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Winbond Electronics Corporation W9464G6KH-5 TR

Part No.:
W9464G6KH-5 TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
66-TSSOP (0.400", 10.16mm Width)
Datasheet:
AetrixW9464G6KH-5 TR.pdf
Description:
IC DRAM 64MBIT PAR 66TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,133

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Product details

Overview

W9464G6KH-5 TR from Winbond is a 1M × 4 banks × 16-bit DDR SDRAM operating at 200 MHz with 2.5V ±0.2V supply, CAS latency options of 2/2.5/3, and SSTL_2 interface - designed for high-bandwidth memory subsystems in embedded controllers, industrial HMIs, and legacy PC-compatible platforms requiring DDR400/CL3 compliance.

For engineers reviewing the W9464G6KH-5 TR datasheet, W9464G6KH-5 TR pinout, W9464G6KH-5 TR application, or W9464G6KH-5 TR equivalent, key selection considerations include its TSOP-II 66-pin package, 7.5–10 ns clock cycle (tCK), 40 ns tRAS, 55 ns tRC, and support for auto/self-refresh with 2 mA standby current.

Technical Context

This DDR SDRAM implements double-data-rate architecture synchronized to both edges of DQS, with differential CLK/CLK inputs and edge-aligned read data / center-aligned write data. It uses a programmable Mode Register to configure burst length (2/4/8), addressing mode (sequential/interleave), and DLL reset state.

The device integrates four independent banks, each with row/column decoders, sense amplifiers, and prefetch registers. Its power management includes precharge power-down, active power-down, and self-refresh modes - all controlled via CKE, CS, RAS, CAS, and WE command decoding with strict timing constraints including tRFC ≥ 70 ns and tREFI = 64 ms.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization1M words × 4 banks × 16 bits = 64 Mbit total capacity
Max Clock Frequency200 MHz - supports DDR400 data rate (400 MT/s)
CAS LatencyProgrammable CL = 2, 2.5, or 3 - determines read access delay in clock cycles
Burst LengthConfigurable 2, 4, or 8 - defines number of consecutive data transfers per command
tRAS (min)40 ns - minimum active-to-precharge time; constrains maximum row activation duration
tRC (min)55 ns - minimum active-to-active or active-to-refresh interval; governs bank cycling rate
IDD6 (Self Refresh)2 mA max - ultra-low current draw during system suspend, enabling extended battery life
Interface StandardSSTL_2 - ensures signal integrity and compatibility with DDR controller I/O drivers

Pinout & Package

W9464G6KH-5 TR is housed in a RoHS-compliant, lead-free TSOP-II 66-pin package (13.0 mm × 20.0 mm × 1.2 mm height) with separate VDD/VDDQ and VSS/VSSQ rails for logic and I/O noise isolation.

Pin/TerminalCircuit RoleDesign Meaning
A0–A11Address InputMultiplexed row/column address lines; A10 controls auto-precharge enable
BA0, BA1Bank AddressSelects one of four internal banks for activate/read/write operations
DQ0–DQ15Data I/O16-bit bidirectional data bus synchronized to both edges of DQS
LDQS, UDQSData StrobeLower/upper byte DQS signals; edge-aligned on read, center-aligned on write
LDM, UDMData MaskByte-level write masking: LDM for DQ0–DQ7, UDM for DQ8–DQ15
CLK, CLK#Differential ClockTiming reference for all commands; sampling occurs at crossing point
CKEClock EnableControls entry/exit from power-down and self-refresh modes
CS#, RAS#, CAS#, WE#Command ControlActive-low command decoder inputs defining bank activate, read, write, refresh, etc.
VREFInput Reference2.5V reference for SSTL_2 input threshold setting; must be stable during self-refresh
VDD, VSSCore Power/Ground2.5V ±0.2V supply for internal logic; requires decoupling per JEDEC DDR guidelines
VDDQ, VSSQI/O Power/GroundSeparate 2.5V rail for output buffers to minimize switching noise coupling into core logic

