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Winbond Electronics Corporation W948D2FBJX5E

Part No.:
W948D2FBJX5E
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
90-TFBGA
Datasheet:
AetrixW948D2FBJX5E.pdf
Description:
IC DRAM 256MBIT PAR 90VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:140

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Product details

Overview

W948D2FBJX5E from Winbond is a 256Mb mobile LPDDR SDRAM with x16 data bus, 1.7–1.95V VDD/VDDQ supply, CAS latency 2 or 3, and 64 ms refresh period-designed for low-power mobile applications requiring burst-oriented memory access with partial array self-refresh and temperature-compensated refresh.

For engineers reviewing the W948D2FBJX5E datasheet, W948D2FBJX5E pinout, W948D2FBJX5E application, or W948D2FBJX5E equivalent, this device supports LPDDR x16 interface timing, programmable output drive strength, deep power-down mode, clock stop capability, and four-bank interleaving for mobile SoC memory subsystems.

Technical Context

This LPDDR SDRAM implements differential CK/CK inputs for precise clock edge sampling, bidirectional DQS strobes aligned with read data and centered on write data, and dual-mode burst (sequential or interleave) controlled via Mode Register bits A3 and A0–A2. It uses internal bank addressing (BA0/BA1) and row/column address multiplexing with A10/AP enabling auto-precharge.

Power management includes three distinct low-power states: Power Down (CKE-driven), Deep Power Down (DPD), and Self Refresh-with ATCSR adjusting refresh rate based on die temperature and PASR allowing selective bank refresh to reduce current draw during partial memory usage.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 256Mb (32MB), organized as 4 banks × 8,192 rows × 1,024 columns × 16-bit
Data Bus Width x16 interface-supports 16-bit parallel I/O with separate UDQS/LDQS strobes for upper/lower byte groups
Clock Rate Up to 200MHz (CL=2, tCK=5ns) - enables 400 MT/s data transfer rate per pin
CAS Latency Programmable CL=2 or CL=3 - determines minimum RAS-to-CAS delay for read command execution
Refresh Interval 64ms standard refresh period - requires 8,192 auto-refresh cycles per interval across all banks
Supply Voltage VDD = VDDQ = 1.7–1.95V - single-supply operation simplifies PMIC design in space-constrained mobile PCBs
Operating Temperature Industrial grade: –40°C to +85°C - qualified for extended-temperature embedded and automotive infotainment use
Package 60-ball VFBGA (5.0 × 8.0 × 0.6 mm, 0.5 mm pitch) - compact footprint optimized for thin mobile form factors

Pinout & Package

W948D2FBJX5E is housed in a 60-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA) package with 0.5 mm pitch, measuring 5.0 mm × 8.0 mm × 0.6 mm. Pin assignments follow LPDDR x16 ball mapping per datasheet Section 3.1.

Pin/Terminal Circuit Role Design Meaning
A0–A12 Input Address Row/column address inputs; A10 doubles as Auto Precharge enable (AP)
BA0, BA1 Input Bank Select Selects one of four internal banks for ACTIVE/READ/WRITE/PRECHARGE commands
CS, RAS, CAS, WE Input Command Strobes Encoded control signals defining command type (e.g., ACTIVE = CS/L, RAS/L, CAS/H, WE/H)
CK, CK Differential Clock Input Samples all address/control on rising edge of CK/falling edge of CK; defines timing reference
CKE Clock Enable Active-HIGH; gates internal clocks-LOW enters Power Down, Self Refresh, or Active Power Down
DQ0–DQ15 I/O Data Bus 16-bit bidirectional data path; supports double-data-rate transfers synchronized to DQS edges
UDQS, LDQS I/O Data Strobe UDQS clocks DQ8–DQ15; LDQS clocks DQ0–DQ7; edge-aligned on reads, center-aligned on writes
UDM, LDM Input Data Mask LDM masks DQ0–DQ7; UDM masks DQ8–DQ15; sampled on both DQS edges during WRITE
VDD, VSS Core Power/Ground 1.7–1.95V supply and return for logic circuitry and input buffers
VDDQ, VSSQ I/O Power/Ground Separate 1.7–1.95V supply/ground for DQ/DQS drivers-reduces switching noise coupling

