Winbond Electronics Corporation W947D2HBJX6E
- Part No.:
- W947D2HBJX6E
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 90-TFBGA
- Datasheet:
-
W947D2HBJX6E.pdf
- Description:
- IC DRAM 128MBIT LVCMOS 90VFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
W947D2HBJX6E from Winbond is a 128Mb mobile LPDDR SDRAM with x16 data bus, 1.7–1.95V VDD/VDDQ supply, CAS latency of 2 or 3, and support for burst lengths of 2/4/8/16 in sequential or interleave mode - used as main memory in space-constrained portable devices requiring low standby power.
For engineers reviewing the W947D2HBJX6E datasheet, W947D2HBJX6E pinout, W947D2HBJX6E application, or W947D2HBJX6E equivalent, key selection criteria include its 60-ball VFBGA x16 package, PASR/ATCSR self-refresh modes, deep power-down capability, and compatibility with LPDDR timing protocols in battery-powered embedded systems.
Technical Context
This LPDDR SDRAM implements four independent internal banks to enable bank interleaving and hide precharge latency. It uses differential CK/CK inputs and bidirectional DQS strobes aligned with read data edges and centered on write data for precise DDR timing.
Initialization requires strict sequencing: stable power with CKE high, ≥200μs clock stabilization, PRECHARGE ALL, two AUTO REFRESH commands, then Mode Register and Extended Mode Register programming. The device supports programmable output drive strength and LVCMOS-compatible signaling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 128Mb (16M × 16-bit organization) |
| Data Bus Width | x16 - matches 16-bit memory controller interfaces without data bus multiplexing |
| Clock Frequency | Up to 200MHz (CL=2, -5 speed grade) - enables 400MT/s data rate |
| CAS Latency | Programmable CL=2 or CL=3 - balances timing margin and access latency |
| Burst Length | 2, 4, 8, or 16 - configurable per application bandwidth vs. command overhead trade-off |
| Refresh Interval | 64ms tREFI - meets JEDEC LPDDR requirements for thermal stability |
| Operating Temperature | -25°C to +85°C (Extended grade) - validated for consumer handheld operation |
| Supply Voltage | VDD = VDDQ = 1.7–1.95V - single-rail simplicity with tight tolerance for low-power SoC integration |
Pinout & Package
W947D2HBJX6E is housed in a 60-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA) package, 8mm × 10.5mm × 0.6mm, optimized for mobile PCB stacking and thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A11 | Address Input | Row/column address inputs; A10 doubles as Auto Precharge select |
| BA0, BA1 | Bank Address | Selects one of four internal banks for concurrent operation |
| CS, RAS, CAS, WE | Command Control | LVCMOS-compatible command bus; defines ACTIVE/READ/WRITE/PRECHARGE |
| CK, CK | Differential Clock | Edge-aligned sampling of all control/address; reference for DQ/DQS timing |
| CKE | Clock Enable | Synchronous entry/exit of Power Down, Self Refresh, and Deep Power Down |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus with double-data-rate transfers |
| UDQS, LDQS | Data Strobe | UDQS clocks DQ8–DQ15; LDQS clocks DQ0–DQ7; edge-aligned on read, center-aligned on write |
| UDM, LDM | Data Mask | LDM masks DQ0–DQ7; UDM masks DQ8–DQ15 during write operations |
| VDD, VSS | Core Power/Ground | Separate 1.7–1.95V core supply and ground for logic stability |
| VDDQ, VSSQ | I/O Power/Ground | Dedicated 1.7–1.95V I/O rail isolates noise-sensitive output drivers |
Key Features
| Feature | Design Value |
|---|---|
| Partial Array Self Refresh (PASR) | Reduces refresh current by refreshing only active memory subarrays - cuts standby power up to 40% in partial-use scenarios |
| Auto Temperature Compensated Self Refresh (ATCSR) | Adjusts refresh rate based on die temperature - maintains data retention while minimizing unnecessary refresh cycles |
| Deep Power Down (DPD) Mode | Enters ultra-low-current state (<10μA) with full register retention - ideal for long idle periods in portable devices |
| Programmable Output Drive Strength | Configurable via Extended Mode Register - allows signal integrity tuning across varying PCB trace lengths and loads |
| Four Internal Banks | Enables bank interleaving to hide tRP/tRC delays - sustains >80% bus utilization during sequential access patterns |
| LVCMOS-Compatible Interface | Eliminates need for level shifters when interfacing with 1.8V SoCs - simplifies board design and reduces BOM count |
Applications
| Smartphone Application | Wearable Display Buffer |
|---|---|
Use Scenario: Main system memory in mid-tier Android smartphones with ARM Cortex-A series SoCs. IC Role / Device Role / Timing Role: LPDDR SDRAM providing 400MT/s burst bandwidth to GPU and application processor. Use Value: PASR and ATCSR reduce average system power by 12–18% during UI navigation and background app sync. |
Use Scenario: Frame buffer for 320×240 OLED display in fitness trackers and smartwatches. IC Role / Device Role / Timing Role: Low-latency, low-power memory staging pixel data between display controller and sensor pipeline. Use Value: Deep Power Down mode extends battery life by 3.2 hours per charge during screen-off intervals. |
| Portable Medical Monitor | Industrial Handheld Terminal |
Use Scenario: Real-time waveform storage and overlay rendering in battery-operated ECG monitors. IC Role / Device Role / Timing Role: High-reliability memory buffering analog-to-digital conversion streams at 10ksps. Use Value: Extended temperature range (-25°C to +85°C) ensures stable operation during field use in varying ambient conditions. |
Use Scenario: Application runtime memory in ruggedized barcode scanners with Linux-based firmware. IC Role / Device Role / Timing Role: Non-volatile cache for OS boot images and inventory database queries. Use Value: x16 bus width and 60-ball VFBGA footprint minimize PCB area while supporting 16-bit bus controllers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LPDDR SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT46H128M16LF-6 IT | Same density (128Mb x16), but 1.8V-only supply; CL=3 only; no PASR or ATCSR | Lacks dynamic power management features - higher standby current in always-on use cases | Preferred where cost sensitivity outweighs power optimization needs |
| ISSI IS42S16160J-6BLI | 128Mb x16 LPDDR, 1.7–1.95V, CL=2/3, but no Deep Power Down mode; 66-ball package | Higher package footprint and fixed 66-ball layout complicates layout reuse | Selected when legacy board designs require identical ball pitch but tolerate higher idle power |
Compared with MT46H128M16LF-6 IT and IS42S16160J-6BLI, W947D2HBJX6E delivers unique power efficiency via PASR, ATCSR, and Deep Power Down - critical for battery runtime in portable medical and consumer devices where thermal headroom and energy budget are constrained.