Key Features

FeatureDesign Value
Double Data Rate ArchitectureTwo data transfers per clock cycle - doubles effective bandwidth without increasing clock frequency
Programmable Mode RegisterEnables runtime configuration of burst length, CAS latency, and DLL reset - eliminates hardware redesign for timing tuning
Write Data Mask (WDMS)LDM/UDM pins allow selective byte masking during burst writes - prevents partial-word corruption in mixed-access systems
Auto & Self Refresh4K-row refresh completed within 64 ms; self-refresh draws only 2 mA - enables low-power suspend states
Power Down ModesPrecharge and active power-down reduce IDD2F/IDD2Q to 25 mA - cuts idle power by >40% vs. active operation

Applications

Industrial HMI Memory BufferLegacy PC Embedded Controller

Use Scenario: Touchscreen-based human-machine interface running real-time OS with graphics overlay and local data logging.

IC Role / Device Role / Timing Role: Primary working memory for display frame buffer and application code execution; interfaces directly to ARM9 or MIPS-based SoC DDR controller.

Use Value: 64 Mbit density and DDR400 bandwidth support smooth 800×480 pixel rendering at 60 Hz with <10 µs read latency (CL=2), while self-refresh extends battery-backed operation to >72 hours.

Use Scenario: Industrial automation controller maintaining firmware, configuration tables, and I/O history in non-volatile context during brownouts.

IC Role / Device Role / Timing Role: Main system RAM co-located with X86-compatible microcontroller; operates under 0°C to 70°C ambient per -5 speed grade.

Use Value: SSTL_2 compatibility ensures plug-and-play integration with legacy chipset designs; 40 ns tRAS and 55 ns tRC enable deterministic memory arbitration in hard real-time PLC scan cycles.

Network Appliance Packet BufferMedical Diagnostic Imaging Cache

Use Scenario: Low-cost Ethernet switch ASIC buffering ingress/egress packet queues with dynamic allocation across ports.

IC Role / Device Role / Timing Role: Shared packet memory accessed concurrently by multiple DMA engines; relies on 4-bank interleaving for parallel access.

Use Value: Four independent banks allow simultaneous read from one bank while writing to another - sustaining >320 MB/s aggregate throughput under burst-8 traffic patterns.

Use Scenario: Portable ultrasound device capturing and preprocessing real-time B-mode image streams before compression and storage.

IC Role / Device Role / Timing Role: High-speed frame store between ADC front-end and DSP engine; requires low-latency random access and burst streaming.

Use Value: Programmable CL=2/2.5/3 allows optimization for either minimal latency (diagnostic responsiveness) or maximum throughput (real-time Doppler processing); 2.5V operation reduces thermal load in sealed enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR SDRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MT46V64M16P-5B:JSame 64 Mbit density, 200 MHz, CL=3 only; 60-pin TFBGA vs. 66-pin TSOP-II; higher IDD0 (50 mA vs. 45 mA)Requires PCB redesign due to different footprint and ballout; better thermal performance in space-constrained layoutsChoose if board area is constrained and BGA assembly capability exists; avoid for TSOP-II socketed or legacy wave-soldered designs
IS42S16640B-5TLIdentical 64 Mbit, TSOP-II 66-pin, CL=2/2.5/3; same tRAS/tRC specs; slightly higher IDD6 (2.5 mA vs. 2 mA)Pin-to-pin compatible with W9464G6KH-5 TR; identical command set and timing - drop-in replacementSelect for second-source assurance without layout or firmware changes; verify VREF tolerance alignment in high-noise environments

Compared with MT46V64M16P-5B:J and IS42S16640B-5TL, W9464G6KH-5 TR offers the lowest self-refresh current (2 mA) and full CL flexibility in a proven TSOP-II form factor - making it optimal for cost-sensitive, thermally constrained, or long-lifecycle industrial designs where footprint stability is critical.