Key Features

Feature Design Value
Partial Array Self Refresh (PASR) Enables refresh of only active banks-reducing IDD current by up to 50% when memory usage is sparse
Automatic Temperature Compensated Self Refresh (ATCSR) Adjusts refresh rate dynamically with junction temperature-maintains data retention while minimizing power at low temp
Deep Power Down (DPD) Mode Reduces standby current to ≤1 µA-ideal for long idle periods in battery-powered handheld devices
Programmable Output Drive Strength Configurable via Extended Mode Register-allows signal integrity tuning for varying trace lengths and loads
Four Independent Banks Enables bank interleaving-hides precharge and activation delays to sustain high effective bandwidth
Auto Precharge Option Enabled per READ/WRITE via A10/AP-eliminates explicit PRECHARGE command overhead in sequential access patterns

Applications

Smartphone Application Processor Memory Tablet GPU Frame Buffer

Use Scenario: Main system memory for ARM-based application processors in sub-6-inch smartphones with tight thermal and power budgets.

IC Role / Device Role / Timing Role: LPDDR x16 interface provides 3.2 GB/s peak bandwidth to support multi-core CPU, ISP, and video decode pipelines.

Use Value: PASR and ATCSR cut average DRAM current by 35% during UI navigation and background app refresh-extending battery life.

Use Scenario: Dedicated graphics memory for Mali-T860 or Adreno 505 GPUs in 7–10 inch Android tablets.

IC Role / Device Role / Timing Role: Four-bank architecture enables concurrent texture fetch and render target writes without pipeline stalls.

Use Value: CL=2 timing at 200MHz delivers 16-cycle read latency-matching GPU pixel throughput requirements for 1080p UI rendering.

Automotive Infotainment Head Unit Portable Medical Imaging Display

Use Scenario: System memory in QNX- or Linux-based head units supporting navigation, Bluetooth audio, and rear-camera video overlay.

IC Role / Device Role / Timing Role: Industrial temperature rating (–40°C to +85°C) and DPD mode ensure reliable operation across vehicle cabin thermal cycles.

Use Value: Deep Power Down mode reduces quiescent current to <1 µA during ignition-off state-meeting ISO 16750-2 parasitic drain limits.

Use Scenario: Frame buffer memory in portable ultrasound or X-ray preview displays requiring rapid image update and zero data loss.

IC Role / Device Role / Timing Role: Dual-clock domain (CK/CK) and strict AC timing compliance guarantee deterministic read latency for real-time display controllers.

Use Value: 64ms refresh guarantee and error-free operation at full spec ensures uninterrupted clinical image streaming over 10+ year product lifetime.

Equivalent & Alternatives

The following parts are listed as comparable options for similar LPDDR SDRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
MT46H32M16LFCK-6 IT:F Same density (256Mb x16), but operates at 1.2V core/I/O; supports CL=2.5/3 only; no PASR or ATCSR Lacks temperature-adaptive refresh and partial-array control-requires external thermal management for automotive use Prefer W948D2FBJX5E where industrial temp range, ultra-low DPD current, or dynamic refresh optimization is required.
IS42S16160J-6BLI Standard DDR SDRAM (not LPDDR); 3.3V VDD; no CKE-controlled power modes; CL=3 only; no DQS or differential clock Higher power, no deep sleep states-unsuitable for battery-powered devices; incompatible pinout and protocol W948D2FBJX5E is not interchangeable; choose only if legacy DDR interface and higher voltage tolerance are mandatory.

Compared with MT46H32M16LFCK-6 IT:F and IS42S16160J-6BLI, W948D2FBJX5E uniquely combines LPDDR protocol compliance, industrial temperature support, PASR/ATCSR power optimization, and 60-ball VFBGA packaging-making it the only viable option for next-generation ultra-thin mobile and automotive memory subsystems.

