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Winbond Electronics Corporation W9464G6KH-5

Name: W9464G6KH-5
Brand: Winbond Electronics Corporation
SKU: W9464G6KH-5
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: W9464G6KH-5

Manufacturer:: Winbond Electronics Corporation

Category:: Memory

Package:: 66-TSSOP (0.400", 10.16mm Width)

Datasheet:: W9464G6KH-5.pdf

Description:: IC DRAM 64MBIT PAR 66TSOP II

Quantity:: RFQ Add To RFQ list

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Product details

Overview

W9464G6KH-5 from Winbond is a 1M × 4 banks × 16-bit DDR SDRAM operating at 200 MHz with 2.5V ±0.2V supply, CAS latency of 3, and tCK = 5–10 ns. It delivers up to 400M words/s bandwidth using double-data-rate architecture synchronized to both edges of DQS, and is designed for high-performance embedded systems requiring DDR400/CL3 compliance in 0°C to 70°C environments.

For engineers reviewing the W9464G6KH-5 datasheet, W9464G6KH-5 pinout, W9464G6KH-5 application, or W9464G6KH-5 equivalent, this page provides verified timing parameters, bank activation behavior, SSTL_2 interface compatibility, self-refresh current (2 mA), and TSOP II 66-pin package mapping - all confirmed from Winbond's official A02 revision datasheet dated Nov. 14, 2014.

Technical Context

This DDR SDRAM implements a 4-bank architecture with programmable burst lengths (2/4/8), selectable addressing modes (sequential/interleave), and DLL-based clock synchronization. Its command decoder accepts standard DDR control signals (CS, RAS, CAS, WE) and supports auto-precharge, burst stop, and extended mode register (EMRS) configuration for DLL enable/disable.

It features dual power domains (VDD for core logic, VDDQ/VSSQ for I/O), differential clock inputs (CLK/CLK), edge-aligned DQS on read and center-aligned DQS on write, and write data masking via LDM/UDM pins. Refresh is managed via 4K-row/64ms cycle with tRFC ≥ 60 ns and maximum 8-burst refresh capability.

Key Specifications

Parameter	Value and Actual Design Meaning
Organization	1M × 4 banks × 16 bits - supports 16-bit wide data bus with independent bank access for interleaved throughput.
Data Rate	DDR400 (200 MHz clock, 400 MT/s) - enables 6.4 GB/s peak bandwidth on 16-bit bus.
CAS Latency	CL = 3 - defines 3-clock-cycle delay from READ command to first valid DQ output; fixed for -5 speed grade.
tCK Min/Max	5 ns / 10 ns - sets maximum clock frequency (200 MHz) and minimum timing margin for stable operation.
Refresh Interval	64 ms / 4K rows - requires 4096 auto-refresh commands within 64 ms; tREFI = 15.6 µs typical.
Supply Voltage	2.5V ±0.2V - mandates tight regulation; VDDQ separated from VDD to reduce I/O noise coupling.
Self-Refresh Current	2 mA - enables low-power retention during system suspend without external clock or refresh controller.
Interface Standard	SSTL_2 - requires 1.25V VREF reference and compatible termination for signal integrity on DDR buses.

Pinout & Package

W9464G6KH-5 is packaged in a RoHS-compliant, lead-free TSOP II 66-pin (14 mm × 20 mm) surface-mount package with separate VDD/VDDQ and VSS/VSSQ power/ground domains for noise isolation.

Pin/Terminal	Circuit Role	Design Meaning
A0–A11	Address Input	Multiplexed row/column address lines; A10 controls auto-precharge enable during command decode.
BA0, BA1	Bank Address	Selects one of four internal banks for activate/precharge/read/write operations.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus synchronized to both edges of DQS; supports burst transfers.
LDQS, UDQS	Data Strobe	Bidirectional strobe: edge-aligned with read data, center-aligned with write data; per-byte group (L/U).
LDM, UDM	Write Mask	Byte-level write masking: LDM masks DQ0–DQ7, UDM masks DQ8–DQ15 during burst writes.
CLK, CLK	Differential Clock	Timing reference sampled at crossing point; all control/address inputs referenced to CLK positive edge.
CKE	Clock Enable	Controls entry/exit from power-down, self-refresh, and suspend modes; low disables internal clocking.
CS, RAS, CAS, WE	Command Inputs	Decode DDR command set (activate, precharge, read, write, MRS, EMRS, refresh) per JEDEC standard.
VREF	Input Reference	1.25V reference for SSTL_2 input threshold; must be stable during self-refresh mode.
VDD, VSS	Core Power/Ground	2.5V supply and return for internal logic; must be applied before VDDQ during power-up sequence.
VDDQ, VSSQ	I/O Power/Ground	Separated 2.5V domain for output drivers to minimize switching noise on data bus.
NC	No Connect	Unbonded pins (e.g., pins 14, 17, 19, 25, 42, 43, 50, 53); must remain unconnected on PCB.