Availability

W9464G6KH-5 TR is available at Aetrix Electronics and suitable for industrial HMIs, legacy PC embedded controllers, and network appliance packet buffers requiring stable component supply, long-term lifecycle support, and RoHS-compliant manufacturing.

Supply support for W9464G6KH-5 TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and DDR SDRAM for industrial, automotive, and computing markets.

The W9464G6KH series belongs to Winbond's DDR1 SDRAM product line, engineered for backward-compatible DDR400 systems where reliability, temperature stability, and pinout consistency outweigh next-generation bandwidth requirements.

FAQ

What is the operating temperature range for W9464G6KH-5 TR?

W9464G6KH-5 TR is rated for commercial temperature operation from 0°C to +70°C. This distinguishes it from the industrial-grade W9464G6KH-5I variant, which supports –40°C to +85°C. The -5 suffix explicitly denotes the commercial speed grade, and thermal derating of AC parameters must follow the datasheet's recommended DC operating conditions across this range.

Does W9464G6KH-5 TR support DLL reset and how is it configured?

Yes, W9464G6KH-5 TR supports DLL reset via bit A8 in the Mode Register Set (MRS) command. When A8 = 1 during MRS, the DLL is reset; when A8 = 0, DLL reset is disabled. A minimum of 200 clock cycles after DLL reset is required before issuing a Read command to ensure lock stability - a mandatory step in the documented power-up initialization sequence.

Can W9464G6KH-5 TR be used in systems requiring CL=2.5 latency?

Yes, W9464G6KH-5 TR fully supports CAS Latency 2.5 as specified in its features and KEY PARAMETERS table. CL=2.5 is selected by programming A6–A4 = 010 in the Mode Register. This setting yields a tCK min of 6 ns at CL=2.5, enabling tighter timing margins than CL=3 while retaining greater setup margin than CL=2 in marginal signal integrity environments.

What is the function of the VREF pin on W9464G6KH-5 TR and is it required during self-refresh?

The VREF pin provides the 2.5V reference voltage for SSTL_2 input thresholding on address, command, and control pins. Per the datasheet, VREF must remain stable and powered during self-refresh mode - even though CKE is driven low - because internal input receivers remain active and require valid reference levels to maintain command decode readiness upon exit.

How many auto-refresh commands must be issued to maintain data retention in W9464G6KH-5 TR?

W9464G6KH-5 TR requires 4,096 auto-refresh cycles every 64 ms (tREFI = 64 ms), averaging one refresh every 15.625 µs. The device allows up to eight pending auto-refresh commands, but the absolute interval between any two successive commands must not exceed 8 × tREFI = 512 ms to guarantee data retention across all rows and banks.

W9464G6KH-5 TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
66-TSSOP (0.400", 10.16mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM - DDR
Memory Size:
64Mbit
Memory Organization:
4M x 16
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
15ns
Access Time:
55 ns
Voltage - Supply:
2.3V ~ 2.7V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
66-TSOP II

W9464G6KH-5 TR FAQ

1.How can I place an order for W9464G6KH-5 TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W9464G6KH-5 TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W9464G6KH-5 TR reliable?

The price and inventory of W9464G6KH-5 TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W9464G6KH-5 TR is usually 5 days.

3.What payment methods are accepted for W9464G6KH-5 TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W9464G6KH-5 TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W9464G6KH-5 TR?

W9464G6KH-5 TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W9464G6KH-5 TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W9464G6KH-5 TR?

For technical support, including W9464G6KH-5 TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W9464G6KH-5 TR requirements.

6.How does Aetrix verify that W9464G6KH-5 TR is sourced from the original manufacturer or authorized distributors?

All W9464G6KH-5 TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W9464G6KH-5 TR meets industry standards.

7.What is the process for return or replacement of W9464G6KH-5 TR?

All W9464G6KH-5 TR units undergo pre-shipment inspection (PSI). If there is an issue with W9464G6KH-5 TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W9464G6KH-5 TR part is unused and in its original packaging.

Return procedure for W9464G6KH-5 TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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