pin Thin Small Outline Package (TSOP II), with dedicated VDD/VSS for core logic and isolated VDDQ/VSSQ for I/O buffers to minimize switching noise. Pin functions follow JEDEC-standard DDR SDRAM assignment.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A12 | Address Input | Multiplexed row/column address lines; A10 controls single/all bank precharge |
| BA0, BA1 | Bank Select | Selects one of four internal banks for activate/read/write commands |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus synchronized to both edges of DQS |
| LDQS, UDQS | Data Strobe | Lower/upper byte DQS; edge-aligned on read, center-aligned on write |
| LDM, UDM | Data Mask | Byte-level write masking: LDM for DQ0–DQ7, UDM for DQ8–DQ15 |
| CLK, CLK# | Differential Clock | Timing reference for all command/address sampling at crossing point |
| CKE | Clock Enable | Controls entry/exit from power-down and self-refresh modes |
| CS, RAS, CAS, WE | Command Inputs | Decode bank activate, precharge, read, write, refresh, and mode register commands |
| VREF | Input Reference | Reference voltage for SSTL_2 input threshold; must be maintained during self-refresh |
Key Features
| Feature | Design Value |
|---|---|
| Double Data Rate Architecture | Two data transfers per clock cycle - doubles effective bandwidth without increasing clock frequency |
| Programmable Burst Length | Configurable 2/4/8-word bursts - optimizes bus utilization for sequential vs. random access patterns |
| Auto & Self Refresh Modes | 7.8 µs auto-refresh interval and <2 mA self-refresh current - enables low-power standby with full data retention |
| Write Data Masking | Independent LDM/UDM control over lower/upper 8-bit data lanes - prevents partial writes without read-modify-write overhead |
| SSTL_2 Interface Compliance | JEDEC-standard 2.5 V signaling with controlled slew rates - ensures signal integrity in high-speed DDR layouts |
| DLL-Based Timing Control | Delay-Locked Loop synchronizes DQS-to-clock phase - enables reliable data capture at 200 MHz operation |
Applications
| Industrial HMI Systems | Network Edge Routers |
|---|---|
Use Scenario: Real-time display rendering and touch response in factory-floor HMIs operating continuously at ambient temperatures up to 85°C. IC Role / Device Role / Timing Role: Main system memory buffering graphics frame buffers and UI state data with deterministic CAS latency timing. Use Value: Industrial temperature rating and self-refresh capability ensure uninterrupted operation during thermal cycling and brief power interruptions. | Use Scenario: Packet buffering and forwarding table storage in fanless, compact edge routers deployed in uncontrolled environments. IC Role / Device Role / Timing Role: High-bandwidth working memory for packet classification engines and flow management logic. Use Value: DDR400 bandwidth and low IDD6 current (<2 mA) support sustained throughput while minimizing thermal load in sealed enclosures. |
| Medical Diagnostic Devices | Automated Test Equipment |
Use Scenario: Image acquisition and preprocessing in portable ultrasound units requiring reliable memory performance across clinical temperature ranges. IC Role / Device Role / Timing Role: Frame buffer and algorithm scratchpad memory interfaced directly to FPGA-based image processors. Use Value: TSOP II package enables compact PCB layout; SSTL_2 compatibility simplifies interface design with Xilinx/Intel FPGA I/O banks. | Use Scenario: High-speed pattern memory in automated test systems performing real-time digital stimulus/response validation. IC Role / Device Role / Timing Role: Storage for test vectors and expected result signatures accessed at burst rates matching ATE clock domains. Use Value: Programmable burst length and CAS latency allow tuning to match tester timing margins and reduce setup/hold violations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT46V32M16-5B:J | Same density and speed grade (DDR400), but uses 60-ball BGA instead of TSOP II-66; higher I/O capacitance (3 pF vs. 2.5 pF) | Requires PCB redesign due to BGA footprint and different thermal profile; better suited for space-constrained designs with thermal vias | Select when board area is critical and reflow capability supports fine-pitch BGA assembly. |
| IS42S16400J-5BL | Identical TSOP II-66 package and pinout; same 64 Mbit ×16 organization but rated only to 70°C commercial temp range | Lacks industrial temperature qualification; not suitable for deployments exceeding 70°C ambient | Choose only for cost-sensitive commercial applications where thermal margin exceeds 15°C. |
Compared with MT46V32M16-5B:J and IS42S16400J-5BL, W9425G6KH-5I uniquely combines industrial temperature operation, TSOP II compatibility, and Winbond's proven DDR SDRAM reliability-making it optimal for field-deployed equipment where long-term stability and drop-in manufacturability are required.