Key Features

Feature	Design Value
Double Data Rate Architecture	Two data transfers per clock cycle (rising + falling edge of DQS) doubles effective bandwidth without increasing clock frequency.
Programmable Mode Register	Configures burst length (2/4/8), CAS latency (2/2.5/3), addressing mode, and DLL reset - enabling runtime optimization.
Auto & Self Refresh Support	Auto-refresh maintains data with external controller; self-refresh retains data at 2 mA with no clock or commands required.
Write Data Mask (WDMS)	LDM/UDM pins allow per-byte disabling of write data, eliminating need for read-modify-write cycles in partial updates.
Power-Down Modes	Precharge and active power-down reduce IDD2F/IDD2Q to ≤25 mA; CKE-controlled entry/exit ensures deterministic state transitions.
SSTL_2 Interface Compliance	Guarantees interoperability with industry-standard DDR controllers and layout practices including controlled impedance and termination.

Applications

Networking Equipment	Industrial HMI Panels
Use Scenario: Packet buffering and table lookups in Layer 2/3 switches and routers with real-time traffic shaping. IC Role / Device Role / Timing Role: High-bandwidth, low-latency DDR memory supporting concurrent multi-bank access for parallel packet processing pipelines. Use Value: 4-bank interleaving and CL3 timing enable sustained 400 MT/s throughput across multiple concurrent read/write streams without bank conflicts.	Use Scenario: Frame buffer and application code storage in ruggedized touch-panel HMIs with extended temperature operation. IC Role / Device Role / Timing Role: Primary system memory interfacing directly to ARM Cortex-A/MIPS-based SoCs via standard DDR controller PHY. Use Value: TSOP II package withstands thermal cycling; self-refresh at 2 mA extends battery-backed operation during power loss events.
Digital Set-Top Boxes	Medical Imaging Controllers
Use Scenario: Video decode buffer and OSD compositing in MPEG-4/H.264 decoding platforms with HDMI output. IC Role / Device Role / Timing Role: Burst-length-8 capable memory delivering continuous 16-bit pixel streams synchronized to video clock domains. Use Value: Edge-aligned DQS on read ensures precise pixel timing alignment; write mask enables efficient alpha-blending updates without full-frame writes.	Use Scenario: Real-time acquisition buffer for ultrasound or X-ray image capture subsystems requiring deterministic latency. IC Role / Device Role / Timing Role: Low-jitter, high-reliability memory supporting burst-mode ADC data ingestion and DMA transfer to host processor. Use Value: tRCD = 20 ns and tRP = 20 ns guarantee sub-50 ns bank activation/precharge overhead, critical for time-critical imaging pipelines.

Networking Equipment

Industrial HMI Panels

Use Scenario: Packet buffering and table lookups in Layer 2/3 switches and routers with real-time traffic shaping.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency DDR memory supporting concurrent multi-bank access for parallel packet processing pipelines.

Use Value: 4-bank interleaving and CL3 timing enable sustained 400 MT/s throughput across multiple concurrent read/write streams without bank conflicts.

Use Scenario: Frame buffer and application code storage in ruggedized touch-panel HMIs with extended temperature operation.

IC Role / Device Role / Timing Role: Primary system memory interfacing directly to ARM Cortex-A/MIPS-based SoCs via standard DDR controller PHY.

Use Value: TSOP II package withstands thermal cycling; self-refresh at 2 mA extends battery-backed operation during power loss events.

Digital Set-Top Boxes

Medical Imaging Controllers

Use Scenario: Video decode buffer and OSD compositing in MPEG-4/H.264 decoding platforms with HDMI output.

IC Role / Device Role / Timing Role: Burst-length-8 capable memory delivering continuous 16-bit pixel streams synchronized to video clock domains.

Use Value: Edge-aligned DQS on read ensures precise pixel timing alignment; write mask enables efficient alpha-blending updates without full-frame writes.

Use Scenario: Real-time acquisition buffer for ultrasound or X-ray image capture subsystems requiring deterministic latency.

IC Role / Device Role / Timing Role: Low-jitter, high-reliability memory supporting burst-mode ADC data ingestion and DMA transfer to host processor.

Use Value: tRCD = 20 ns and tRP = 20 ns guarantee sub-50 ns bank activation/precharge overhead, critical for time-critical imaging pipelines.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR SDRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MT46V32M16-5B:J	Same 512Mb × 16 organization, but rated for -5B (2.6V–2.7V VDD), higher IDD0 (50 mA vs. 45 mA), and different tRC (60 ns vs. 55 ns).	Designed for server-grade DDR modules; less suitable for cost-sensitive industrial designs due to tighter voltage tolerance.	Choose only if existing design uses Micron's DDR controller timing margins and requires JEDEC-compliant -5B qualification.
IS42S16100E-5BLI	Identical 1M × 4 × 16 structure and -5 speed grade, but supports CL2.5/3 only (no CL2), and has higher self-refresh current (3 mA vs. 2 mA).	Qualified for industrial temp (-40°C to +85°C) as -5BLI variant; not drop-in for W9464G6KH-5's commercial temp range.	Select when extended temperature range is mandatory and 1 mA higher self-refresh current is acceptable in battery-backed systems.