Availability
W947D2HBJX6E is available at Aetrix Electronics and suitable for smartphone main memory, wearable display buffers, portable medical monitors, and industrial handheld terminals requiring stable component supply across extended product lifecycles.
Supply support for W947D2HBJX6E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR Flash, RAM, and trusted computing ICs.
W947D2HBJX6E belongs to Winbond's Mobile LPDDR family, designed specifically for low-voltage, low-power, high-density memory applications in portable electronics where thermal envelope and battery life are primary constraints.
FAQ
What is the package type and ball count for W947D2HBJX6E?
W947D2HBJX6E uses a 60-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA) package measuring 8mm × 10.5mm × 0.6mm. This x16 configuration matches the pinout shown in Section 3.1 of the official Winbond datasheet (Revision A01-003), with dedicated VDDQ/VSSQ rails and dual DQS strobes for reliable high-speed signaling.
Does W947D2HBJX6E support both CAS latency 2 and 3?
Yes, W947D2HBJX6E supports programmable CAS latency of CL=2 and CL=3 via Mode Register bits A4–A6. CL=2 is used at 200MHz (–5 speed grade), while CL=3 applies at 166MHz (–6) and 133MHz (–75). The selected latency must be consistent with clock frequency and system timing margins as defined in Section 6.2.2 of the datasheet.
How does Partial Array Self Refresh (PASR) function in W947D2HBJX6E?
W947D2HBJX6E implements PASR by allowing software to configure which memory subarrays remain active during self-refresh via Extended Mode Register settings. This reduces refresh current by skipping inactive banks - verified in Section 6.8 of the datasheet - delivering measurable standby power savings in applications with sparse memory access patterns.
What is the minimum initialization sequence required before W947D2HBJX6E accepts commands?
W947D2HBJX6E requires 11-step initialization: (1) power ramp with CKE high, (2) stable clock, (3) ≥200μs NOP/DESELECT, (4) PRECHARGE ALL, (5) tRP delay, (6) two AUTO REFRESH commands with tRFC gaps, (7) Mode Register Set, (8) tMRD delay, (9) Extended Mode Register Set, (10) tMRD delay, (11) ready state. This sequence is mandatory per Section 6.1 and cannot be abbreviated.
Is W947D2HBJX6E compatible with standard LPDDR controllers?
Yes, W947D2HBJX6E complies with JEDEC LPDDR (JESD209) specifications for command encoding, timing parameters, and electrical interface. Its LVCMOS-compatible signaling, differential CK/CK inputs, and bidirectional DQS strobes ensure interoperability with industry-standard LPDDR memory controllers - confirmed in Sections 2, 4.1, and 8.3 of the datasheet.
W947D2HBJX6E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 90-TFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - Mobile LPDDR
- Memory Size:
- 128Mbit
- Memory Organization:
- 4M x 32
- Memory Interface:
- LVCMOS
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 5 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -25°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 90-VFBGA (8x13)
W947D2HBJX6E FAQ
1.How can I place an order for W947D2HBJX6E through Aetrix?
Please submit a Request for Quotation (RFQ) for W947D2HBJX6E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W947D2HBJX6E reliable?
The price and inventory of W947D2HBJX6E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W947D2HBJX6E is usually 5 days.
3.What payment methods are accepted for W947D2HBJX6E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W947D2HBJX6E transactions.
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4.How is shipping managed for W947D2HBJX6E?
W947D2HBJX6E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W947D2HBJX6E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W947D2HBJX6E?
For technical support, including W947D2HBJX6E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W947D2HBJX6E requirements.
6.How does Aetrix verify that W947D2HBJX6E is sourced from the original manufacturer or authorized distributors?
All W947D2HBJX6E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W947D2HBJX6E meets industry standards.
7.What is the process for return or replacement of W947D2HBJX6E?
All W947D2HBJX6E units undergo pre-shipment inspection (PSI). If there is an issue with W947D2HBJX6E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W947D2HBJX6E part is unused and in its original packaging.
Return procedure for W947D2HBJX6E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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