Availability

W948D2FBJX5E is available at Aetrix Electronics and suitable for smartphone application processor memory, tablet GPU frame buffer, automotive infotainment head unit, portable medical imaging display, and industrial HMI systems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for W948D2FBJX5E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and low-power DRAM products for consumer, industrial, and automotive markets.

W948D2FBJX5E belongs to Winbond's Mobile LPDDR SDRAM product line, engineered specifically for battery-constrained portable devices demanding high bandwidth, ultra-low standby power, and robust thermal performance across wide ambient conditions.

FAQ

What is the pin count and package type of W948D2FBJX5E?

W948D2FBJX5E uses a 60-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA) package with 0.5 mm pitch, measuring 5.0 mm × 8.0 mm × 0.6 mm. This matches the LPDDR x16 ball assignment specified in the official datasheet Section 3.1 and is distinct from the 90-ball x32 variant used in W948D6FB.

Does W948D2FBJX5E support CAS latency 2 and 3?

Yes, W948D2FBJX5E supports programmable CAS latency of CL=2 or CL=3 via Mode Register bits A4–A6. CL=2 enables 5 ns tCK operation at 200 MHz, while CL=3 allows relaxed timing margins at lower frequencies such as 166 MHz or 133 MHz-providing flexibility for system-level timing closure.

What power-saving features does W948D2FBJX5E include?

W948D2FBJX5E integrates three key power-saving features: Deep Power Down (DPD) mode (<1 µA IDD), Partial Array Self Refresh (PASR) for selective bank refresh, and Automatic Temperature Compensated Self Refresh (ATCSR) that scales refresh rate with die temperature-collectively reducing average system memory power in mobile and automotive applications.

Is W948D2FBJX5E compatible with standard DDR2 or DDR3 controllers?

No, W948D2FBJX5E is an LPDDR (Low Power DDR) SDRAM and is not electrically or protocol-compatible with DDR2 or DDR3 controllers. It requires an LPDDR-specific memory controller supporting differential CK/CK, bidirectional DQS, and LPDDR command encoding-including CKE-driven power states and extended mode register configuration.

What is the maximum clock frequency supported by W948D2FBJX5E?

W948D2FBJX5E supports up to 200 MHz clock frequency (tCK = 5 ns) when configured for CAS latency 2. This corresponds to a data transfer rate of 400 MT/s per pin. The device also supports 166 MHz (–6 speed grade) and 133 MHz (–75 speed grade) for designs prioritizing timing margin or lower power.

W948D2FBJX5E Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
90-TFBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM - Mobile LPDDR
Memory Size:
256Mbit
Memory Organization:
8M x 32
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
15ns
Access Time:
5 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-25°C ~ 85°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
90-VFBGA (8x13)

W948D2FBJX5E FAQ

1.How can I place an order for W948D2FBJX5E through Aetrix?

Please submit a Request for Quotation (RFQ) for W948D2FBJX5E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W948D2FBJX5E reliable?

The price and inventory of W948D2FBJX5E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W948D2FBJX5E is usually 5 days.

3.What payment methods are accepted for W948D2FBJX5E?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W948D2FBJX5E transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W948D2FBJX5E?

W948D2FBJX5E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W948D2FBJX5E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W948D2FBJX5E?

For technical support, including W948D2FBJX5E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W948D2FBJX5E requirements.

6.How does Aetrix verify that W948D2FBJX5E is sourced from the original manufacturer or authorized distributors?

All W948D2FBJX5E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W948D2FBJX5E meets industry standards.

7.What is the process for return or replacement of W948D2FBJX5E?

All W948D2FBJX5E units undergo pre-shipment inspection (PSI). If there is an issue with W948D2FBJX5E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W948D2FBJX5E part is unused and in its original packaging.

Return procedure for W948D2FBJX5E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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