Availability
W9425G6KH-5I is available at Aetrix Electronics and suitable for industrial HMI systems, network edge routers, medical diagnostic devices, and automated test equipment requiring stable component supply across extended temperature ranges and multi-year production cycles.
Supply support for W9425G6KH-5I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including NOR/NAND Flash, SRAM, and DRAM products for industrial, automotive, and communications markets.
The W9425G6KH series belongs to Winbond's legacy DDR SDRAM product line, designed specifically for cost-effective, thermally robust main memory in resource-constrained embedded systems requiring JEDEC-compliant DDR interfaces.
FAQ
What is the maximum clock frequency supported by W9425G6KH-5I?
W9425G6KH-5I supports a maximum clock frequency of 200 MHz, corresponding to DDR400 operation with a minimum clock cycle time (tCK) of 5 ns at CAS latency 3. This frequency is guaranteed across the full industrial temperature range (–40°C to +85°C) under specified 2.5 V ±0.2 V supply conditions. The device uses a DLL to maintain timing accuracy at this rate.
Does W9425G6KH-5I support both auto-refresh and self-refresh modes?
Yes, W9425G6KH-5I supports both auto-refresh and self-refresh modes. Auto-refresh requires external issuance every 7.8 µs on average (8K cycles per 64 ms), while self-refresh operates autonomously with CKE held low and draws ≤2 mA. During self-refresh, the DLL is disabled and must be reset upon exit, requiring ≥200 clock cycles before valid reads.
What is the function of the LDM and UDM pins on W9425G6KH-5I?
The LDM (Lower Data Mask) and UDM (Upper Data Mask) pins on W9425G6KH-5I provide byte-level write masking: LDM controls DQ0–DQ7 and UDM controls DQ8–DQ15. When asserted high during a write burst, they mask the corresponding 8-bit lane, enabling partial writes without read-modify-write sequences. Both signals are sampled synchronously with DQS edges.
How does W9425G6KH-5I handle differential clock inputs CLK and CLK#?
W9425G6KH-5I samples all address and command inputs (except DQ, DM, and CKE) on the crossing point of CLK and CLK#, which defines the positive clock edge. This differential input structure improves noise immunity and timing margin. The internal DLL locks to this edge to align DQS for read data capture and center DQS for write data strobing.
What package type is used for W9425G6KH-5I and what are its key mechanical features?
W9425G6KH-5I uses a 66-pin TSOP II (Thin Small Outline Package) with lead-free, RoHS-compliant construction. Key features include gull-wing leads for surface-mount assembly, separate VDDQ/VSSQ power/ground pairs for I/O noise isolation, and standardized pinout aligned with JEDEC DDR SDRAM specifications - enabling direct replacement in existing DDR memory layouts.
W9425G6KH-5I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 66-TSSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - DDR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 55 ns
- Voltage - Supply:
- 2.3V ~ 2.7V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 66-TSOP II
W9425G6KH-5I FAQ
1.How can I place an order for W9425G6KH-5I through Aetrix?
Please submit a Request for Quotation (RFQ) for W9425G6KH-5I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W9425G6KH-5I reliable?
The price and inventory of W9425G6KH-5I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9425G6KH-5I is usually 5 days.
3.What payment methods are accepted for W9425G6KH-5I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9425G6KH-5I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W9425G6KH-5I?
W9425G6KH-5I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W9425G6KH-5I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W9425G6KH-5I?
For technical support, including W9425G6KH-5I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9425G6KH-5I requirements.
6.How does Aetrix verify that W9425G6KH-5I is sourced from the original manufacturer or authorized distributors?
All W9425G6KH-5I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9425G6KH-5I meets industry standards.
7.What is the process for return or replacement of W9425G6KH-5I?
All W9425G6KH-5I units undergo pre-shipment inspection (PSI). If there is an issue with W9425G6KH-5I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W9425G6KH-5I part is unused and in its original packaging.
Return procedure for W9425G6KH-5I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W9425G6KH-5I Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
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