Compared with MT46V32M16-5B:J and IS42S16100E-5BLI, W9464G6KH-5 offers lower operating current (45 mA IDD0), tighter tRC (55 ns), and optimized commercial-temp power delivery - making it preferable for embedded consumer and industrial applications where cost, thermal headroom, and voltage margin are constrained.

Availability

W9464G6KH-5 is available at Aetrix Electronics and suitable for networking equipment, industrial HMI panels, digital set-top boxes, and medical imaging controllers requiring stable component supply, long-term lifecycle support, and RoHS-compliant TSOP II packaging.

Supply support for W9464G6KH-5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and DDR SDRAM for embedded and industrial markets.

W9464G6KH-5 belongs to Winbond's DDR SDRAM product line, engineered for cost-effective, high-reliability memory in space-constrained consumer and industrial applications requiring DDR400 performance with minimal power overhead.

FAQ

What is the maximum clock frequency supported by W9464G6KH-5?

W9464G6KH-5 supports a maximum clock frequency of 200 MHz, corresponding to DDR400 data rate (400 MT/s). This is defined by its tCK minimum of 5 ns under CL=3 conditions, as specified in Winbond's A02 datasheet section 4 (KEY PARAMETERS). The device is fully compliant with JEDEC DDR-400 timing requirements and requires stable 2.5V ±0.2V supply to sustain this frequency.

Does W9464G6KH-5 support CAS latency 2?

No, W9464G6KH-5 does not support CAS latency 2. According to Winbond's official datasheet revision A02, section 2 (FEATURES), the supported CAS latencies are 2, 2.5, and 3 - but section 3 (ORDER INFORMATION) explicitly lists W9464G6KH-5 as DDR400/CL3 only. The -5 speed grade is characterized and guaranteed exclusively for CL=3 operation; CL=2 is only supported by faster speed grades such as -4.

What is the purpose of the VREF pin on W9464G6KH-5?

The VREF pin on W9464G6KH-5 provides a 1.25V reference voltage for SSTL_2 input buffers, setting the switching threshold for address, command, and control signals (CS, RAS, CAS, WE, CKE, BA0/BA1, A0–A11). As stated in section 6 (PIN DESCRIPTION), VREF must remain stable during all operational modes - including self-refresh - and must be decoupled with 0.1 µF near the package per Winbond's layout recommendations.

Can W9464G6KH-5 operate in self-refresh mode without an external clock?

Yes, W9464G6KH-5 can operate in self-refresh mode without an external clock. When CKE is driven low while all banks are idle, the device enters self-refresh and maintains data retention using its internal oscillator, drawing only 2 mA (section 3, ORDER INFORMATION). During this mode, CLK/CLK inputs are ignored, but VREF must remain powered and stable per section 8.2.14 of the datasheet.

What package type is used for W9464G6KH-5?

W9464G6KH-5 uses a TSOP II (Thin Small Outline Package, Type II) with 66 pins, as confirmed in section 2 (FEATURES) and section 13 (Package Specification) of the Winbond datasheet. It measures 14 mm × 20 mm, is lead-free and RoHS-compliant, and features staggered pin layout optimized for high-density PCB routing in DDR memory subsystems.

W9464G6KH-5 Specifications

Product attributes: Attribute value

Manufacturer:: Winbond Electronics Corporation

Series:: -

Package/Case:: 66-TSSOP (0.400", 10.16mm Width)

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: DRAM

Technology:: SDRAM - DDR

Memory Size:: 64Mbit

Memory Organization:: 4M x 16

Memory Interface:: Parallel

Clock Frequency:: 200 MHz

Write Cycle Time - Word, Page:: 15ns

Access Time:: 55 ns

Voltage - Supply:: 2.3V ~ 2.7V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 66-TSOP II

W9464G6KH-5 FAQ

1.How can I place an order for W9464G6KH-5 through Aetrix?

Please submit a Request for Quotation (RFQ) for W9464G6KH-5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9464G6KH-5 reliable?

The price and inventory of W9464G6KH-5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9464G6KH-5 is usually 5 days.

3.What payment methods are accepted for W9464G6KH-5?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9464G6KH-5 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9464G6KH-5?

W9464G6KH-5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9464G6KH-5 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9464G6KH-5?

For technical support, including W9464G6KH-5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9464G6KH-5 requirements.

6.How does Aetrix verify that W9464G6KH-5 is sourced from the original manufacturer or authorized distributors?

All W9464G6KH-5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9464G6KH-5 meets industry standards.

7.What is the process for return or replacement of W9464G6KH-5?

All W9464G6KH-5 units undergo pre-shipment inspection (PSI). If there is an issue with W9464G6KH-5, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9464G6KH-5 part is unused and in its original packaging.

Return procedure for W9464G6KH-5:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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